The following answer is in line with ASML indicating TSMC adding significant 28nm capacity in 2013.
TSMC 20nm will be planar and as far as I understand does not use SOI.
Intel's 22nm SoC will roll out end 2013 and 14nm manufacturing will commence in 2013- no reason to get impatient
My second question is, could you give any update on your (inaudible)? Do you expect a broad-base adoption for your (inaudible) in 20-nanomter platform?
Yes, will be used with the 20-nanometer part. In fact, it’s already being used toward the 28-nanometer part. But the revenue is still relatively small. And as I said, technically, it’s progressing fine. We’re trying to reduce the costs more. The revenue, well, there will not be significant revenue until 2015, 2016.
You might want to glance over the transcript - the timelines/milestones set by TSMC management are (IMHO) all over the place and somewhat lack consistency.
I don't think TSMC met its advanced revenue contribution % objective given by beginning of the year :
The contribution to total wafer revenue has increased from 7% in the second quarter to 13% in the third quarter. We expect 28-nanometer revenue will exceed 20% of our total wafer revenue in the fourth quarter and will be more than 10% for the whole year.
That would roughly correspond to $1.7 Billion
Capex on the other hand (and most goes into advanced technology):
Regarding capital expenditure for this year, up to the third quarter, we have spent $6.2 billion, representing 75% of our total year budget. I have finished my report on our financial highlights.
Put this in perspective to Intel - nevertheless Dumbstreet assigns significantly higher PE to TSMC - but than again Dumbstreet does not mess with TSMC stock