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Uni-Pixel, Inc. Message Board

  • red_the_carney_barker red_the_carney_barker Sep 29, 2013 11:48 AM Flag

    Read this, think about it,, and if you know UniBoss technology you will understand..

    we already have the solution to all these "problems" brought up by this author.. the only thing he got right is "Key Processing choices to be made".. they don;t understand UniBoss yet....

    MANUFACTURING: KEY PROCESSING CHOICES ARE STILL TO BE MADE (18 sep '13 publish date)
    We have identified strong technical challenges for the printed & flexible electronics industry to overcome if it is to be successful. Today it is still more technopush rather than market-pull. Printed and flexible electronics are still looking for high throughput, high resolution deposition techniques in order to become suitable for other markets than just a few niche highend applications. For example, a big bottleneck is an efficient barrier technology. Indeed, to be successful, the main technical challenge in the short term lies in finding a good barrier technology: encapsulation materials are not so good on flexible substrates.
    Solution printing process flow is composed of three main steps: ink/coating creation, deposition and curing. Ink chemistry is application dependent, and various precursors can be used for the same application. The nature of the ink / coating will define what kind of process can or cannot be used.
    For example, only inks containing very thin particles can be used for inkjet printing (typically

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    • red_the_carney_barker red_the_carney_barker Sep 29, 2013 11:49 AM Flag

      (typically

      • 1 Reply to red_the_carney_barker
      • red_the_carney_barker red_the_carney_barker Sep 29, 2013 11:50 AM Flag

        In the same way, deposition methods induce specifi c requirements in terms of viscosity. Deposition techniques vary, but most of them are not yet adapted to large volume, low cost printed electronics. Thermal processing is required in order to crystallize the ink. Curing temperature and time are critical factors for printed electronics manufacturing as organic materials are very sensitive to high temperatures.
        For printed and flexible electronics, every application has its own challenges. For example, fl exibility challenges for small screen OLEDs are:
        • Expensive encapsulation with slow manufacturing processes today
        • Low number of material suppliers
        • No high throughput equipment
        • Still high cost etc …

        To achieve printability, there are additional challenges: the need for efficient materials (long lifetime, good printability, good conductivity etc…), need for efficient processes and cost effective manufacturing equipment, for example.

 
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