Intel will be in the market with its 22nm chips towards the end of this year whereas, if all goes according to plan, Apple's A7 produced on TSMC's 20nm planar process will be out mid-2014. Seems like they're about even on low power mobile targeted SoCs for now. Intel is planning jump ahead by bringing out 14nm at an accelerated schedule of end of 2014. But so is TSMC with their 16nm FinFET process in mid 2015. Since Intel is the one trying to catch up in the market, this doesn't look bad for ARM at all. We're just beginning to feel the effects of the added money that has been pumped into the foundry fabrication business due to the massive adoption of mobile technology in the market.
But so is TSMC with their 16nm FinFET process in mid 2015. Since Intel is the one trying to catch up in the market, this doesn't look bad for ARM at all.
In 2015 Intel will have processed several millions of TriGate wafers....wink,wink
their 16nm FinFET process ,,,,it's 20nm design rules ...wink, wink
I am amazed by ignorance and lack of knowledge by the ARM fans
"We're just beginning to feel the effects of the added money that has been pumped into the foundry fabrication business due to the massive adoption of mobile technology in the market."
For sure you got that right - but not the way you think.
TSMC reiterates plans for 18-inch wafer manufacturing
Josephine Lien, Taipei; Jessie Shen, DIGITIMES [Friday 10 May 2013]
Taiwan Semiconductor Manufacturing Company (TSMC) has reiterated plans to build its first 450mm (18-inch) pilot production lines, which will offer FinFET transistor technology at 10nm and 7nm nodes, in 2016-17.
TSMC also hopes to adopt extreme ultraviolet (EUV) lithography to make 10nm chips, with equipment move-in slated for the end of 2017.
JK Wang, VP of operations for 300mm fabs for TSMC, indicated that equipment suppliers were previously hesitant about pouring cash into fab tools for 18-inch wafer manufacturing. However, the industry is now aware of the upcoming transition to 18-inch wafers, Wang said.
Every major equipment maker has allocated about 15% of their R&D capex to develop manufacturing equipment for 18-inch wafer production, Wang observed.
TSMC is looking to finish installing most of its required equipment for 18-inch wafer manufacturing by the end of fourth-quarter 2015, and expects to construct its first 18-inch pilot lines between 2016 and 2017, Wang disclosed. In addition, installation of EUV equipment as well as 193nm wavelength immersion scanners is set to complete by the end of 2017, Wang said.
TSMC's 18-inch facilities will enter 10nm and 7nm process generations , Wang noted.
In addition, Wang revealed that TSMC will expand its 28nm foundry capacity to a monthly level of 100,000 12-inch wafers at the end of 2013. The foundry is also gearing up for 20nm chip production in 2014, Wang added.