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InvenSense, Inc. Message Board

  • cooper2023 cooper2023 Oct 31, 2013 3:01 PM Flag

    InvenSense(TM) Introduces the World's First MotionTracking SoC Optimized for Google's Android KitKat 4.4

    SAN JOSE, Calif., Oct 31, 2013 (BUSINESS WIRE) -- InvenSense, Inc. , the leading provider of MotionTracking(TM)system on chip devices, announced the 6-axis MPU-6515 MEMS SoC and corresponding MotionApps(TM) software platform optimized to support key new functions introduced in Android KitKat. The MPU-6515 incorporates an enhanced version of InvenSense's patented Digital Motion Processor(TM) (DMP) to offload complex motion protocols and algorithms from the Application Processor (AP) as required by Android KitKat for low power inertial location tracking and contextual awareness. At 3x3x0.9mm, the MPU-6515's integrated Gyroscope, Accelerometer and DMP is targeted for next-generation wearables, smartphones and tablets that run the Android 4.4 operating system.

    Android 4.4 defines several new sensor functions including Significant Motion Interrupt, Pedometer, Step Event and Event Batching. The MPU-6515 performs these functions on-chip, only waking the Application Processor when critical motion events require attention from other parts of the system. Beyond significantly lowering power consumption for always-on location and context tracking applications, MPU-6515 reduces system cost and complexity by connecting directly with the Application Processor, thus eliminating the need for additional motion processing ICs within the Android 4.4 operating system.

    "The MPU-6515 MEMS SoC is designed to offload the complex protocol processing and event filtering necessary for the new sensor functions in Android KitKat," said Ali Foughi, Vice President of Marketing and Business Development at InvenSense. "InvenSense is singularly positioned to enable this market with our fully integrated sensor SoC platforms while our competitors must use a separate microcontroller to process the new Android Kit Kat features, increasing OEM system cost, power consumption and overall board footprint."

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