A 14nm hybrid FinFet is useless if they can't scale the backend - it's (hybrid finfet) a marketing hype for the dummies
“RC scaling is about k-effective, not the absolute k value of each layer,” said Mandyam Sriram, director of technology for Novellus’ PECVD business unit. “Today the fastest and most advanced devices in the industry use Novellus dielectric films. We offer proven, high volume manufacturing-ready solutions to design-in capacitance reduction, with both an ease of integration and a low cost-of-ownership for our customers.”
Agree, but a blatant plug for LRCX warrants a plug for AMAT technology
The Black Diamond II nano-porous low-k film is the industry standard for the 45/32nm copper/low-k interconnects, with a k-value of approximately 2.5. Its predecessor, Black Diamond (k~3.0), is the industry-standard for the 90/65nm nodes.
The next-generation Black Diamond 3 film extends this industry-leading technology to ultra-low-k (ULK) film (k~2.2) for scaling to 22nm and below and improving device speed.