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Intel Corporation Message Board

  • semi_equip_junkie semi_equip_junkie Feb 15, 2013 9:20 PM Flag

    Semiconductor guy - have fun at tech conference

    in SF. Free lunch ? Don't party too hard and perhaps someone can explain to you the difference between front end (transistor engineering) and back end (interconnects).
    BTW do you know a guy by the name of Handel Jones.
    He claims planar 20nm FDSOI (as proposed by STM) is 50 to 60% less expensive to 14/16nm FinFet ...are Samsung and Glofo betting on the wrong horse?
    Also did they make up their minds about gate first or gate last?
    I get the impression there's quite a bit of disarray in the ARM camp as we speak

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    • semiconductorguy Feb 16, 2013 5:26 AM Flag

      I saw Handel at Common Platform last week. No comment on FDSOI. TSMC owns 28nm. 20nm is not going to be a big node but TSMC should do okay with Apple. Samsung is my bet on 14nm. Samsung is Intel's biggest threat on all fronts. Samsung is gunning for Intel.

      Why do you say that about ARM? Where is they disarray? Intel's CEO was forced out without a replacement. That is what I call disarray.

      • 2 Replies to semiconductorguy
      • "Samsung is my bet on 14nm"
        It's 14nm transistor technology on a 20nm die - performance improvement will be offset by cost
        "Samsung is Intel's biggest threat on all fronts."
        Samsung is an even bigger threat to the fabless ARM players and ARM foundries.
        Consolidation within ARM is already taking place
        "Samsung is gunning for Intel"
        Server will be one of the growth drivers and so will be LPDRAM - server memory is extremely lucrative for Samsung and both Intel and Samsung work closely together on setting up specs.
        Besides Samsung has to prioritize:
        they face stiff competition from SNDK/Toshiba and Micron - both LPDRAM and NAND are growing

        "Intel's CEO was forced out without a replacement "
        Why would they force him out without replacement - it does not make sense.
        Besides that's your opinion - my opinion is that he laid all the seeds (somewhat late) to turn Intel around.
        Glofo, Samsung and TSMC are racing to catch up with Intel manufacturing and process technology.To me it confirms that manufacturing capabilities and process technology have become a most valuable asset.
        Intel is making steady progress in closing the performance gap while leveraging its manufacturing capabilities.

        Once again ARMs 14 nm Finfet is transistor technology on 20nm die - I think people are so afixiated on FinFet and they oversee to shrink the backend (interconnect) as well

      • Intel's CEO was forced out without a replacement. That is what I call disarray

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