according to a recent presentation, so you are correct.
Of course I am correct
October 2012 is NOT recently - the market is SLOW,SLOW, SLOW
SA is s SLOW SLOW, SLOW.
you are SLOW, SLOW, SLOW
October 2012 - ashraf you better get on that 14nm Intel/ 14/16nm ARM die size projections
Functional scaling itself will be limited to some extent by the 20-LPM metal density, but presumably some die shrink can be achieved by using more metal layers, and also the increased current density will allow some compaction since higher-current transistors will be smaller. Keeping single patterning will mitigate the cost, compared with double patterning for denser layers.