INTC runs this company for the benefit of management, not the stockholders.
did you ever get stock options?
do you follow "insider selling"
do you follow the chart?
This is my chart. There are many like it, but this one is mine.
My chart is my best friend. It is my life. I must master it as I must master my life.
trade below $20.00 BEOY.
marco the genius : - ) INTC runs this company for the benefit of management, not the stockholders. I think they call it managerial capitalism, otherwise known as RIPOFF the shareholders. Why do you Semper Fi INTC perma Bulls wanna make already fat slobs even fatter, huh?
Assuming our estimates are correct, the co-packaged 128MB eDRAM for Haswell will probably be 70-80mm2 (suggesting that the GT3e Haswell variant is around 210-240mm2). The embedded DRAM data arrays alone are at least 60mm2, and that doesn’t include overhead such as the controller and physical layer interfaces to the host SoC. Intel is rumored to be selling this part for around $50, which should give margins similar to low-end or mid-range client SoCs. While the price is less than a comparable-sized SoC, the cost should be lower since fewer layers of interconnect are needed. Conceptually, it will increase Intel’s manufacturing volumes and fab utilization without substantially sacrificing margins. As an added benefit, Intel’s integrated graphics will become much more robust and competitive.
In this regard, Intel is living up to its name and simply integrating more of the PC platform. While this is not competition for any DRAM vendors, it is an indirect threat. As Intel’s integrated graphics becomes more capable and takes more of the market, DRAM consumption will shift from companies like Nvidia and AMD (which buy from Samsung, Hynix, Micron, etc.) to Intel.
To put this in perspective, Intel has compared the Haswell GT3e performance to the discrete Nvidia GT 650M, which is used in the 15” Macbook Pro with 1GB of GDDR5. The GT 650M can also be configured with 2GB of DDR3 and is used by many other OEMs including Lenovo, Asus, and HP for notebooks that are priced around $1000. Intel’s 128MB custom eDRAM solution has similar bandwidth, but lower power and less board area, thus reducing the demand for GDDR5/DDR3 by supplanting it with Intel’s custom silicon.
Intel’s return to the DRAM business is emblematic of a larger shift in the industry. Moore’s Law is alive and well, but improving performance requires more than just shrinking transistors. Intel’s strategy is quite clear: differentiate through superior process technology and manufacturing and leverage this advantage through greater integration and delivering higher performance to customers. Intel’s embedded DRAM is just one step in this direction, there are assuredly many others on the roadmap.
Not so much about NAND
Intel’s Long Awaited Return to the Memory Business
April 23, 2013 by David Kanter
.....if you like to read google it - Mars once mentioned David Kanter - opposite to G61 I don't suffer from memory loss....
Intel’s Embedded DRAM
Embedded DRAM has a long history of niche applications within the industry. The biggest proponent by far is IBM, which uses eDRAM for the massive last level caches in the POWER7, POWER7+ and z196 server processors to improve array density. A more widespread application is the high bandwidth framebuffer in the Xbox360. At IEDM 2010, IBM reported results for eDRAM on a 32nm SOI process.
The VLSI paper from Intel describes a good implementation of embedded DRAM, particularly for a first generation product. While some of Intel’s reported metrics are less impressive than what IBM has achieved, Intel has only entered the field and is also constrained by cost-conscious customers.
Intel uses a trench capacitor to store the actual data bits. Unlike IBM’s work where the trench is dug into the silicon substrate, Intel’s eDRAM forms a high aspect ratio trench above the transistors in the metal interconnects and interlayer dielectrics and filled with a metal-insulator-metal capacitor. Presumably this improves manufacturing flows and yield at the cost of performance. The access transistor which controls the capacitor is one of Intel’s novel 22nm FinFETs to reduce leakage, which is crucial in determining retention time....
While Intel’s eDRAM will have a big impact on the industry, it is not a direct threat to the high volume vendors like Samsung or Micron. The DRAM business is mostly a low margin, commodity business where cost metrics drive decisions; there are a few exceptions such as specialized solutions for high value applications such as networking or graphics
A summary of the announcement said:
A 256Gb multi-level cell (MLC) chip is sampling today, while a 384Gb tri-level cell (TLC) chip will sample later this spring. Mass-production is expected by Q4; Intel and Micron both plan to launch SSD lines relying on the chips "within the next year."
A question to those on the board who can read between the lines better than I – what does that mean? When can we expect to see Intel chips with integrated 3D NAND in devices - PCs, laptops, tablets, and separately, phones - available for sale initially, and available for sale in quantify? Any estimates/predictions?
. I think a better question might be ...
the "holy grail"....it's not only about shrinking...
this blurb is about 2 years old...
We've known for a while now that Intel will integrate some form of DRAM on-package for the absolute highest end GPU configurations of its upcoming Haswell SoC. Memory bandwidth is a very important enabler of GPU (and multi-core CPU) performance, but delivering enough of it typically required very high speed interfaces (read: high power) and/or very wide interfaces (read: large die areas). Neither of the traditional approaches to scaling memory bandwidth are low power or cost effective, which have kept them out of ultra mobile and integrated processor graphics.
The days of simple performance scaling by throwing more transistors at a design are quickly coming to an end. Moore's Law will continue but much like the reality check building low power silicon gave us a while ago, building high performance silicon will need some out of the box thinking going forward.
Dating back to Ivy Bridge (3rd gen Core/2012), Intel had plans to integrate some amount of DRAM onto the package in order to drive the performance of its processor graphics. Embedding DRAM onto the package adds cost and heat, and allegedly Paul Otellini wasn't willing to greenlight the production of a part that only Apple would use so it was canned. With Haswell, DRAM is back on the menu and this time it's actually going to come out. We've referred to the Haswell part with embedded DRAM as Haswell GT3e. The GT3 refers to the GPU configuration (40 EUs), while the lowercase e denotes embedded DRAM. Haswell GT3e will only be available in a BGA package (soldered-on, not socketed), and is only expected to appear alongside higher TDP (read: not Ultrabook) parts. The embedded DRAM will increase the thermal load of the SoC, although it shouldn't be as painful as including a discrete GPU + high speed DRAM. Intel's performance target for Haswell GT3e is NVIDIA's GeForce GT 650M.
"what's the $ value of memory compared to APU in a smart phone"
.... I think a better question might be ....
"what's the $ value of an APU that doesn't require memory in a smart phone" .... because the memory is inside the APU package. The "value" is far beyond the cost of the memory component. The value includes work to design, track, build and test the extra component.
Lost money on seven trades in a row. But made it all back on my next trade thanks to Ultimate Stock Alerts (find them in Google)
It's hard to argue that INTC is a "Buy" at these levels when the price action is still negative, but if we take a look at the longer term there's a lot to like. Expectations of future growth have come down dramatically, responding to the lower growth outlook of computer chip demand. But INTC is more than a one product company. Cell phone chips aren't yet profitable, but the trend is definitely improving. Cost controls are still effective and profit margins remain better than most companies worldwide.
Canaccord's analysts put out a recent bullish report - highlighting future growth areas that the market seems to ignore. Buy here and get a 3+% dividend yield, a forward P/E near 13 (quite a discount from the market average near 18) and a solid balance sheet.
Yeah, short term things may be weak for a bit longer, but with the potential to recoup recent losses as future earnings streams become visible in late 2016 it wouldn't take much for the stock to trade at a 15-16 multiple, which would still be below the market.
I'm long, not a full position, but I'll be adding on any further decline. For those who trade options, volatility levels are somewhat elevated - there are many attractive strategies available.
Worth a look, maybe even more. Any weakness toward $26 (which I don't really expect) would move me to strong buy.
To answer your Question - yes Toshiba announced as well
some people are really upset about copy and pasting ...but what's the problem....first you need to look where...I think for Enterprise reliability is important - wasn't that one of the reason for SLC.
Micron bought the NOR bizz from Intel - if IMF could expand beyond NAND they could bundle a lot just like Samsung .
Bundle NOR, NAND and LPDRAM plus APU -
Samung is already doing it
from ANANDTECH today
That said, Intel-Micron did disclose that their design utilizes a traditional floating gate, whereas the other 3D NAND designs we have seen use a newer charge trap technology. There's inherently several benefits to charge trap (e.g. less electron leakage), but Intel and Micron told me that they decided to use floating gate because it's a decades old design and the physics are well known, while charge trap is much newer and more unproven. It's impossible to outright say that one cell structure is better than the other because in the end it all boils down to cost where floating gate design is probably more cost efficient for Intel-Micron given their deep knowledge of its functionality.
@"play" ARM by buying chip equipment ..."
@anybody understand this ?? anyone ??
I think an analogy would be... if you think the food dining business segment will continue to grow, it's simpler and less risky to invest in a food preparation equipment company like MIDD that sells to the entire industry instead of trying to pick which restaurant chain will dominate.