Intel GT3e Expected To Capture Lead In Integrated Graphics
Ashraf Eassa is saying in his Seeking Alpha article that he expects Intel's Haswell graphic (GT3e) to capture the integrated graphics crown from AMD at the highest end, while delivering significant competition to the AMD's and Nvidia's discrete graphics. Also good writeup on the subject in Anandtech.
This past fall [see IFTLE 123: Intel's Bohr on3DIC] IFTLE reported rumors that Intel would be using TSV stacked DDR4 memory in their Haswell-EX platform for enterprise computing.
Haswell is the codename for the successor to Ivy Bridge architecture. Intel is expected to release 22nm CPUs based on Haswell around June 2013 according to leaked roadmaps. Current rumors have it that the Haswell GT3 will be the introduction point for 2.5D stacking and interposers. Semiaccurate [link] reports that Intel codename "Crystalwell" is not L4 cache on package but rather is GPU memory on an interposer. They indicate that the GT3 variants of Haswell will have 64MB of on-package memory connected through an ultra-wide bus.
Reports were that Haswell needed lower memory power consumption, higher memory bandwidth, and memory capacity that DDR3 could not provide but wide IO TSV based memory stacks could. Based on recent reports from the Semi 3D summit where ST Ericsson’s Kimmich concluded that "although 3D TSV technology appears ready for mass production, wide IO technology is not yet a fit for mainstream smartphones. LPDDR3 and LPDDR4 will be used in this application due to better thermal performance and lower cost." [see IFTLE 134 “SEMI 3D European Summit – Isthe Wide IO Driver Dead ?”]
IFTLE must ask whether these Haswell "requirements" can be met with the newly described LPDDR3 and LPDDR4 solutions, which do not use TSV technology.