Nanya Technology unveils 8Gb QDP DDR3 based on TSV 3D IC technology Josephine Lien, Taipei; Adam Hwang, DIGITIMES [Thursday 19 July 2012] Nanya Technology debuted prototype 8Gb QDP (quad-die package) DDR3 based on in-house-developed via-middle TSV (through silicon via) 3D IC technology at a July 18 investors conference.
The 8Gb QDP DDR3 involves stacking four 2Gb DDR3 dies in four layers, Nanya explained. Nanya plans to start volume production of TSV-based QDP DRAM mainly for use in mobile or high-speed computing devices in 2013 or 2014.
In addition, Nanya has been cooperating with Micron Technology to develop 30nm 4Gb DDR4 and will have samples of low-power DDR4 RDIMM and LRDIMM in certification in the third quarter of 2012, specifically for use in high-end servers. Production is scheduled to kick off in 2013.
Nanya recorded revenues of NT$10.102 billion (US$344 million), gross margin of negative 31.08%, net operating loss of NT$5.280 billion, net loss of NT$6.692 billion and net loss per share of NT$0.45 for the second quarter.
Nanya has begun shipments of server DRAM to data center clients in North America, Europe and China and 8Gb low-power DDR2 to tablet PC vendors. The company is ready to supply 4Gb low-power reduced-standby DDR3 ultrabook vendors.
Nanya expects mild sequential growth in demand for PC-use DRAM and a 50% on-quarter increase in demand for low-power DRAM used in smartphones and tablet PCs in the third quarter of 2012. The company also expects DRAM contract prices to slightly rise or remain unchanged sequentially in the third quarter. http://www.digitimes.com/news/a20120718PD220.html
*Cymer does NOT make ASPs! Cymer makes units/bits/layers!!! Those three going bonkers!!!