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Cymer Inc. Message Board

jamulmike 356 posts  |  Last Activity: 19 hours ago Member since: Oct 10, 2011
  • Harlan Sur
    The O'fer shills and their sponsored "experts"?
    cave dwelling flat earth luddite clowns both.
    Here, history DOES repeat.
    O'fer forever.
    The All Silicon Solution Bonanza.

    Okay, appreciate the insights there. Maybe more of a product question for me next. I mean, if we include 2 in 1s, I think SSD and embedded NAND attach rates in notebook PCs are at or slightly above 50% now and continuing to climb. I think you guys had a target of having your 3D NAND base client SSD in the market in calendar Q3. Maybe if you can just give us an update there? And I think you guys also had a target to have your 3D NAND-based SATA solution, your high capacity drives for hyperscale drives starting in calendar Q4, if you could give us an update there as well? Thanks.

    Mark Durcan

    Well, they are both in the market. And we are going to just have to see what the demand looks like, but so far we like the reaction we are seeing

    Sentiment: Strong Buy

  • The mad dash to the motherboardless All Silicon Solution is well underway.
    It is just the opposite of the O'fer shills chip Armageddon.
    Bit Bonanza.

    Ernest Maddock

    Again, it’s really challenging to give you a forecast of what’s going to happen with the pricing environment. But in terms of aggregate revenues, we would expect it, as we move through these qualifications, that you are going to see the mobile business maintain or slightly improve in terms of a percentage of its overall revenue to the business. And as we noted in our comments, right, as we see eMCP market moving to higher density, we think that, that will be sort of a starting point for an improvement in that aggregate market, which has been weak actually in the last couple of quarters and that’s a quarter or so off as we roll into calendar 2017

    Sentiment: Strong Buy

  • Huge increase on a simply huge base.
    48-layer 3D NAND. Now. 96. Soon.
    3D interposer chip stack. Now.
    This is just the start.

    For NAND, we estimate 2016 industry bit supply growth in the mid 30% to low 40% range with a similar range in 2017 as early 3D conversions create some temporary supply constraints. Over the last several quarters, we have experienced strong demand coupled with aggressive pricing as suppliers have been driving to increased penetration rates and densities. Similar to DRAM, the current channel pricing environment appears to be improving, but has not yet significantly impacted across other segments. Our long-term bit demand forecast is in the low 40% range as lower cost and higher performance 3D NAND solutions enter the market.

    Sentiment: Strong Buy

  • Samsung, the run away and hide bit leader, will be cranking out 1Xnm RAM.
    Taking share with predatory pricing.
    Cymer lights DON'T make profits. They make bits. 25% growth on a simply huge base is simply huge.

    Turning to the memory industry more generally, we believe that the DRAM industry supply growth will be in the low to mid 20% range in 2016, which is consistent with our prior commentary. If wafer output declines in the latter half of the year as some parties have forecast, we would expect to exit the year on a slower run-rate and 2017 bit supply growth could be in the mid to high-teens. This compares to our long-term bit demand forecast in the low to mid-20% range. The significant improvements we are seeing in channel pricing are not currently impacting other segments. And as a result, we continue to take a conservative view of the market environment.

    Sentiment: Strong Buy

  • I think Samsung is already in volume production of 1Xnm.
    Micron continues to be a generation behind.
    "experts" RAM bits to increase 20-25%.
    Laggards don't do well in the 21st.
    Cymer lights DON'T make profits. They make bits. Better than anyone.

    In our Compute and Networking business unit, we returned to revenue growth despite pricing pressure in the client segment. This was driven by the ongoing ramp of our 20-nanometer products, which exceeded 25-nanometer shipments on a bit basis for the first time. We enjoyed continued 20-nanometer qualifications across all CMB market segments led by our 8-gigabit DDR4 product in enterprise, cloud and client. In May, NVIDIA launched the world’s fastest consumer graphics card designed with Micron’s GDDR5 X. We are excited about the prospects for this high-performance memory product. In enterprise and cloud, we saw initial customer announcements based on our NVDIMM product offering with high-performance persistent memory.

    Sentiment: Strong Buy

  • While the shills scream about 20th HDD hotbox PCs, 21st guys busy cranking out The Mother of All Paradigm Shifts’ IoE Thingies.

    Messenger now has 11,000 bots on its platform

    Jul 1 2016, 04:30 ET | By: Yoel Minkoff, SA News Editor

    Facebook now has over 11K bots and 21K developers building them on Messenger, the social networking giant's David Marcus told CNBC.

    The company opened the platform just over 10 weeks ago and the latest figures appear to suggest enthusiasm from the developer community.

    Sentiment: Strong Buy

  • Nothing screams units/layers/bits bonanza like FOWLP.
    Like Fiber.
    Like 400G. Then 800.
    Like 5G.
    Like 8K. Soon.

    Camtek Ltd. (NASDAQ: CAMT; TASE: CAMT), today announced the launch of an innovative inspection method for Fan-Out Wafer Level Packaging (FOWLP). This new inspection method compares the image acquisition of the dies on the reconstructed wafer with the computer-aided design (CAD) data used in fabricating the wafer.

    Ramy Langer, Vice President and Head of Camtek's Semiconductor Division, commented, "Camtek has more than 25 years of experience working with CAD data in our Automated Optical Inspection (AOI) systems for the PCB industry. The development of this new method for the inspection of Fan-Out applications is based on this experience and accumulated know-how."

    Continued Mr. Langer: "Industry experts expect Fan-out wafer level packaging technology to grow in excess of 30% annually over the coming years. The Fan-out packaging process imposes many inspection challenges, especially due to alignment issues. We believe that using the CAD as a reference for detecting the reconstructed wafers will make our Eagle product the tool of choice for Fan-out applications."

    Sentiment: Strong Buy

  • The 3D Interposer Age is here.
    This will allow innovation beyond comprehension. shills will scream the sky is falling.
    (Cymer)ASML. Will they consolidate the whole Fab process?

    Rudolph Receives Multi-System Order for Over $11 Million From a Leading OSAT for Fan-out Wafer Level Packing Inspection

    Rudolph Inspection, Metrology and Analysis selected for large-scale ramp of Fan-out Wafer Level Package Production (FOWLP).

    Rudolph Technologies, Inc., a leader in the design, development, manufacture and support of defect inspection, lithography, metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide, announced today that a leading OSAT in Asia has placed an order for over $11 million USD for an integrated solution consisting of multiple process control inspection systems and yield management software suite. The solutions will be deployed into multiple applications including whole wafer inspection, 3D bump metrology and post-saw die inspection. The systems will begin shipping in Q2 2016, with the majority of the order shipping the second half of 2016.

    Sentiment: Strong Buy

  • But...
    the shills and their sponsored "experts" tell us over and over and over innovation is over.
    The Earth is flat.
    The Sun orbits Earth.
    O'fer shills.

    Applied Materials Revolutionizes Etch With Breakthrough Selective Materials Technology

    Disruptive etch technology shapes features with the atomic-level precision required to advance Moore’s Law

    •Extreme selectivity process removes unwanted material without damaging increasingly delicate structures
    •In production at leading chipmakers for advanced FinFET and memory

    SANTA CLARA, Calif., June 29, 2016 (GLOBE NEWSWIRE) -- Applied Materials, Inc. is revolutionizing etch technology with its Applied Producer® Selectra™ system, the industry's first extreme selectivity etch tool that introduces new materials engineering capabilities for continued scaling of 3D logic and memory chips.

    “One of the most significant hurdles in producing advanced chips is to selectively remove a specific material without damaging other exposed materials in the multi-layer device,” said Dr. Shankar Venkataraman, vice president and general manager of Applied’s Selective Removal Products Business Unit. “The Selectra system is the latest innovation in our etch portfolio of differentiated products, and creates new market opportunities by delivering the extreme selectivity required to advance Moore’s Law.”

    Advanced microchips featuring increasingly complex structures and deep, narrow trenches are creating new manufacturing challenges. One of these challenges is the inability of wet chemistry to penetrate tiny structures; another is the removal of unwanted materials without causing damage. The Selectra system’s breakthrough process accesses the smallest spaces, delivering unprecedented materials selectivity and atomic-level etch precision for a wide variety of dielectric, metal and semiconductor films. Its extensive range of processes and ability to achieve precisely controlled residue- and damage-free materials removal targets an expan

    Sentiment: Strong Buy

  • cnbc continues the myth it does news.
    ~85% of volume is traitors.
    1% of the pinging krapp becomes a psycho picosecond traitor actual transaction.
    There are no bulls and bears. They’re one and the same.
    There are no investors or concerns.
    psycho picosecond traitors.
    Quants and algorithms.

  • Multi-core screams multi-channel SSS. Nothing spews chunks like SSS.
    3D interposer watt sipping motherboardless All Silicon Solution.
    This is just the start.


    •Intel has made its second generation Xeon Phi a perfect fit for artificial intelligence.

    •Nvidia, on the other hand, has made its new Tesla P100 GPU accelerators to offer huge computing horsepower.

    •For running machine/deep learning workloads, the tide has turned in Intel’s favor.

    Diane Bryant, head of Intel's (NASDAQ:INTC) datacenter group, said at Computex in Taipei that the company's Knights Landing ("KNL") processors could be the perfect fit for AI (artificial intelligence) in terms of running ML (machine learning) or DL (deep learning) workloads. KNL represents Intel's second generation (x200) Xeon Phi family.

    According to Bryant, since the latest Xeon Phi coprocessors feature up to 72 cores, and each core has 2 Intel AVX-512 SIMD processing units for delivering improved per-core floating-point performance, these processors are ideal for running ML/DL workloads. However, it remains to be seen if these processors can surpass Nvidia's (NASDAQ:NVDA) new Tesla P100 GPU accelerators, which are currently considered the best fit for ML/DL.

    Sentiment: Strong Buy

  • Just the start…of pixel/bit inflation

    Google's Satellite Map Gets a 700-Trillion-Pixel Makeover

    More than 1 billion people use Google Maps every month, making it possibly the most popular atlas ever created. On Monday, it gets a makeover, and its many users will see something different when they examine the planet’s forests, fields, seas, and cities.

    Google has added 700 trillion pixels of new data to its service. The new map, which activates this week for all users of Google Maps and Google Earth, consists of orbital imagery that is newer, more detailed, and of higher contrast than the previous version.

    Most importantly, this new map contains fewer clouds than before——only the second time Google has unveiled a “cloudless” map. Google had not updated its low- and medium-resolution satellite map in three years.

    The improvements can be seen in the new map’s depiction of Christmas Island. Almost a thousand miles from Australia, the island was largely untouched by human settlement until the past two centuries. Its remoteness gives it a unique ecology, but—given its location in the middle of the tropical Indian Ocean—it is frequently obscured by clouds. The new map clears these away:

    Sentiment: Strong Buy

  • And,...
    This is just the start.

    How Telemedicine Is Transforming Health Care

    After years of big promises, telemedicine is finally living up to its potential.

    Driven by faster internet connections, ubiquitous smartphones and changing insurance standards, more health providers are turning to electronic communications to do their jobs?and it?s upending the delivery of health care.

    Doctors are linking up with patients by phone, email and webcam. They?re also consulting with each other electronically?sometimes to make split-second decisions on heart attacks and strokes. Patients, meanwhile, are using new devices to relay their blood pressure, heart rate and other vital signs to their doctors so they can manage chronic conditions at home.

    Telemedicine also allows for better care in places where medical expertise is hard to come by.

    Five to 10 times a day, Doctors Without Borders relays questions about tough cases from its physicians in #$%$, South Sudan and elsewhere to its network of 280 experts around the world, and back again via the internet

    Sentiment: Strong Buy

  • Just the start.

    Inuitive will leverage the CEVA-XM4 to run complex, real-time depth sensing, feature tracking, object recognition, deep learning and other vision-related algorithms targeting a range of mobile devices, including augmented and virtual reality headsets, drones, consumer robots, 360 degree cameras and depth sensors. In addition, developers and OEMs will be able to leverage the open, programmable nature of the CEVA-XM4 in the Inuitive SoC to add their own differentiating features and algorithms via software, including their own neural networks which can be implemented via the CEVA Deep Neural Network (CDNN) framework.

    Ceva's imaging and vision DSPs addresses the extreme processing requirements of the most sophisticated computational photography and computer vision applications such as video analytics, augmented reality and advanced driver assistance systems (ADAS). By offloading these performance-intensive tasks from the CPUs and GPUs, the highly-efficient DSP dramatically reduces the power consumption of the overall system, while providing complete flexibility

    Sentiment: Strong Buy

  • Stuff is really, really gunna fly.
    Very, very exciting times.
    Cymer times.

    Intel’s innovation in data center

    In order to achieve cost performance, Intel is currently working on three technologies: Omni-Path fabric, silicon photonics, and 3D XPoint, which will complement each other.

    Omni-Path fabric

    Omni-Path is a fabric path that would directly connect the CPU (central processing unit) with other external devices providing seamless workflow. Enterprises currently use FPGA as an add-on. Intel would integrate Altera’s FPGA with its CPU, providing FPGA acceleration at the silicon level. This will shift the workload from software to FPGA, thereby accelerating workloads like artificial intelligence and data analytics.

    However, Intel will face tough competition from IBM (IBM), as the latter is integrating Xilinx’s (XLNX) FPGAs into its power server processors.

    Silicon Photonics

    Silicon Photonics will overcome the drawbacks of copper wire and provide high-speed interconnects between systems.

    However, the industry is teaming up to compete with Intel in the data center space. Seven companies including Qualcomm (QCOM), XLNX, Advanced Micro Devices (AMD), and IBM have collaborated to create a single interconnect format CCIX (cache-coherent fabric to interconnect accelerators) that will allow different CPUs such as ARM, Power, and x86 to share data with FPGA accelerators.

    3D XPoint

    Intel, in collaboration with Micron Technology (MU), has developed a breakthrough storage class memory 3D XPoint, which is believed to be 1,000 times faster than NAND, is nonvolatile, and is cheaper than DRAM (dynamic random access memory). Intel claims that it would revolutionize data analytics.

    Intel believes that these technologies would help it compete with QCOM’s ARM-based server chips and IBM’s Power server chips. We’ll look deeper into the data center’s competitive landscape in the coming part of the series.

    Sentiment: Strong Buy

  • Qualcomm to debut with 10nm Server CPU

    A few customers are testing the chips, but things might become more interesting as Qualcomm is expected to release its first 10nm server SoC with even more cores. This would mean higher IPC (instruction per clock) and higher clocks with the same TDP of 14nm FinFET products.

    Sentiment: Strong Buy

  • Best-selling high card in history sources claim

    Many of our colleagues were writing about the shortage of Nvidia Geforce GTX 1080 and 1070 cards and they got things mostly right. Our multiple sources close to AIB partners told us that the 1080 is the bestselling high-end card in the history of GPU.

    Sentiment: Strong Buy

  • 4K ?

    Observers baffled

    The dark satanic rumour mill has manufactured a hell on earth yarn claiming that the coming LeEco LeMax 2 Pro will have 8GB of RAM.

    Most of us thought that the OnePlus 3 was pretty daft running 6GB, but according to Phone Radar the LeEco LeMax 2 Pro’s 8GB is about the same as a PC.

    The question is what is a smartphone going to do with 8GB of RAM? It might offer a small performance boost for the Snapdragon 821 it is supposed to be packing, but not that much to be worthwhile. The Snapdragon 821 will be a quad-core chip clocked at up to 2.3GHz.

    One suggestion is that the phone will need all that Ram to run the LeEco LeMax 2 Pro’s 5.7-inch 1440 x 2560 screen. There will also be 128GB of built-in storage along with a microSD card slot, plus a 25MP rear camera and an 8MP front-facing one and this thing is likely to shrouded in metal.

    We suppose that 8GB is a bit of a gimmick but not one we can think of any use for it.

    Sentiment: Strong Buy

  • shill "nearly impossible" FinFET has become mundane.
    10nm cheaper than dirt MEMS stuffed in everything(y).
    Just the start.

    Make Every Market Smarter

    3DInCites Interview with Yann Guillou, SEMI Europe

    3DInCites: Last year’s European MEMS Summit topic was Sensing the Planet, MEMS for Life. This year it’s Make Every Market Smarter, besides being a clever acronym, what will this year’s topic focus on vs. last year?

    Guillou: Smart phone, smart home, smart building, smart city, smart lighting, smart manufacturing, smart grid, smart watch, etc… I could continue for hours as everything you read today is or should be “smart.” Based on our analysis, to make all these markets or products “smart,” MEMS or more generically speaking, sensors and actuators, will be key enablers. Consequently, we decided to use the motto “Make Every Market Smarter,” for our event which is naturally a reference to the MEMS acronym.

    When it comes to specific topics, this year we will continue to focus on the business challenges faced by the industry, new technologies, and we will spend time on automotive, consumer and wearable electronics markets ─ and of course IoT.

    Sentiment: Strong Buy

  • the yahoos, “This topic is deleted”