Mavis Hong, Taipei; Jessie Shen, DIGITIMES [Thursday 27 June 2013]
IC backend service company Advanced Semiconductor Engineering (ASE) has seen its Europe- and US-based fabless clients adopting copper wire to package their products since the beginning of 2013, and enjoyed a substantial rise in copper wirebonding orders, according to company COO Tien Wu.
ASE's revenues generated from copper wirebonding surpassed those from gold wirebonding for the first time in the first quarter of 2013, said Wu.
Another milestone for ASE's copper wirebond business is that the company saw orders placed by its customers in Europe and US contribute more than those of its Asia-based clients in the first quarter of 2013, Wu indicated. This proves that ASE's copper wirebond services are mature enough to ease customer concerns over yield rates and its impact on product quality, Wu said.
ASE is also looking to receive more requests for copper wirebond services from its IDM clients later in 2013, which will help the backend firm generate more revenues from the product line, Wu noted.
Citing company data, Wu disclosed that about 75% of ASE's fabless clients have turned to copper wire, and only 35% of its IDM customers adopt the packaging.
ASE started to develop its copper wirebond services in 2009, and has already built sufficient capacity to meet the expected future growth in demand, Wu said.
Found this today. looks like 2014 will be a good year for KLIC
Soaring fab equipment sales next year.
Semiconductor manufacturing equipment sales will soar 21% to $43.98 billion in 2014 from $36.29 billion this year, says SEMI.
Following two years of conservative capital investments by major chip manufacturers, the new drivers for equipment spending are significant NAND flash fab investments by Samsung in China and Toshiba/Sandisk in Japan, and investments by Intel, including its fabs in Ireland.
Most major regions of the world will see significant equipment spending increases.
Front-end wafer processing equipment will grow 24 percent in 2014 to $35.59 billion, up from $28.70 billion in 2013.
Test equipment and assembly and packaging equipment will also experience growth next year, rising to $3.18 billion (+6 percent) and $2.9 billion (+14 percent), respectively.
“To meet the pent-up demand for capacity, particularly for leading-edge devices, we expect capital spending to increase throughout the remainder of this year and continue through 2014 — to post one of the highest rates of global investment for semiconductor manufacturing ever,” says Danny McGuirk, CEO of SEMI.
Growth is forecasted in China (82 percent), Europe (79 percent), South Korea (31 percent), Japan (32 percent), North America (9 percent), and Taiwan (2 percent). Taiwan will continue to be the world’s largest spender with $10.62 billion estimated for 2014, followed by North America at $8.75 billion and Korea with $8.74 billion.
2014 is expected to be the biggest spending year ever after the $47.7 billion spend in 2000.