The partnership focuses on innovation speed and time to market in eight select automotive electronics application segments ranging from long-established core leadership positions of NXP's automotive business, such as in-vehicle networking and car entertainment, to emerging technologies for the connected car. This includes Car-to-X communications, telematics, Near Field Communications (NFC), and high-voltage controls for electrical vehicles.
"The partnership is another milestone in our Progressive Semiconductor Program (PSCP) and underscores the mutual trust that both corporations have built over many years," said Ricky Hudi, Chief Executive Engineer Electrics/Electronics, Audi. "In addition, NXP's strategy to provide the electronic interfaces for the connected car is smart and gives clear indications for Audi's future plans."
Experts estimate that 90 percent of all innovation in automotive is enabled by electronics, with semiconductors playing a key role, while the increasing level of connectivity to the outside world requires a strong background in adjacent businesses and technologies, such as NFC, wireless reception, radar, and telematics. Audi and NXP's collaboration acknowledges the importance of semiconductors in introducing these and other new functions to the car, with a focus on achieving new levels of driving safety and comfort, saving costs, and improving energy efficiency.
"It's a real honor to serve as a strategic innovation partner to Audi in the premium car market, and is a testament to the industry recognizing NXP's excellent customer support, commitment to deliver top quality solutions, and above all our innovation power," said Kurt Sievers, general manager, automotive business, NXP. "Our strong collaboration with Audi reinforces that NXP's focus on technologies for the connected car is spot on with where the industry is going."
NXP and Audi's partnership is part of Audi's Progressive Semiconductor Program (PSCP), the comprehensive semiconductor strategy aimed at intensifying the role and engagement of semiconductor companies in the processes of the German car manufacturer. It is entitled "Role Model of Innovation & Speed" and was signed in May 2012 by Ricky Hudi of Audi and Kurt Sievers of NXP.