Sony recently licensed the Ziptronix ZiBond technology for BSI image sensor manufacturing. Several sources, including a Chipworks teardown published by technology blog network Engadget, have subsequently reported that Sony is supplying image sensors for the iPhone 4S.
ZiBondTM direct bonding process enables pixel scaling, increased yield and lower production costs in rapidly growing image sensor markets.
Ziptronix Inc., the leading developer of direct bonding technology for advanced semiconductor applications, announced today that recent collaborations with major image-sensor manufacturers have shown that the Ziptronix ZiBondTM direct bonding process contributes minimum distortion in backside illuminated (BSI) image sensors.
“In addition to confirming that the Ziptronix direct bonding technology delivers the lowest distortion of any process for manufacturing BSI image sensors, these results have tremendous bottom-line significance for image sensor makers,” said Ziptronix CEO Dan Donabedian. “Minimal distortion means pixels can be scaled smaller, and that means increased image sensor resolution, more die per wafer, improved image sensor yields and lower production costs.”
BSI image sensors are rapidly replacing frontside illuminated image sensors for applications such as digital cameras and smartphone cameras due to pixel scaling and other advantages enabled by not illuminating the photodiodes through the CMOS interconnect stack. BSI image sensor manufacturing typically requires bonding a silicon CMOS wafer to a non-CMOS handle wafer. Because this bonding technology does not involve a large coefficient of thermal expansion (CTE) mismatch, it does enable very low distortion which is required for scalable color filter array overlay on the exposed photodiodes after thinning of the bonded CMOS wafer.
Distortion of the wafer introduced during the bonding process can compromise the overlay and limit pixel scaling. ZiBond’s inherent capacity for high bond strength at low temperature effectively minimizes this distortion compared to the competing bond technologies, adhesive and copper thermo-compression. This directly enables submicron pixel scaling; for example, 0.9 micron pixel BSI image sensors have already been fabricated and work on 0.7 micron pixel BSI is underway.
Sony Corp., a leader in image sensor manufacturing, has recently licensed the Ziptronix ZiBond technology for BSI image sensor manufacturing. Several sources, including a Chipworks teardown published by technology blog network Engadget, have subsequently reported that Sony is supplying image sensors for the iPhone 4S.
Of course you are correct Casey. The old rule that I learned in elementary school "I before E except after C; unless as an A like in WEIGH" has failed me countless times over the years. Thanks for pointing that out.
Your sensor knowledge is ok, but this whole eric/tina thing you got going is rather pathetic. Invest some of your short profits on some counseling, what was your life like when OVTI was going from $5 to $37? Must have been some lonely days and nights. Congrats on your victory here, I think you should triple down prior to Tuesday.
You are right. From $5 to $37, you seven bagger your investment. OTOH, if you short from $37 to $5 you make only $32. Even if you repeat, you won't get a seven bagger for shorting. But Eric was so adamant, he stays negative all the way from $5 to $37. He shorted occasionally and made only pennies and he is too ashamed to say it.
Do you think that this might be the reason for Sony image sensors in the iPhone 4S in the US? Outside the US there may not be any patent protection for Ziptronix. That might leave the door open for OVT image sensors which are much less expensive for AAPL.