and that's GREAT .. i don't companies whose mgmt doesn't give the facts ....
BTW Billy , what other companies are successful selling OLED microdisplays ??? hmmmmmm
jimmye , ice is no problem , we got enough to last 'til June ..
just hope we don't catch any crabs ... g
this whole thing seems to be hazy ... the original statement from the company stated that 80% of the
unit will be distributed to shareholders in 2015 , with the disclaimer that it could still be a sale .. ok ..
that being said , i read about the 80% being a swap !
which is it ??? a true dist. to shareholders ?? or just allowing us to swap GE for the new company in
some ratio , that at best will be around a 10% discount to closing price on some day ...i don't consider
and manner of a swap to be a distribution ... garce
i think that he was referring to those outsized volumes last week ... today is pretty much at the avg ..
yes , it looks like the activity , buy or sell , around the VOD deal is behind us , but i don't expect
all the dust to settle for another quarter ... g
interesting Don , i had not seen the bonding patent ... just read it ...
more worms in the can now ..
1) the fails could have been from the old process and the new one
is designed to circumvent the wire bonding process pitfalls .
2) the fails could have come from the new process .
from reading the patent , Eman is going for wireless bonding , just
bond pad to pad and this would also mean no gluing the die to the
pad to pad bonding is much more robust process than wire bonding , but
still takes some development time ... i also wonder, if the new pad
process is something that can be done on the SNUP , which could
mean even lower cycle time from wire bonding and 1 less tool
to worry about .... certainly interesting ..
what will also be interesting , is if they let the Q/A guy describe what
went wrong and also to address the new process , i still think
that the problem has been bounded and resolved .... garce
okay Bill , here is yet another lesson ...
1) read and comprehend someone's post before reply
2) lets define terms:
1) wafers ... yes , i and others , have long known that Eman buys it's wafers ready for processing
and that they come from TSMC ...
3) the wafer is the CHIP SUBSTRATE.
4) Eman makes chips
5) the chips need to be built into a PACKAGE , or MODULE substrate.
6) I know for a fact that Emagin does not make the module substrate , I don't know who does.
My last post was concerning the module package that Eman buys from some vendor , that's
actually where the PADS are ... on the chip , there are tiny tiny tiny solder balls .
The pads are most likely built with 2 layers of metal and gold plated .. PAD bonding problems
occur here , and usually is the result of delamination of the metals in the PAD , or maybe
too much of the gold DIFFUSED into the rest of the pad , resulting in a poor bond ......
BILLY ... that post was not about the wafers !!!! ... garce
and he probably feels embarassed that he's a good foot taller than Napolean ..
sure would be nice if Congress voted him a one way ticket to Elba .. eh ??
i disagree ... it seems to me , that Obama would like to get the title of US President changed from a professional
position to one of hourly pay , since he'd be on the clock 24/7 .. it'll be a windfall of OT ... don't forget ,
he has 2 1/2 more years to suck on the govt. teat .. after that ??? who knows .. will Michelle go back to
practicing law and support him , a la gigolo ? I cannot see his contituency throwing gobs of money
his way for speaking engagements and other such things a president can to gen income after office ...
depends on the source of the problem , Don ... if this is an incoming defect from the \
module substrate vendor , it could take a while , unless the problem surfaced quickly and
was bound to a known quantity ... regardless , the fact that it impacts rev drove the 10K and
for most investors/traders , who only have numbers to go by , it sounded like a show stopper ..
we'll all be experts by 5 pm ...
as per usual, the guidance will carry more import than the results ... garce
counter to Bill's claim that everything is handled in house , once the wafers arrive , probably so , for the
chips .... there is no way that Emagin makes the module substrate , these are bought from a vendor ,
who also laid down the bonding pads ... could have very been an incoming problem and highlights
the need to qualify a vendor (that's a given ) , but there should still be an incoming inspection or test , at
least a sample ... i still maintain the pad thing is not big , except for the fact that some revenue gets pushed
into Q2 ....
also hoping for some hardballs to get tossed in the q/a session ...
but the print contained in an investing 101 book can be useful .. try it ..
company statements and pr's are often used to "flavor facts " , but the SEC filings are just facts ,
period ... they are NOT company's opinion of itself .. so i , for one do believe the SEC required prints ..
as a single piece of data for DD .... g
i bought VZ in the low 30's .. now yielding over 6% .. what's your point ??? you might also want to do a
compare chart of T v. VZ ... surprise .. VZ shows a nifty cap gain .. what was the point you are trying make ??
Maybe that T has a lot of capex to catch VZ , which will lower earnings ... were you making a point ??
thanks jpm ... i am expecting to hear that the actual problem occurred some time ago , once things got to the
point of impacting revs , they were bound to issue the 10k ... and there could still some sort of good news ..