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Cymer Inc. Message Board

jamulmike 284 posts  |  Last Activity: 3 hours ago Member since: Oct 10, 2011
  • 2017 Snapdragon will be 10nm

    Exclusive: Launched by the year's end

    There has been a leak about the Snapdragon 823, or a successor to Snapdragon 820, which will be more than just a faster version – our well-placed industry sources have confirmed that Qualcomm plans to use the 10nm process on the new chip late in 2016.

    Despite a potential announcement in 2016, the next generation Snapdragon will not be seen in phones until Q1 2017 and will probably find its place in top-end devices. Nothing is set in stone, but one can imagine that future Samsung, LG, HTC and many other major players will end up using the Snapdragon 8x0 10 nanometer chip. We heard the name Snapdragon 830 mentioned in some of our conversations. Fudzilla is not the first to talk about a 10nm Snapdragon 820 successor, but we have managed to confirm the existence of Snapdragon in 10nm from our independent sources.

    The Snapdragon 823, whch is a faster version of the 820, might end up in Samsung Galaxy Note 6 and the future Sony Xperia and G Flex 3. The latest leak calls this chip a SM8996PRO with a 64 Bit Kryo Quad core at 2.6GHz and an Adreno at 720MHz. This is quite a boost from the Snapdragon 820's top speed of 2.2 GHz for the CPU and 624MHz for the Adreno 530. Some sources mention a 3GHz core clock, but that sounds a bit too optimistic.

    Both TSMC and Samsung should be ready for volume production of 10nm. This is a process that will help mobile SoC manufacturers put a little distance between the 2015 and 2016 SoCs and the ones that they plan to ship in 2017.

    This might be the first Snapdragon using ARM Cortex cores but we don’t have enough information to make that claim. At some point Qualcomm was considering abandoning the development of the custom in house ARM cores for mobile, but the success of Snapdragon 820 might have changed people's minds. We do know it is 10nm and that it should be shipping roughly 11 months from now.

    Sentiment: Strong Buy

  • Me?
    I'll stick with the facts.
    With the innovators and entrepreneurs. The Teflon d(im)on sez to disregard his shills and compare YoY facts. cnbc guest sez shills not paid to be accurate when discussing the Teflon d(im)on's remarks.
    With (Cymer)ASML.

    Why is this important in the real world? There is the obvious problem of gold being really expensive, insert a joke about it being the gold standard for coatings here. Needless to say Xtalic says they are 50-80% the cost of a gold coating with the same electrical properties and less porosity. Believe it or not the bit about porosity is probably the most important of the three.

    Sentiment: Strong Buy

  • There's plenty past 3D NAND.
    "experts" WAG a decade or more. O'fer forever sponsored "experts".
    That means decades.
    This is just the start...of The All Silicon Solution Age.

    Update April 13, 2016 at 3:31pm: Everspin just confirmed that the 256Mb die is on the 40nm process, the 1Gb is a 28nm chip.

    Another interesting technical tidbit is the interface, until now Everspin’s MRAMs used a standard DDR3 interface, something the 256Mb product continues on with. The upcoming 1Gb products will move to a DDR4 bus so you can tell where it is aimed. Both versions are true NVRAM so you can instantly power it off, there is no wear leveling needed, and write speeds are a claimed 10,000x faster than NAND flash. To operate on the DDR3/4 busses you would need that level of speed so this number seems quite reasonable.

    Sentiment: Strong Buy

  • The 21st stuff will force gadget makers to perfect The All Silicon Solution. Soon.
    Bit intense 7nm chips stuffed in everything(y). Way, way cheaper than dirt 7nm.
    While shills will cry wolf again that The Wall has been hit. O'fer shills. Harold "End of Days" Camping shills.
    A units/layers/bits bonanza.

    ASE grabs major SiP module orders for second-generation Apple Watch, sources say

    Julian Ho, Taipei; Jessie Shen, DIGITIMES [Thursday 14 April 2016]

    Advanced Semiconductor Engineering (ASE), already a provider of SiP (system-in-package) modules for the first-generation Apple Watch, has reportedly grabbed the majority of SiP module orders for the second-generation device, according to industry sources.

    Sentiment: Strong Buy

  • For years, Intel has been onboarding lagging edge circuits in its leading edge chips.
    The best combo would be 86/ARM Logic with Memory and Storage stacked on a 3D interposer. Soon.

    IDF Shenzhen begins with IoT as main focus

    Monica Chen, Shenzhen; Joseph Tsai, DIGITIMES [Thursday 14 April 2016]

    Intel Developer Forum (IDF) Shenzhen began on April 13 and its forums on the first day mainly focused on Internet of Things (IoT) applications and partnerships with China institutes and businesses.

    Intel also reaffirmed its investment of US$3.5 billion over the next 3-5 years to upgrade its plants in Dalian, China to manufacture 3D NAND and 3D XPoint.

    Intel China president Ian Yang during a keynote outlined Intel's thoughts and strategy for the IoT industry, and said it will expand technologies into smart wearables and robotic products.

    Yang pointed out that Intel has already started testing a solution that combines its Altera Arria 10 FPGA with Xeon E5-2600 v4 processor to satisfy datacenter demand for large memory.

    Sentiment: Strong Buy

  • HDD PCs are boring the bejesuses out of the customer.
    Years ago the customer focus has on smart everything(y) else.
    PC guys need to dump the humongous 20th HDD tower. Stick PC.
    Creative Destruction is becoming ever more disruptive of Old Tech.
    Just the start.

    Mobile products, IoT, VR and robots spotlighted at Hong Kong Electronics Fair

    Max Wang, Hong Kong; Joseph Tsai, DIGITIMES [Thursday 14 April 2016]

    Hong Kong Electronics Fair Spring Edition is being hosted from April 13-16 and products such as smartphones, tablets, wearables, peripherals, IoT applications, robots and virtual reality are the focuses of the show.

    Hosts, the Hong Kong Trade Development Council (HKTDC), said the show has attracted 3,400 enterprises from 24 countries, up from 2,800 in 2015. HKTDC expects visitors for this year's show to also far surpass those of 2015.

    For peripherals, many players have showcased products such as stylus, protective case and power bank accessories.

    Tablets being showcased are mainly high price/performance ratio models, and many vendors have turned to develop 2-in-1

    Sentiment: Strong Buy

  • Predicting 5nm by '18.
    Possibilities are endless.
    Innovation will come fast and furious. We KNOW innovation only speeds up. At ever increasing rates.

    As for 7nm, development is well on track, TSMC noted. "We have more than 20 customers in intensive design engagement with us and expect to have 15 customer tape-outs in 2017," Liu indicated. TSMC expects to move its 7nm process technology to volume production in the first half of 2018.

    Sentiment: Strong Buy

  • AMD announces new workstation graphics card with 32GB memory

    Press release, April 15; Joseph Tsai, DIGITIMES [Friday 15 April 2016]

    At the 2016 National Association of Broadcasters (NAB) show, AMD announced the new AMD FirePro W9100 32GB, a workstation graphics card with 32GB memory support for large asset workflows with creative applications planned for availability in the second quarter of 2016.

    AMD also introduced the AMD FireRender plug-in for Autodesk 3ds Max, which supports Ultra HD workflows and photorealistic rendering functionality.

    Sentiment: Strong Buy

  • Just a few years ago 1MP was the standard.
    Pixels mean bits.
    A bits bonanza even if units are growing single digits (ON A SIMPLY HUGE BASE). Layers, too.
    Makes no sense to make 10nm and below with a motherboard bloated with lagging edge chips.
    3D interposer (read All Silicon Solution). Soon.
    Just the start.

    Smartphone-use lens module maker Largan Precision expects business in April and May to basically remain unchanged on month due to off-season effects, CEO Lin En-ping said at an April 14 investors conference.

    Largan reported consolidated revenues at NT$8.271 billion (US$253 million), gross margin 59.66%, net profit NT$3.622 billion and net EPS NT$27.01 for first-quarter 2016.

    10-megapixel and above lens modules accounted for 50-60% of first-quarter 2016 consolidated revenues of NT$8.271 billion (US$252 million), 8-megapixel models for 20-30%, 5-megapixel ones for 10-20% and models with other resolutions for 0-10%.

    Sentiment: Strong Buy

  • The All Silicon Solution Age has just begun.
    10nm way cheaper than dirt chips stuffed in everything(y).
    Then way, way cheaper than dirt 5nm. O'fer shills wrong about costs. ALWAYS. Clueless about new techniques and materials. ALWAYS.

    400G. Then 1TB
    8K. Samsung sez glassesless 3D with 11K.
    96-layer SSS. Then new stuff like RRAM/ReRAM.
    Let's face it. Shills are not paid to be accurate. Paid 7 figures to move stock prices for psycho picosecond traitor clients.


    Sentiment: Strong Buy

  • I'm pretty, starting with wet ArF or before, customer had to sign up for OnPulse.
    Quad-pattern is 2X pulses.
    A pulse bonanza.

    Sentiment: Strong Buy

  • The need to shrink gets ever stronger.
    the shill Static Model has NEVER worked. O'fer forever shills. 7 figure pay contort n distort shills.
    A shrink bonanza.

    Mark Liu

    Well I’ll try to answer what I heard from you. Yes, we plan to use EUV on our 5-nanometer. And we have already three yielding tools on the floor and the fourth is coming. So all these are using actively for the development. So until 2020, when N5 is currently planned into production, yes, it will be adopted.

    But just to remind you that in – if you think about CapEx, don’t think about everything we’re going to change to EUV. There are 80 layers and only a 10th – there are about 50/60 if you discount multiple patterning. Only the 10 of them roughly will use EUV. So a lot of tools still be able to common tools. So did I answer your question?

    Sentiment: Strong Buy

  • Mehdi Hosseini*

    So there’s been a lot of emphasis on this, on 7-nanometer and your progress. It’s great to see you have maintained your lead. But in that context should we assume that the 10-nanometer will be a shorter node? And if so, what happens to backfilling? You mentioned the 90% of the equipment for 10 and 90% of the 10-nanometer equipment could be used for 7-nanometer. Is that going to have an impact on your spending which ties into backfilling? Any comment or any color there would be great.

    Elizabeth Sun

    Okay. Mehdi’s question is that he’s happy to see that we have a leadership in 7 – at 7-nanometer. However, does that mean that we will have a short node for 10? And if it is a short node, what would happen to the common tools, this equipment being 90%-plus common? What’s the impact to our capital spending?

    Mark Liu

    I think this 10-nanometer will ramp very fast, but it appears to be a shorter node than that of 7-nanometer. So the picture could be similar to our 20 and 16. And also we anticipated before enough that we try to maximize the common tools from 10-nanometer to 7-nanometer. Therefore this is 95% is in – is by design so that when the 10-nanometer, after three years, it reduces, the tool can be readily expanded into the capacity for 7-nanometer ramp.

    *this is the very same shill that predicted Chip Armageddon because of little 20nm. Everyone. I mean EVERYONE knew 20nm was an unloved orphan.
    This was, then, put on the wires as fact. traitors went hog wild punishing the price.
    same old krapp...

    Sentiment: Strong Buy

  • The Wall on shrink?
    O’fer forever shills wrong again. And again and again.
    What else is new?
    7nm will be way, way cheaper than dirt and stuffed in even more stuff. Stuff shills totally clueless on.
    Here, history DOES repeat.
    A units/layers/bits bonanza.
    Just the start.

    Michael Chou

    Yes. So does that mean you actually see the stronger-than-expected 10-nanometer compared to six months ago based on your progress? Because in the past it seems that – I remember management mentioned 10-nanometer will be smaller than 16-nanometer. So based on latest progress, are you seeing the better demand outlook for 10-nanometer?

    Mark Liu

    When I talked about 20 customers, it’s on 7-nanometer. Okay? So 7-nanometer indeed, we see stronger adoption in the past quarters. So that’s what we are – I was addressing.

    Sentiment: Strong Buy

  • Randy Abrams

    Okay. And if I could ask, for the forward technology, you’re doing a much faster move to 7-nanometer, where it’s a new bump every one year, where so many other foundries, like Intel, is going to an optimized, taking longer. And I’m curious on two fronts. One if there’s any trade off or risk to your strategy moving faster.

    And the 7, your density shrink is about a 60%, so not at full shrink. If, as we go through the node, if competitors could leapfrog with a full 7 nanometer or you can upgrade the process as you move through. So maybe talk about that strategy for what you’re doing on 10 and 7.

    Mark Liu

    Well I cannot tell you all our strategy. But we think we are developing a technology fit for our customers’ product announcement. So all this strategy and roadmap is collaborating with our customers at the shortest time to be able to reach the maximum technology development benefit for their products. So that has been the past two or three generations, but I don’t see no difference in going forward.

    Sentiment: Strong Buy

  • 20th HDD hotbox PC units totally meaningless about leading edge chips.
    InFO totally meaningful.

    Now let me update on InFO. Equipment installation at our Longtan site for volume production is almost complete. We expect to complete customer product qualification shortly and will be ready for volume production in this quarter.

    Our expectation of InFO contributing more than $100m per quarter in 4Q this year remains unchanged. In addition to high-volume preparation and product qualification, we are working on yield improvement and cost reduction.

    Now let me make some comments on InFO technology. Compared to the conventional package, TSMC InFO has advantage in form factor, such as smaller area and a similar thickness, and also in how efficient. You can reduce the power consumption by as much as 20%. Meanwhile, InFO supports our memory bandwidth and therefore improves circuit performance.

    With TSMC’s InFO technology, our customers can integrate the multiple chip in the same package while reducing the overall cost. This advantage will enable InFO technology to play an important role in the chip partitioning, which can be one of the effective ways to reduce cost for products which utilize leading-edge technology, such as 7-nanometer technology and beyond. As a result, we believe InFO will be a powerful technology to capture the growth opportunity in both mobile and IoT market.

    Sentiment: Strong Buy

  • the yahoos, "This topic is deleted"

  • Quad-pattern wet ArF or single pass EUV?
    Who cares?*
    (Cymer)ASML wins either way.

    Now on EUV, we have made good progress in the EUV development with ASML. Recently, EUV development gained quite a good momentum across the industry. Two source power of 60 watts to 80 watts is capable of becoming operational in fact now. We are working on the tool reliability under fab operating conditions. EUV photoresist mass fabrication, particle control and basic modules have all made good progress. We recently demonstrated a reasonable yield on our N7 yield vehicle, 128-megabit SRAM using one EUV layer. Currently development of a reliable EUV mask pellicle is another focus to enable a mass production operation.

    *I wonder often if Intel is dragging its feet on EUV being way more efficient at ArF.

    Sentiment: Strong Buy

  • Cymer lights make units/layers/bits.
    Not sales/profits/margins.
    Bonanza just starting. And just increasing.

    Now let’s take a look at revenue by technology. 16 and 20 nanometer contributed 23% of our total wafer revenue in the first quarter. In addition, 28-nanometer saw a nice rebound in demand and contributed 30% of our total wafer revenue. Together, these three advanced technologies accounted for 53% of total wafer revenue.

    Sentiment: Strong Buy

  • As I said for years. And years.
    PC guys failing miserably to pick up the pace.
    Apple went SSS years ago. Taking share.
    Google and new MicroSoft pads doing very well.
    Mobile Stuff (read SSS based) en fuego.
    HDD stuff?
    Simply "falling off a cliff"
    Smart everything(y) booming while chicken little shills run around screaming the sky is falling because 20th HDD hotboxes are "falling off a cliff".

    How your phone will soon control your entire house

    Just phone home

    Since the jazzy heyday of 80s sci-fi movies, we've been promised houses that respond to our every whim.

    Music following us from room to room, heating that knows how warm you want to be all the time and maybe even a robot butler for good measure. Well, that future has well and truly arrived – apart from cyber-Jeeves, that is.

    But rather than a smart house that controls everything centrally, the brains of your home is actually your smartphone.

    Whether you have a top-of-the-line Samsung Galaxy S7 or a more modest Honor 5X, there are now ways to control every aspect of your nest from your palm, from how bright your bedroom is to how much energy you use every month.

    While the smart home is still something of a mess in terms of security and cross-compatibility, there's no doubt we've come a very long way.

    Here are some of the best and coolest ways you can control your home in 2016, whether you're there or not.

    Music that follows you around

    Appliances that do the hard work for you

    Stopping the worries when out and about

    Lights you can dim from your wrist

    Oh soooo much more!!!!

    Sentiment: Strong Buy