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Intel Corporation Message Board

  • semi_equip_junkie semi_equip_junkie Apr 17, 2013 2:38 PM Flag

    Intel is widening the gap

    Tape out versus the real world - there is nothing better than running megatons of wafers when it comes to learning

    IRPS 2013: Self-heating to accelerate aging in FinFETs
    “In finFETs, because it’s a three-dimensional structure, this self-heating is a bottleneck in scaling down,” said Giuseppe Larosa, Technical Program Chair of the IRPS. “Self-heating become a key important issue. The International Reliability Physics Symposium (IRPS) is being held April 14-18, 2013 at the Hyatt Regency Monterey Resort & Spa in Monterey, CA.

    At IRPS, Intel will present new research in a paper titled “Self-heat Reliability Considerations on Intel’s 22nm Tri-Gate Technology.” This work elaborates on various measurements to observe self-heating as well as the associated reliability implications, not only in the transistors, but the overlying metal lines. “The self-heating of the finFET can locally increase the temperature in the metal wires above, enhancing electromigration effects,” Larosa said.

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