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Pepsico, Inc. Message Board

jackgotney 8 posts  |  Last Activity: Jul 20, 2016 9:53 AM Member since: Nov 19, 2009
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  • Reply to

    2Q Sales & Marketing

    by luke_sky_walk_er Jul 12, 2016 10:43 AM
    jackgotney jackgotney Jul 20, 2016 9:53 AM Flag

    This link wasn't coming up but now it is. I don't like the new 'conversations' board because there is no rhyme or reason to where Yahoo inserts your messages. Most recent messages should automatically go to the top. Any Sophia check out the latest News from Monday. Naarmaan has decided to be our first European customer branding their products with out tap and co-marketing the products globally. They are converting over their filler machines to insert our tap instead of their old taps. They are a big global Dairy distributor headquartered in Europe. I hope this can bring us to break even - no more dilution!

  • Reply to


    by luke_sky_walk_er Jul 1, 2016 11:30 AM
    jackgotney jackgotney Jul 8, 2016 1:51 PM Flag

    Just to be fair, you should say that today we're 7.4 cents closer to infinity and unbounded wealth. Buy buy buy.

    United States Patent Application 20160197227
    Kind Code A1
    Forrest; Stephen R. ; et al. July 7, 2016
    The present disclosure generally relates to thin film liftoff processes for use in making devices such as electronic and optoelectronic devices, e.g., photovoltaic devices. The methods described herein use a combination of epitaxial liftoff and spalling techniques to quickly and precisely control the separation of an epilayer from a growth substrate. Provided herein are growth structures having a sacrificial layer positioned between a growth substrate and a sacrificial layer. Exemplary methods of the present disclosure include forming at least one notch in the sacrificial layer and spalling the growth structure by crack propagation at the at least one notch to separate the epilayer from the growth substrate.
    [0019] ...Epitaxial liftoff ... can be a slow process .. taking hours or ... days to complete... there is a need to introduce new thin film liftoff methods that are fast and precisely controlled.
    [0020] The present disclosure addresses this need by combining epitaxial liftoff with spalling. Spalling is a fast liftoff process that uses crack propagation assisted by a stressed layer. The stressed layer induces a stress in a substrate, and the induced stress guides a crack in a direction parallel to the interface between the substrate and a thin film layer. Spalling alone, however, suffers from disadvantages such as the inability to precisely control the cracking interface. For example, deviation at the cracking position during spalling can be on the order of a micron. The inventive methods of the present disclosure combine epitaxial liftoff and spalling techniques for fast and precisely controlled thin film liftoff processes, whereby crack propagation is controlled at the sacrificial layer, resulting in a controlled cracking interface.

  • Reply to


    by luke_sky_walk_er Jul 1, 2016 11:30 AM
    jackgotney jackgotney Jul 7, 2016 10:52 AM Flag

    Everyone worries about China. They are the rip off capital of the world with no respect for patents. That culture stems from the that China always considered patents to be public property and government owned. This is contrary to international practices and is changing. So the free for all, your invention is my invention, attitude is changing. But traditions and attitudes are hard to break and copycatting continues like a flood after the rain. I get the feeling if Pepsico wants us to manufacture for them, it is unlikely there will be copycatters popping up. We are establishing relationships with the big companies over there. So there could be knock offs in the future but it shouldn't impact anything that we develop on a large scale with the large distributors.

  • jackgotney jackgotney Jul 7, 2016 9:30 AM Flag

    I agree. Also as an FYI - they are well aware and are giving that most of their focus.

  • Reply to


    by luke_sky_walk_er Jul 1, 2016 11:30 AM
    jackgotney jackgotney Jul 6, 2016 3:35 PM Flag

    IDND doesn't seem to have an extensive patent portfolio with only a handful of patents as far as I could see. I think once we start getting ahead financially we should prbably try to tighten up our IP and maybe expand it through directed contracted R&D. Until then we have some barrier to entry advantage which is our proprietary expertise & experience, including our executive network connections, highly refined, unique, and difficult to copy, product, and a number of other related offerings. The current offering gives us an advantage in marketing which even we didn't have 3 or 5 years ago. Pepsico who at first had the notion of doing it all themselves, decided to let IDND handle the manufacturing end because (at least I seem to remember from the report) it was more difficult than they'd anticipated. That said we are still waiting for those orders from Pepsico aren't we. Didn't we anticipate that we'd have orders flowing in by the end of last year? Anyway isn't Dohler sending them samples at least? I hope they like what they see, the advantages it will bring to the table for them.

  • Reply to


    by luke_sky_walk_er Jul 1, 2016 11:30 AM
    jackgotney jackgotney Jul 5, 2016 4:33 PM Flag

    I agree it is speculation but not totally baseless. We are currently priced at .40 to .50 based on being nearly but not quite breakeven and for being a pink sheet stock. We need another customer and some positive earnings to go with it to get over $1.00. If we did that we'd not only be at a higher price but we be more liquid there. I think we can do it. We have seen some positive changes since Tom Shaver has taken his position as CEO. I have a more positive outlook than Sophia in that even though I am disappointed in the operating numbers, the bottom line is we need another big customer, and I think we are better positioned to do that than ever before. More than one ould be like cake icing as our revenues and margins would improve the more we sell. Keeping my fingers crossed and not giving up. We have a new, well connected and experienced, CEO with relevant strengths. I like the steps we've taken since 2013 and it should not be long before we are rolling finally. If you just look at the bottom line it doesn't look like this company is going anywhere. But I believe that should be changing within the next year, and I believe it will be worth the wait. I have been in since 2011 and have a lower average price of .33 but others have waited longer and are undestandably frustrated but the past can both help and also cloud the perception of the present so we have to be careful to crack through to reality, good or bad. I see some negatives but all in all I see nothing to stop them now from locking in a few more customers in the next 12 months to 18 months and that should translate to a better bottom line and stock price. So speculation? yes. My 2 cents.

  • United States Patent 9,385,348
    Forrest , et al. July 5, 2016

    Organic electronic devices with multiple solution-processed layers


    A method for fabricating an organic light emitting device stack involves depositing a first conductive electrode layer over a substrate; depositing a first set of one or more organic layers, wherein at least one of the first set of organic layers is a first emissive layer and one of the first set of organic layers is deposited by a solution-based process that utilizes a first solvent; depositing a first conductive interlayer by a dry deposition process; and depositing a second set of one or more organic layers, wherein at least one of the second set of organic layers is a second emissive layer and one of the second set of organic layers is deposited by a solution-based process that utilizes a second solvent, wherein all layers that precede the layer deposited using the second solvent are insoluble in the second solvent.

    In organic electronic devices such as organic photovoltaics (OPVs) ..(etc.) it is common to utilize multi-layer structures. While this is typically a simple process for vacuum-processed films, problems arise for solution-processed films. When multi-layer structures are fabricated from solution-processed films, the underlying layers can be re-dissolved, as orthogonal solvents are uncommon.
    While this is typically a simple process for vacuum-processed films, problems arise for solution-processed films.

    Here, the inventors present a method of decreasing the re-dissolution of underlying organic layers by incorporating solvent vapor annealing (SVA). The inventors have devised a compound protection layer scheme to allow solution processing of multi-layer organic film structures. The process scheme is useful where orthogonal solvents are not available. The process scheme can be useful for such technologies as fabrication of OPVs and OLEDs as examples.

107.05-0.44(-0.41%)12:45 PMEDT