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Intel Corporation Message Board

  • semi_equip_junkie semi_equip_junkie Apr 19, 2013 11:45 PM Flag

    Intel will squash ARM server attempts

    Intel to use DDR4 with TSV starting in 2014?

    Despite these comments, IFTLE would be remiss if we didn't point out that rumors continue to swirl that Intel will use 3D stacked DDR4 memory in their Haswell-EX platform for enterprise computing [link ].

    Since Haswell will feature microprocessors with 12-14 cores, it will benefit from lower memory power consumption, higher memory bandwidth, and the memory capacity that DDR3 simply cannot provide. DRAM makers will make high-capacity DDR4 chips using through-silicon-via (TSV) technology that will allow to increase capacity of memory chips at a very fast rate. For servers, special switches will be introduced to avoid one module/one channel limitation.

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