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  • singhlion2001 singhlion2001 Apr 7, 2013 8:01 PM Flag

    Samsung tops leading-edge chip-making capacity

    Samsung tops leading-edge chip-making capacity
    Peter Clarke

    4/5/2013 6:01 AM EDT

    LONDON – More than 25 percent of installed wafer capacity worldwide is tailored for the production ICs with feature sizes below 40nm, according to market research firm IC Insights. At the same time nearly 25 percent is dedicated to production at 0.2-micron or greater geometries.

    The global wafer fab capacity across all manufacturers and geometries in 200-mm wafer equivalents was 14.5 million wafers per month (see figure 1).

    The market research firm has ranked manufacturing companies by their installed capacity in four categories. At the leading edge (below 40nm) Samsung leads followed by Intel, Toshiba/SanDisk, SK Hynix and Micron (see figure 2). The ranking reflects the significance of memory to production volumes, but not necessarily revenues.

    IC Insights has divided global installed capacity, as of the end of 2012, into six categories based on the minimum geometry of the processes used in wafer fabrication. About 27 percent of global wafer capacity was for devices having geometries smaller than 40nm (see figure 1). Such devices include high-density DRAM, which are typically built using 30nm- to 20nm-class process technologies; high-density flash memory devices that are based on 20nm- to 10nm-class processes; and high-performance microprocessors and advanced ASIC/ASSP/FPGA devices based on 32/28nm or 22nm technologies.

    About 22 percent of global capacity is dedicated to "maure" process nodes at 90nm, 0.13-micron, and 0.18-micron. A variety of processes base on these nodes are offered by foundries including TSMC, UMC, GlobalFoundries, SMIC, and TowerJazz.

    Although the leading-edge of chip manufacturing has, up until now, been moving in line with Moore's law the business has a long tail and large quantities of standard analog and general-purpose logic are manufactured with well-established process technologies having larger than 0.4-micron feature sizes. In addition, high-voltage power semiconductors require large-geometry process technologies.

    Click on image to enlarge.

    Figure 1: Worldwide chip manufacturing capacity by geometry as of December 2012. (Installed monthly capacity in 200-mm equivalent wafers.) Source: IC Insights.

    Click on image to enlarge.

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