% | $
Quotes you view appear here for quick access.

Rambus Inc. Message Board

  • exgeae exgeae Jul 24, 2012 10:35 AM Flag

    Beyond DDR3: Advancing the Main Memory Roadmap

    Rambus is not dead yet. They are not one trick pony.

    Demand for an enriched end-user experience and increased performance in next-generation mainstream computing applications is unremitting. Driven by multi-core computing, virtualization and processor integration trends, the industry needs a next-generation main memory solution capable of achieving data rates of up to 3200Mbps in the same, or lower power envelope as the current DDR3 1600MHz memory solution. The divergence of these two requirements, increasing performance while lowering power, presents a difficult challenge for future memory system designers.

    In addition, next-generation memory solutions face potential bottlenecks in access efficiency and capacity, both of which have fallen as date rates increased. Memory module upgrades are the most common way to increase capacity in a system. The number of modules supported on a DDR3 memory channel drops at high data rates due to degraded signal integrity. This problem is so severe that by 1333MHz, most DDR3 memory channels can support only a single module. This makes a DDR3 memory system inadequate for most server, workstation and high-end PCs. Memory access granularity also suffers as data rates increase due to the disparity between the interface and core access speeds. The result is an increase to the core prefetch and a sub-optimal transfer size for future multi-core and graphics computing applications.

    SortNewest  |  Oldest  |  Most Replied Expand all replies
    • Rambus innovations such as Module Threading can provide the performance needed in memory systems beyond DDR3

      In order to address these challenges, Rambus has announced a set of innovations focused on advancing single-ended signaling technologies to meet the memory system requirements of next-generation computing applications. Rambus' solution builds upon existing innovations and designs, such as FlexPhase™ circuitry, FlexClocking™ and Dynamic Point-to-Point technologies, and newly introduced innovations for Near Ground Signaling and Module Threading. When used in combination, these innovations, available for licensing, can enable future main memory systems to achieve double the data rates, 50% higher memory access efficiency, and 40% lower power consumption when compared to current DDR3 solutions.

11.99+0.37(+3.18%)Oct 24 4:00 PMEDT