Hynix to Expand Its NAND Output By IN-SOO NAM December 6, 2007; Page B4
SEOUL, South Korea -- Hynix Semiconductor Inc. will begin mass producing high-density NAND flash memory chips in January in an effort to pull ahead in the race for ever-smaller chips.
Hynix will start making 16-gigabit NAND flash memory chips using leading 48-nanometer process technology at its plants in Icheon and Cheongju, a company spokeswoman said.
"We'll soon send samples to our clients world-wide," said Seong-ae Park. "We aim to overtake bigger rivals by adopting advanced technology in actual production ahead of them."
She added that Hynix, the third-largest NAND-chip maker by volume, also plans to introduce the more advanced 41-nanometer technology to produce 32-gigabit NAND chips in next year's fourth quarter.
Demand for flash memory chips, which save data in electronic devices even when the power is off, has been driven by the popularity of portable items such as music players and digital cameras.
As finer processing technology allows more data to be crammed into smaller spaces at lower cost, flash memory has become suitable for larger, more profitable devices such as laptops and camcorders, making the race for higher-density chips even more competitive.
Ms. Park said the migration to the advanced-process technology will help Hynix cut costs and boost the profit margin in its memory business from the current 12%.