"The foundries are loaded with money and have two more years to catch up with Intel due to it's mis-step on integrated 4G/LTE. A lot can change in two years."
[There you go khitchykoo - making things up again. The foundries are NOT loaded with the kind of money needed to build new fabs. It's why the number of ARM foundries in the fabrication race has dropped to just two: Samsung and TSMC. I don't make this stuff up. Go look it up. You have internet access, right? By the end of 2013 it will likely be just Intel and Samsung in the race.Not only do you need about $10 billion for a brand new facility, you need billions for R&D as well. And quite a few years.]
"It is rumored that, next month at the Mobile World Congress in Barcelona, Intel will announce the Merrifield processor targeted at smartphones, a shrink to 22 nm with performance improvements similar to the Bay Trail-T. Intel has begun production of its LTE/4G baseband chip according to Intel’s spokesman Jon Carville."
"In mid-2012 Intel doubled down on LTE/4G when it opened a new office in San Diego, Qualcomm’s home territory, with the express intent of recruiting from the area’s deep pool of baseband talent to build a new modem design team for LTE/4G technologies. There are rumors that Intel will be making at least one more LTE/4G investment in 2013. A second source for LTE/4G baseband modems from Intel will be welcomed by smartphone manufacturers as an alternative to Qualcomm’s near monopoly of LTE/4G modems and will relieve supply constraints."
"Delivering LTE/4G to smartphone manufacturers in the first half of 2013 is a critical milestone for Intel."
[Also, let us not forget what Intel will have that Qualcomm won't in two years:]
"At IDF 2012, Intel showed off an experimental SoC codenamed "Rosepoint," targeted at low power mobile consumer devices. Built on the 32 nm process, the tiny chip combines a full-featured dual-core Atom processor with a WiFi transceiver. This could eliminate the need for external transceivers on Atom-powered devices, reducing the platform's board footprint, and of course, power draw."