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Intel Corporation Message Board

  • wallisweaver wallisweaver Aug 15, 2013 5:00 PM Flag

    Intel Construction of 450mm Fab started January 2013

    The Intel fab -- known as D1X module 2 -- is intended to be a development fab for production of ICs on 450mm diameter wafers. However, the breaking of ground for the wafer fab was not widely reported at the time it occurred.

    From nextbigfuture

    [This approach of build first, talk later is the opposite of TSMC...]

    [These are the resources that Intel is putting in place. Resources that guarantee that Intel will own the future. And there is nothing that ARM can do about it. Not on FinFET and not on 450mm wafers. Intel is just too far out in front on both of them. ARM doesn't have the time or money to even keep Intel's advantage from expanding. And this is why Intel's future is secure. It may not be flashy and it may not be fast. But it will give Intel control of the processor business sooner than most think...]

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