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Intel Corporation Message Board

ideal_invst 106 posts  |  Last Activity: 18 hours ago Member since: May 9, 2011
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  • RISC vs CISC: What's the Difference?
    Analysis of ARM, X86, MIPS designs shows no difference

    A new study comparing the Intel X86, the ARM and MIPS CPUs finds that microarchitecture is more important than instruction set architecture, RISC or CISC.

    If you are one of the few hardware or software developers out there who still think that instruction set architectures, reduced (RISC) or complex (CISC), have any significant effect on the power, energy or performance of your processor-based designs, forget it.

    Ain't true. What is more important is the processor microarchitecture — the way those instructions are hardwired into the processor and what has been added to help them achieve a specific goal.


    "Based on this study, developers can safely consider ARM, MIPS, and x86 processors simply as engineering design points optimized for different levels of performance," he said. “There's nothing fundamentally more energy-efficient in one ISA class versus another."

    In the concluding paragraph of the report, the authors write: "It appears that decades of hardware and compiler research has enabled efficient handling of both RISC and CISC ISAs, and both are equally positioned for the coming years of energy-constrained innovation."

    Sources: EE Times

  • ideal_invst ideal_invst Jun 29, 2015 9:42 AM Flag

    You're right., my bad...should have had my coffee before responding. Intel is doing a lot of mixing and matching GPUs, should be easier to swap it out if Intel thinks it is worthwhile to do so.

  • ideal_invst ideal_invst Jun 29, 2015 8:38 AM Flag

    You're right....with SoFIA, not ARM but hurting all lower-end ARM SoC vendors.

    Over time if and when x86 core is substituted for ARM, will be hurting ARM as well. Don't mind Intel handing a few pennies over to ARM if it is not worthwhile to add x86 in place of ARM core :)

  • Reply to

    Alex, question for you

    by ideal_invst Jun 27, 2015 1:23 PM
    ideal_invst ideal_invst Jun 28, 2015 8:37 PM Flag

    SEJ & Alex, appreciate your thoughts. Regarding Micron - Flat bits, lower ASPs, staggered quarter vis-a-vis Intel - too many moving parts to accurately assess Intel Q2 results. Guess we have to wait till Intel announces in a couple of weeks.

  • The Malaysia-based SNS network announced the first smartphone with a Intel Atom x3 "SoFIA" mobile chipset. Dubbed JOI Phone 5, the dual-SIM budget-level smartphone will be sold through GLOO’s retail network in Malaysia.

    The front of JOI Phone 5 resembles the recently launched Asus ZenFone 2. The device packs a 64-bit dual-core Intel Atom x3-C3130 mobile chipset, which is manufactured via 28nm process, and integrates the Mali-400MP2 GPU for graphics. The SoC is coupled with 1GB of RAM and 8GB internal storage.

    The rest of the Phpne 5’s specifications include 5” 720p IPS LCD display, 8MP main camera, and 2MP front-facing snapper. Connectivity options include Wi-Fi 802.11 b/g/n, Bluetooth 4.0, and dual-SIM. The handset boots Android 4.4 KitKat.

    SNS network has packed a 2100 mAh battery in this dual-SIM device. JOI phone 5 is priced at 399 Malaysian Ringgit ($106).

    JOI 7 Lite phablet with 7-inch display sporting 1024x600 pixel resolution was also announced for 299 Malaysian Ringgit ($79). The device packs the same 64-bit Intel Atom x3 chipset as the Phone 5, coupled with 1GB of RAM and 8GB of built-in storage.

    However, this is not the first tablet with Atom x3 chipset. A Chinese Telecast X70 3G tablet with phone calling support was the first Atom x3 tablet priced merely at $70.

    Source: gsmarena

  • ideal_invst by ideal_invst Jun 27, 2015 1:23 PM Flag

    I recall one of your comments from a few days back. In that you indicated that there has to be some reason why Intel was expediting Skylake even though Broadwell has not been fully rolled out yet. If I remember right, the thread was about Intel embedding DRAM or some sort of NVM in its CPUs/SoCs.

    Now we have 2 more datapoints:
    (1) Micron announced poor results and weak forecast (most take it to indicate a poor PC market)
    (2) With less than a week left in Q2, Intel hasn't pre-announced (so its results may be in line with previous guidance)

    I think that the idea that Skylake (which should be shipping already if systems are to be out in late-July and August) incorporates some level of embedded memory (DRAM and/or other NVM) can only be substantiated further with these 2 datapoints.

    Only this scenario explains all the 3:
    (1) Weaker results for DRAM manufacturers like Micron
    (2) Higher Skylake ASPs resulting in increased revenues for Intel
    (3) Compelling reason for Intel to expedite Skylake at the expense of Broadwell.

    Curious to know your thoughts on this.

  • ideal_invst ideal_invst Jun 19, 2015 10:25 AM Flag

    Will check out anandtech. But for now, 810 seems to be a gift that keeps on giving :)

  • Reply to

    Wallis: re: Zenfone 2 availability.

    by paul.ottelini Jun 18, 2015 11:35 PM
    ideal_invst ideal_invst Jun 19, 2015 9:58 AM Flag

    Looks like QCOM will be supplying the SoC's for the flagship phones for W10.

    Good overheating ones I hope....for use in the North Pole. Just kidding!

  • [Samsung, Sony, HTC, & now Xiaomi !!]

    Qualcomm Snapdragon 810 chipset has allegedly caused the delay in Xiaomi Mi 5 launch; the chipset has been plagued with thermal heat issues which Xiaomi do not want to be associated with the hotly anticipated Mi 5.

    Mobile vendors like Sony and HTC suffered overheat issues on the Xperia Z3+ and HTC J Butterfly respectively. Issues like these have equally forced other mobile phone manufacturers to avoid the Qualcomm’s Snapdragon 810 chipset.

    Earlier in 2015, 60 OEM’s reportedly adopted the chipset as their primary processor but the plague associated with it has seen several big name mobile vendors go for alternatives. LG opted for a less powerful Snapdragon 808 chipset on the G4, while HTC escaped the notorious overheating issue by housing a MediaTek chip on its HTC One M9+ device.

    The embarrassing report associated with the Snapdragon 810 chipset forced Qualcomm to cut ties with Taiwan Semiconductor Manufacturing Company TSMC who helped build the chipset. Qualcomm has reportedly reached out to Samsung for its next-gen Snapdragon 820 chipset.

    Xiami Mi 5 is expected to release later this year, but a recent report from Forbes suggests Xiaomi will power the device with Snapdragon 820 chipset. However, Qualcomm next-gen chipset would become available at the tail end of the year, which technically implies that the Mi 5 will ultimately see a delay in its release date.

    Source: Techrez

  • ideal_invst ideal_invst Jun 16, 2015 11:25 AM Flag

    When you say "problem is with the design", I take it that you mean the 810 SoC design. If so, Qualcomm has messed up pretty bad this time - yes? And the TSMC 20-nm process did not help mitigate the SoC design issues.

  • ideal_invst ideal_invst Jun 16, 2015 10:01 AM Flag

    Monk, did you notice my posting yesterday....Sony has admitted that the Snapdragon 810 is causing their new Experias to run hot and customers should switch it off and on to keep them from overheating. They promise a fix over the next few months.

    So now we have both Samsung and Sony saying that the Snapdragon 810s are overheating. In effect, the TSMC 20nm can't be working too good, eh?

  • Sony admits Snapdragon 810 is causing Xperia Z3+ overheating issues
    Tells users to turn it on and off again
    By Lee Bell
    Mon Jun 15 2015, 11:44

    SONY HAS ADMITTED that the Xperia Z3+ is overheating owing to problems with the phone's Qualcomm Snapdragon 810 chip.

    The Japanese firm said that it will release a software fix in the summer to tackle the fault, which is a known problem seen in other handsets powered by the processor.

    Sony acknowledged the overheating after it was detected in tests run by GSMinfo in the Netherlands, which found that the camera app crashed after a few minutes of video recording and that an unusual amount of heat was felt on the rear of the device.

    Sony suggests powering off the phone several times a day while the fix is being readied, especially when charging the device. It also recommends that dissatisfied Xperia Z3+ and Xperia Z4 owners should contact the Sony service centre.

    The Xperia Z3+ isn't the first phone to suffer problems with the Snapdragon 810 chip. Rumours surfaced earlier this year that Samsung ditched Qualcomm and used its own microprocessors in the Galaxy S6 due to overheating problems.

    LG in April decided to go with Qualcomm's hexa-core Snapdragon 808 chip instead of the 810 for the LG G4, leading many to speculate that this was down to overheating.

    Qualcomm at the time denied the claims, saying that LG's decision to use the Snapdragon 808 was made "over a year ago" and had nothing to do with the persistent rumours surrounding the 810.
    Tim McDonough, head of marketing at Qualcomm, said at the time: "The decisions on which chipsets to put on which handsets come from over a year ago."

    What's more, LG was quick to jump to Qualcomm's defence, saying that the G Flex 2 ships with the Snapdragon 810 and has had no problems.

    Nevertheless, the news of the Sony Xperia Z3+ overheating doesn't bode well for the reputation of the 64-bit octa-core Snapdragon 810.

    Source: TheInquirerDOTNet

  • ideal_invst ideal_invst Jun 10, 2015 10:26 AM Flag

    Alex, appreciate your ability to look beyond the headlines and what most people seem to infer from them!

  • Spreadtrum Guns for Intel’s 14nm FinFET in 2016

    SHANGHAI, China — Qualcomm and MediaTek, you better watch out. Here comes Spreadtrum, riding piggyback on Intel’s foundry business and gunning for 14nm FinFET, with sights set on 10nm.

    China’s Spreadtrum Communications will use Intel Corp.’s 14nm FinFET process technology, for both the low- and high-end mobile chips the company plans to launch in 2016, Leo Li, chairman and CEO of Spreadtrum, told EE Times Tuesday (May 26).

    For Spreadtrum, using Intel as its foundry has apparently superseded its potential adoption of Intel Architecture in future mobile chips.

    Intel’s $1.5 billion investment in Tsinghua Unigroup last fall resulted in the U.S. chip giant owning 20 percent of China’s combined Spreadtrum Communications and RDA Microelectronics. Spreadtrum’s quid pro quo for Intel, under the agreement, is a matter of intense speculation among semiconductor industry observers.

    Li, during the one-on-one interview, insisted, “I am under no obligation” to use Intel technologies “unless they prove to be competitive on the market.”

    Nowhere in a series of agreements the two companies signed last fall is it stipulated that Spreadtrum must switch from ARM-based architecture to Intel Architecture in future chips.

    “They can’t force us,” said Li. But that’s not to say that Li isn’t interested in a war chest full of Intel’s technologies. “Intel is a great company. It really has a lot to offer.”

    Source: EE Times

  • ideal_invst ideal_invst May 22, 2015 7:20 AM Flag

    FYI, this isn't true as they have used Intel in tablets before (the tab 3).

    That may be the case, but it does not negate what mega.hurts said.

    In the recent past, Samsung had increased the use of their Exynos APs. The fact that they now feel compelled to use Intel instead of Exynos is a "significant win" as mega.hurts put it.

  • Reply to

    Newegg Sold out of Zenfone 2's

    by ctsvdreams May 20, 2015 10:10 AM
    ideal_invst ideal_invst May 20, 2015 12:04 PM Flag

    Agree, but a small correction. The date should read 5/19/2015.

  • Reply to

    PayPal Deploys ARM Servers in Data Centers

    by wallisweever May 13, 2015 8:32 AM
    ideal_invst ideal_invst May 14, 2015 8:15 AM Flag

    Well, 2 articles discussing just 2 customers (and rehashing the same customer twice) without much data actually is a very big negative for X-Gene.

    Methinks they are struggling but not ready to quit yet.

  • Reply to

    PayPal Deploys ARM Servers in Data Centers

    by wallisweever May 13, 2015 8:32 AM
    ideal_invst ideal_invst May 13, 2015 12:32 PM Flag


    Just kidding. However, I noticed an article which said that the CEO was evasive and cagey when questioned on volume and/or benchmarks during the conference call.

  • ideal_invst ideal_invst May 9, 2015 8:49 AM Flag

    And the reason Intel would do it is three-fold:

    (1) Get incremental revenues/margins across a huge volume of mobile chips
    (2) Keep their huge factories more fully utilized
    (3) Increase their competitive position by reducing ARM-vendor revenues - which will diminish their capacity to invest into R&D and move up the performance chain into PCs and servers.

    (3) is the key benefit, but the other two are also very valuable.

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