Intel Construction of 450mm Fab started January 2013
The Intel fab -- known as D1X module 2 -- is intended to be a development fab for production of ICs on 450mm diameter wafers. However, the breaking of ground for the wafer fab was not widely reported at the time it occurred.
[This approach of build first, talk later is the opposite of TSMC...]
[These are the resources that Intel is putting in place. Resources that guarantee that Intel will own the future. And there is nothing that ARM can do about it. Not on FinFET and not on 450mm wafers. Intel is just too far out in front on both of them. ARM doesn't have the time or money to even keep Intel's advantage from expanding. And this is why Intel's future is secure. It may not be flashy and it may not be fast. But it will give Intel control of the processor business sooner than most think...]
TSMC Raises The Semiconductor Bar With 450mm!
TSMC first 450-millimeter pilot line is planned at Fab12 Phase VI, starting with 16-nanometer technology. The timing of pilot line will be in 2014. TSMC first 450-millimeter production line is planned in 2015