• Assuming that the midpoint between the Upper and Lower bound cases accurately reflects the history, electricity used by data centers worldwide increased by about 56% from 2005 to 2010 instead of doubling (as it did from 2000 to 2005), while in the US it increased by about 36% instead of doubling.
• Electricity used in global data centers in 2010 likely accounted for between 1.1% and 1.5% of total electricity use, respectively. For the US that number was between 1.7 and 2.2%.
• Electricity used in US data centers in 2010 was significantly lower than predicted by the EPA’s 2007 report to Congress on data centers. That result reflected this study’s reduced electricity growth rates compared to earlier estimates, which were driven mainly by a lower server installed base than was earlier predicted rather than the efficiency improvements anticipated in the report to Congress.
• While Google is a high profile user of computer servers, less than 1% of electricity used by data centers worldwide was attributable to that company’s data center operations.
In summary, the rapid rates of growth in data center electricity use that prevailed from 2000 to 2005 slowed significantly from 2005 to 2010, yielding total electricity use by data centers in 2010 of about 1.3% of all electricity use for the world, and 2% of all electricity use for the US.
AMD 28nm chips are still TSMC
Written by Fuad Abazovic
GlobalFoundries couldn’t make it
Despite a major effort on the part of GlobalFoundries to ramp up its 28nm process and make it more stable and reliable, we are hearing that the company still faces issues.
The issues will hopefully disappear in the future as the Fab 8 in Malta, New York State is doing some test wafers at 20nm and 14nm. However, we were surprised to learn from AMD and people close to the matter that the company is making both of its 28nm Temash and Kabini APUs at TSMC.
They are both expected in Q2 2013, probably around Computex time, or early June 2013. GlobalFoundries is expected to design some 20nm and 14nm for AMD and let’s hope that both AMD and GlobalFoundries will have better luck with 20nm products.
We met several AMD executives at CES and they told us that with 32nm Richland, 28nm Temash and Kabini, things should start to look better for the company. Basically it looks like 2013 will be a much better year for AMD, which is not a surprise as it could hardly do worse than it did in 2012 and this is the general feeling of many AMD executives as well as some major partners.
However, we were surprised to learn from AMD and people close to the matter that the company is making both of its 28nm Temash and Kabini APUs at TSMC.
I don't think GF converted from Gate first to Gate last - TSMC finally "managed" gate last.
The change from gate first to gate last - at least as I understand - is NOT transparent
Here is a surprising piece of info - the so called common platform is a BIG joke - the left ARM does not seem to know what the right ARM is doing
...contrary to the announcements made by the Common Platform group that the 20nm class processes would be gate-last...
IBM surprises with 22nm details at IEDM
By #$%$ James
Monday afternoon at the 2012 IEEE International Electron Devices Meeting, IBM discussed their 22nm SOI high-performance technology , aimed at servers and high-end SoC products. To an extent, this is an extension of the 32nm process, using epitaxial SiGe for the PMOS channels and stress, and dual-stress liners for both NMOS and PMOS strain. However, there were a couple of surprises buried in there -- at least for me!
The first surprise was that this is a gate-first process, contrary to the announcements made by the Common Platform group that the 20nm class processes would be gate-last. The difference seems to be that this technology IS aimed at high performance servers and their support devices, not consumer products, and this is IBM's process for its high-end products, so they are sticking with the proven formula and pushing it to the next level....