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  • ex_hacker202 ex_hacker202 • Sep 13, 2011 4:53 PM Flag

    Does this TSRA sub contribute to bottom line?

    Invensas Validates DFD-Based RDIMM Modules With IDT Chips
    Last update: 9/13/2011 7:00:04 AM

    SAN JOSE, Calif., Sep 13, 2011 (BUSINESS WIRE) -- Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (TSRA), has validated high performance DDR3 registered dual inline memory modules (RDIMMs) incorporating its dual face down (DFD) packaging technology with Integrated Device Technology, Inc.'s (IDT(R); NASDAQ: IDTI) advanced registering clock driver chips.

    DFD is a dual die implementation of Invensas' multi-face down (xFD(TM)) packaging technology platform. The xFD technology meets data center server DRAM requirements by delivering a denser, faster, more cost-effective packaging solution without changes to the manufacturing process. In addition, a 20 to 30 percent reduction in thickness and a thermal transfer improvement of 20 to 30 percent deliver a highly optimized platform for a wide range of DRAM memory modules.

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    • jacosa jacosa • Sep 14, 2011 11:21 AM Flag

      Well yeah, in the new organizational structure. Semi packaging is the main business after all.

      I'm kind of curious. This is the second announcement about DFD memory. Last time I looked, there was no white paper about it. The description makes it sound like a way to use innovative packaging techniques within a semiconductor assemblage while making the attachment to the rest of the world more conventional.

      While there seem to be custom devices (even small standard-ish ones) with 20 connections per square mm or so, the (apparently not monolithic) groups that standardize packages don't seem to have gotten beyond 6 (Very Fine ball grid array).

      • 1 Reply to jacosa
      • ex_hacker202 ex_hacker202 • Sep 14, 2011 6:58 PM Flag

        New structure? Wasn't aware they'd done that - or maybe you're not talking about separating/spinning off the Imaging/Optics division?

        As far as the new chips, another one out today, perhaps the 2nd one you mention:

        press release

        Sept. 14, 2011, 7:00 a.m. EDT

        Invensas Validates DFD-Based RDIMM Modules With Montage Chips



        SAN JOSE, Calif., Sep 14, 2011 (BUSINESS WIRE) -- Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. has validated high performance DDR3 registered dual inline memory modules (RDIMMs) incorporating its dual face down (DFD) packaging technology with Montage Technology's advanced register M88SSTE32882-H0 clock driver chip.

        DFD is a dual die implementation of Invensas' multi-face down (xFD(TM)) packaging technology platform. xFD technology meets data center server DRAM requirements by delivering a denser, faster, more cost-effective packaging solution which can be produced using existing manufacturing processes. In addition, a 20 to 30 percent reduction in thickness and a thermal transfer improvement of 20 to 30 percent provides an optimized platform for a range of DRAM memory modules.

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