The Malaysia-based SNS network announced the first smartphone with a Intel Atom x3 "SoFIA" mobile chipset. Dubbed JOI Phone 5, the dual-SIM budget-level smartphone will be sold through GLOO’s retail network in Malaysia.
The front of JOI Phone 5 resembles the recently launched Asus ZenFone 2. The device packs a 64-bit dual-core Intel Atom x3-C3130 mobile chipset, which is manufactured via 28nm process, and integrates the Mali-400MP2 GPU for graphics. The SoC is coupled with 1GB of RAM and 8GB internal storage.
The rest of the Phpne 5’s specifications include 5” 720p IPS LCD display, 8MP main camera, and 2MP front-facing snapper. Connectivity options include Wi-Fi 802.11 b/g/n, Bluetooth 4.0, and dual-SIM. The handset boots Android 4.4 KitKat.
SNS network has packed a 2100 mAh battery in this dual-SIM device. JOI phone 5 is priced at 399 Malaysian Ringgit ($106).
JOI 7 Lite phablet with 7-inch display sporting 1024x600 pixel resolution was also announced for 299 Malaysian Ringgit ($79). The device packs the same 64-bit Intel Atom x3 chipset as the Phone 5, coupled with 1GB of RAM and 8GB of built-in storage.
However, this is not the first tablet with Atom x3 chipset. A Chinese Telecast X70 3G tablet with phone calling support was the first Atom x3 tablet priced merely at $70.
I recall one of your comments from a few days back. In that you indicated that there has to be some reason why Intel was expediting Skylake even though Broadwell has not been fully rolled out yet. If I remember right, the thread was about Intel embedding DRAM or some sort of NVM in its CPUs/SoCs.
Now we have 2 more datapoints:
(1) Micron announced poor results and weak forecast (most take it to indicate a poor PC market)
(2) With less than a week left in Q2, Intel hasn't pre-announced (so its results may be in line with previous guidance)
I think that the idea that Skylake (which should be shipping already if systems are to be out in late-July and August) incorporates some level of embedded memory (DRAM and/or other NVM) can only be substantiated further with these 2 datapoints.
Only this scenario explains all the 3:
(1) Weaker results for DRAM manufacturers like Micron
(2) Higher Skylake ASPs resulting in increased revenues for Intel
(3) Compelling reason for Intel to expedite Skylake at the expense of Broadwell.
Curious to know your thoughts on this.
Will check out anandtech. But for now, 810 seems to be a gift that keeps on giving :)
Looks like QCOM will be supplying the SoC's for the flagship phones for W10.
Good overheating ones I hope....for use in the North Pole. Just kidding!
[Samsung, Sony, HTC, & now Xiaomi !!]
Qualcomm Snapdragon 810 chipset has allegedly caused the delay in Xiaomi Mi 5 launch; the chipset has been plagued with thermal heat issues which Xiaomi do not want to be associated with the hotly anticipated Mi 5.
Mobile vendors like Sony and HTC suffered overheat issues on the Xperia Z3+ and HTC J Butterfly respectively. Issues like these have equally forced other mobile phone manufacturers to avoid the Qualcomm’s Snapdragon 810 chipset.
Earlier in 2015, 60 OEM’s reportedly adopted the chipset as their primary processor but the plague associated with it has seen several big name mobile vendors go for alternatives. LG opted for a less powerful Snapdragon 808 chipset on the G4, while HTC escaped the notorious overheating issue by housing a MediaTek chip on its HTC One M9+ device.
The embarrassing report associated with the Snapdragon 810 chipset forced Qualcomm to cut ties with Taiwan Semiconductor Manufacturing Company TSMC who helped build the chipset. Qualcomm has reportedly reached out to Samsung for its next-gen Snapdragon 820 chipset.
Xiami Mi 5 is expected to release later this year, but a recent report from Forbes suggests Xiaomi will power the device with Snapdragon 820 chipset. However, Qualcomm next-gen chipset would become available at the tail end of the year, which technically implies that the Mi 5 will ultimately see a delay in its release date.
When you say "problem is with the design", I take it that you mean the 810 SoC design. If so, Qualcomm has messed up pretty bad this time - yes? And the TSMC 20-nm process did not help mitigate the SoC design issues.
Monk, did you notice my posting yesterday....Sony has admitted that the Snapdragon 810 is causing their new Experias to run hot and customers should switch it off and on to keep them from overheating. They promise a fix over the next few months.
So now we have both Samsung and Sony saying that the Snapdragon 810s are overheating. In effect, the TSMC 20nm can't be working too good, eh?
Sony admits Snapdragon 810 is causing Xperia Z3+ overheating issues
Tells users to turn it on and off again
By Lee Bell
Mon Jun 15 2015, 11:44
SONY HAS ADMITTED that the Xperia Z3+ is overheating owing to problems with the phone's Qualcomm Snapdragon 810 chip.
The Japanese firm said that it will release a software fix in the summer to tackle the fault, which is a known problem seen in other handsets powered by the processor.
Sony acknowledged the overheating after it was detected in tests run by GSMinfo in the Netherlands, which found that the camera app crashed after a few minutes of video recording and that an unusual amount of heat was felt on the rear of the device.
Sony suggests powering off the phone several times a day while the fix is being readied, especially when charging the device. It also recommends that dissatisfied Xperia Z3+ and Xperia Z4 owners should contact the Sony service centre.
The Xperia Z3+ isn't the first phone to suffer problems with the Snapdragon 810 chip. Rumours surfaced earlier this year that Samsung ditched Qualcomm and used its own microprocessors in the Galaxy S6 due to overheating problems.
LG in April decided to go with Qualcomm's hexa-core Snapdragon 808 chip instead of the 810 for the LG G4, leading many to speculate that this was down to overheating.
Qualcomm at the time denied the claims, saying that LG's decision to use the Snapdragon 808 was made "over a year ago" and had nothing to do with the persistent rumours surrounding the 810.
Tim McDonough, head of marketing at Qualcomm, said at the time: "The decisions on which chipsets to put on which handsets come from over a year ago."
What's more, LG was quick to jump to Qualcomm's defence, saying that the G Flex 2 ships with the Snapdragon 810 and has had no problems.
Nevertheless, the news of the Sony Xperia Z3+ overheating doesn't bode well for the reputation of the 64-bit octa-core Snapdragon 810.
Alex, appreciate your ability to look beyond the headlines and what most people seem to infer from them!