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Intel Corporation Message Board

  • wallisweaver wallisweaver Aug 28, 2013 6:08 PM Flag

    450mm Wafer Dynamics

    "Long-term, 450mm wafer production is going to ramp across the entire industry; GlobalFoundries believes the capability will approach 50 per cent of the semiconductor market by 2028. That’s only slightly slower than the 300mm ramp, which Intel pioneered in 2000 with the P4, and hit the 50 per cent mark around 2009.

    Even today, a substantial amount of manufacturing is done on sub-300mm wafers, and that will continue to be the case for more than a decade once the 450mm ramp starts – it costs too much to retrofit a fab for TSMC, UMC, or Samsung to do so all at once.

    For Intel, the cost savings of building out 450mm could be as significant as the cost savings of being more than a process generation ahead of the overall market."

    Excerpt above from itproportal

    [Moving to 14nm FinFET and 450mm wafers first offers Intel the ability to move the equivalent of THREE process generations ahead of ARM in terms of economics and technology.]

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    • "Long-term, 450mm wafer production is going to ramp across the entire industry; GlobalFoundries believes the capability will approach 50 per cent of the semiconductor market by 2028. That’s only slightly slower than the 300mm ramp, which Intel pioneered in 2000 with the P4, and hit the 50 per cent mark around 2009.

      Even today, a substantial amount of manufacturing is done on sub-300mm wafers, and that will continue to be the case for more than a decade once the 450mm ramp starts – it costs too much to retrofit a fab for TSMC, UMC, or Samsung to do so all at once.

      For Intel, the cost savings of building out 450mm could be as significant as the cost savings of being more than a process generation ahead of the overall market."

      Excerpt above from itproportal

      [Moving to 14nm FinFET and 450mm wafers first offers Intel the ability to move the equivalent of THREE process generations ahead of ARM in terms of economics and technology.]

    • dnenni@ymail.com dnenni Sep 28, 2013 8:46 AM Flag

      At the US Semiconductor Executive Forum last week CEOs of Altera, Microm, Marvell, and Samsung were asked when 450mm will be available. EUV is not there today and may not come at all. They ALL expressed doubt that it will come at all much less in the next 5 years. Altera uses Intel at 14nm. The Altera CEO said "maybe 7nm" but certainly not 14nm or 10nm.

      This is contrary to what I heard at SemiCon West from the equipment manufacturers but much more believable.

    • Intel can have the highest hi-tech manufacturing as they want - but they need a market to sell their 'stuff'. Having the best plants producing things people aren't buying is risky. I'm long but they will need SIGNIFICANT advantage to move the needle in mobile over ARM. Remember, it's not always the best tech that wins. It's sometimes the 'good enough'.

    • I am an Intel long but must correct you. There is now way in hell Intel will be ready with 450mm for 14nm. All 3 fabs that Intel is transferring this node to are 300mm (Ireland, Oregon,Arizona). Indeed they won't even be ready for HVM 450mm at 10nm, This will again be brought up in 300mm fabs.
      Now there could be a chance that the first 450mm HVM fab is pipe cleaned on 10nm after it matures and is stable in 300mm but by then you are talking 2017. My guess is the first HVM use for 450 wafers is at the 7nm node.

    • 450 mm is long shot but it's coming - one of rge reasons making Intel a long term pick and hold
      (the capability will approach 50 per cent of the semiconductor market by 2028)

 
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