Sat, Aug 23, 2014, 10:40 AM EDT - U.S. Markets closed


% | $
Quotes you view appear here for quick access.

Intel Corporation Message Board

you are viewing a single comment's thread.

view the rest of the posts
  • singhlion2001 singhlion2001 Jan 3, 2013 7:52 PM Flag

    Think Fabrication Doesn't Matter? Think Again...

    Using less powerful light sources, researchers at the Interuniversity Microelectronics Centre (IMEC) here have created about 3,000 wafers using EUV in the past year. But the throughput of the multimillion dollar systems are still 15-30 times too slow for commercial chip makers such as Intel, Samsung and Taiwan Semiconductor Manufacturing Co.

    Researchers have improved the power of light sources 20-fold over the past three years. But they must make similar heroic improvements in the next two years before EUV is ready for production, said Kurt Ronse, IMEC's director advanced lithography program, reporting on the conclusions of an EUV symposium in Brussels. The group also called for development of 500-1,000W EUV light sources by 2016.

    As a result of the EUV delays “the [semiconductor] industry is no longer taking full steps, but implementing half nodes,” Ronse said. “They still call it 14 nm but it’s probably more like 16 or 17 nm,” he said.

    SortNewest  |  Oldest  |  Most Replied Expand all replies
    • "Without EUV, Intel believes it will have to write as many as five immersion patterns on a chip which will take more time and money but is still economical." Hope it is true. But when litho rework rate boomed with strigent process requirements in triple and above patterning, process window and yield are impaced severely. It will be hard to see economic advantages in dimension shrinking. It is happening in current 22/20nm processes(double pattern) and getting worse for 14nm and beyond. That is the reason why Intel/Samsung/TSMC(even nVidia) are urging 450mm progress in parallel to lower down process cost. Tons of hurdles ahead, Go engineers..........Lion roars

      • 1 Reply to singhlion2001
      • LION harsh reality Roars can not be challenged

        Lithography will be a fundamental limiter for all companies. It will many it hard for any single company to have even a 1 generation technology lead.

        Intel can keep hyping but reality at Ground Zero dictates what?

        Lithography is clearly a challenge (and not the only one)and at least it seems that it will need more time.Monolithic 3D with thin layers is an excellent path to continue Moore's Law. There are area that would need engineering such as heat removal and crosstalk but there are no "Red Brick Wall". And as the NAND vendors already adapting monolithic 3D for future scaling, there will be less vendors to support the escalating costs of dimensional scaling for lithography, transistors development etc
        strongest value of integrated circuit is being integrated. Integrated function in one device instead of connecting many devices over PC board represent about an order of magnitude improvement in power performance and cost. An important differentiation to be made is between 3D IC using TSV vs. monolithic 3D. While the cost of devices using TSV is not lower but in fact higher the monolithic 3D IC provide cost reduction

34.94-0.21(-0.60%)Aug 22 4:00 PMEDT

Trending Tickers

Trending Tickers features significant U.S. stocks showing the most dramatic increase in user interest in Yahoo Finance in the previous hour over historic norms. The list is limited to those equities which trade at least 100,000 shares on an average day and have a market cap of more than $300 million.