The manufacturing advantage is going back and forth between GlobalFoundries, TSMC and Intel. Intel lead the market with 45nm, then TSMC launched 40nm. Intel came back with 32nm, then TSMC and GlobalFoundries both started shipping 28nm semiconductors. In April, Intel launched the 22nm process (after several months of delays, untypical for the 800 pound manufacturing gorilla), and that lead will be continued onto 2013, when 20nm process from GlobalFoundries will take the lead, before all three foundry groups meet at 14nm.
With the 20nm node, GlobalFoundries worked hard with its partners inside the Common Platform Alliance (IBM and Samsung) to make the node as SoC-friendly as possible, yet keeping the same performance characteristics that enabled very high clocking of the 32nm and 28nm parts.