Access to the latest process technology is key for Apple, said Kanter, principal of Real World Technologies. “The high cost and power consumption of the A5X was undoubtedly one of the reasons why Apple opted to discontinue the iPad 3 a mere seven months" after it was launched, he said.
Apple moved quickly to adopt the so-called Retina display from Samsung in the iPad 3 released in March. However, the graphics processor in the A5X chip Apple used--made in a 45-nm Samsung process using “conventional SiON gate dielectrics”--could not adequately feed the new 2048×1536 display, Kanter said.
Sentiment: Strong Buy
"Access to the latest process technology is key for Apple, said Kanter, principal of Real World Technologies "
It sure is the key, Apple better come up with something or to it's senses
Sentiment: Strong Buy
Fabrication is a function of cost. If your chip's performance is good enough at a lower res node, simple cost benefit analysis clearly indicates that going to the next process node and adding the cost of fabricating finfets etc etc is simply not worth it for most chip applications. For Intel which is the leading light for high performance consumer computing it makes sense to make the huge investments necessary for further extending Moore's law for PCs, but for the average smartphone vendor, paying more for higher performance chips has become a case of diminishing returns. In other words while it maybe worthwhile to invest in more complex fabrication in the PC space specially now when it is expected Intel and Microsoft will completely change the landscape by integrating tablets into the fold, not in the smartphone space. The only reason all these foundries are investing in fab upgrades is because they think Intel might have an advantage with fabrication in the smartphone chip space. Over time they will realize that this is not the case. They're just playing it safe. The csenario that will probably play out for the foundries is that their most popular process node remains at 28nm even though higher res nodes are available.
khitchdee, you #$%$ did you even read the post? It talks about how Apple screwed the pooch by not having a superior node to move to. Just like that node wasn't enough, 28nm isn't going to be enough. Why? Because new functions are constantly being added and without improvements in fabrication the chips get too big to be practical. Apple got a serious lesson in this. What's your problem???
Sentiment: Strong Buy
The only reason all these foundries are investing in fab upgrades is because they think Intel might have an advantage with fabrication in the smartphone chip space. Over time they will realize that this is not the case.
Yeah right - 9 months ago Apple launched a 45nm I Pad and it tanked.
This is one of the stupidest post I ever red...
why don't you check TSMC projected capex dummkopf
ASML ...All players have access to 20nm and 13nm
Intel is just too much hype...........SAMSUNG/TSM all have vested stake in ASML tools
Moore's Law, the engine of semiconductor innovation for decades, is losing steam due to delayed introduction of next-generation extreme ultraviolet lithography. That was the verdict of experts at the 2012 International Symposium on Extreme Ultraviolet Lithography.
EUV systems need light sources that are nearly 20 times more powerful than the ones used today to lay down patterns on next-generation chips that target sizes as small as 14 nm, Following a global symposium on the topic here, a group of lithography experts said that they hope to have the 200W EUV light sources by 2014—but it may take more time.
Finally figured out litho/ASML - yes TSMC and Samsung followed Intel just like two little puppies following Mother Intel - HA
Unfortunately foundries have more problems than IDMs
I can smell a dramatic change in ARM eco system attitude towards manufacturing - it's finally catching up
NO more cheap ARM SoC - only Intel has the critical volume
When asked if the multipatterning issues at 14-nm applied to both integrated device manufacturers (IDMs) and foundries Meurice said: "At 14-nm foundries have a challenge that the IDMs would not have. The challenge is that thay have to deliver design rules which are less restrictive and they have to deliver a shrink that is very aggressive." As such the decision to go to EUV for 14-nm concerns the foundry environment more than the microprocessor environment, Meurice said.
Using less powerful light sources, researchers at the Interuniversity Microelectronics Centre (IMEC) here have created about 3,000 wafers using EUV in the past year. But the throughput of the multimillion dollar systems are still 15-30 times too slow for commercial chip makers such as Intel, Samsung and Taiwan Semiconductor Manufacturing Co.
Researchers have improved the power of light sources 20-fold over the past three years. But they must make similar heroic improvements in the next two years before EUV is ready for production, said Kurt Ronse, IMEC's director advanced lithography program, reporting on the conclusions of an EUV symposium in Brussels. The group also called for development of 500-1,000W EUV light sources by 2016.
As a result of the EUV delays “the [semiconductor] industry is no longer taking full steps, but implementing half nodes,” Ronse said. “They still call it 14 nm but it’s probably more like 16 or 17 nm,” he said.