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Cymer Inc. Message Board

jamulmike 333 posts  |  Last Activity: 16 hours ago Member since: Oct 10, 2011
  • "In short you can now make a real, expandable ARM PC, not just a tinny laptop."

    CCIX ARM, Qualcomm, AMD, Xilinx, Huawei, IBM, Mellanox, and Xilinx all agree on CCIX interconnects. In a
    not coincidental announcement today, the seven vendors also revealed the CCIX consortium consisting of seven members.

    Leaving aside the fluffy talk of making the world a better place through 5G connected pipe cleaners or whatnot, what does CCIX bring to the table? The short version is it is an on- or off-package coherent interconnect for adding accelerators to an SoC. It is said to be, “[b]oth off-load and bump-in-the-wire inline application acceleration” meaning it can be an end point or twiddle bits that pass through it.

    CCIX will allow coherent for coherent MCM packages and/or external cards, although I wouldn’t want to see the latency numbers on a fully coherent external card sitting in a slot 10+cm away from the SoC. That said if you want to add a NIC or a GPU to your existing SoC, CCIX will allow it.

    From the consumer point of view, CCIX will allow ARM based devices to become more PC-like in their functionality. You will be able to add external storage, networking, displays, and all the like in a known form factor, add-in cards. In short you can now make a real, expandable ARM PC, not just a tinny laptop. When CCIX bearing SoCs hit the market it will change the game.

    Sentiment: Strong Buy

  • Here's the deal.
    Everyone is way behind the Facebook et al roll-your-own SSS servers.
    Really starting to feel the pain. See WinTel and Mobile.
    Very soon?
    The All Silicon Solution.
    The bit intense bonanza.

    Silicon Motion expects NAND flash shortage in 2H16

    Julian Ho, Taipei; Jessie Shen, DIGITIMES [Tuesday 24 May 2016]

    NAND flash device controller supplier Silicon Motion Technology is expecting a shortage for the NAND flash industry in the second half of 2016.

    A shortage of NAND flash chips will be caused by robust growth in the SSD market, according to Silicon Motion president and CEO Wallace Kou. SSD storage demand for data centers will be huge in 2016, said Kou.

    SSD demand has also been driven by the booming DIY market particularly in China, Kou indicated.

    On the supply side, major NAND chipmakers, except Samsung Electronics, are focused on moving their 3D products to volume shipments, while their supplies of 2D flash chips will stay flat, Kou said. The overall supply of NAND flash memory will not be scaled up substantially in the second half of 2016, Kou added.

    Silicon Motion shipped more than 20 million SSD controller chips in 2015. Shipments for 2016 are expected to surge 100%, Kou noted.

    Sentiment: Strong Buy

  • While sheeple glob up the shill Armageddon BeeS?
    Innovators innovate.

    Lattice pASSPs to enter production in August.
    The Lattice CrossLink device has also defined a new class of programmable ASSPs (pASSP) combining the flexibility of an FPGA with the performance of an ASSP. The solution is ideal for a variety of markets including VR, drones, cameras, wearable devices, mobile devices and human machine interfaces (HMIs).

    Lattice is seeing business opportunities from image capture and display technologies, said Chen, adding that technologies related to drones and VR have attracted the industry's attention. Citing Futuresource Consulting, Chen said that combining these new technologies with a global base of 3.7 billion smartphones and tablets that's set to rise more than 30% by 2020.

    The consumer VR market is set to take off in 2017, Chen believes. In addition, the number of VR pplications could expand and flourish in China, Chen noted.

    The new Lattice CrossLink pASSPs are reportedly manufactured by United Microelectronics (UMC) using the foundry's 40nm process technology.

    Sentiment: Strong Buy

  • TSMC to spend US$2.2 billion on R&D in 2016, says co-CEO

    Julian Ho, Taipei; Jessie Shen, DIGITIMES [Thursday 26 May 2016]

    Taiwan Semiconductor Manufacturing Company (TSMC) expects to boost its R&D spending to a record US$2.2 billion in 2016, increasing about 10% on year, according to company co-CEO Mark Liu.

    TSMC will be the industry's first chipmaker to have its 7nm process technology certified, said Liu, adding that TSMC's 7nm currently has 30-40% yield for 128MB SRAM.

    As for 10nm, TSMC is scheduled to move the node technology to volume production by 2017, Liu indicated. TSMC will fabricate 10nm chips at the Phase-5 and 6 facilities at Fab 15, the foundry's 12-inch wafer fab in central Taiwan.

    TSMC has also been aggressively developing its specialty process technologies, Liu noted. Shipments of chips built using TSMC's specialty processes grew 21% in 2015 with the growth outpacing TSMC's overall shipment increase.

    Among TSMC's specialty process nodes, 55nm and 40nm ULP processes are targeted at IoT and wireless MCU applications, Liu said.

    TSMC identifies automotive electronics and IoT as fast-growing markets, Liu indicated. Artificial intelligence (AI), virtual reality (VR) and 3D image capture will also drive future semiconductor market growth.

    TSMC remains optimistic about the smartphone market. Software and hardware upgrades will continue to drive smartphone innovation, Liu said.

    TSMC aims to improve design productivity and shorten design cycles, and reduce product time to market, according to Liu. In 2015, TSMC worked with about 470 customers producing more than 8,900 types of products. With 220 production technologies, TSMC processed more than 8.7 million wafers in 2015 with total shipments exceeding one billion chips

    Sentiment: Strong Buy

  • It's great news that HDDs are vanishing.
    Creative Destruction has given us SSS. Now multi-layer (128? Soon?) 3D SSS.
    Oh soooo much more.
    Bit intense bonanza.

    For more than three decades, computer applications were the largest market for IC sales but that changed in 2013 when the global communications IC market took over the top spot due to steady strong growth in smartphones and weakening demand for desktop and notebook PCs, IC Insights said. Globally, communications systems are now forecast to represent 39.3% of the US$291.3 billion IC market in 2016 compared to 34.7% for computers, and 10.7% for consumer, which has gradually been losing market share for several years.

    IC sales to the automotive market are forecast to represent only about 7.4% of the total IC sales in 2016 but from 2015-2019, this segment is projected to rise by a CAGR of 8.0%, fastest among all the end-use applications, IC Insights said.

    Sentiment: Strong Buy

  • Digitimes Research: Wi-SUN widely used in Japan, but internationalization faces problems
    I've read several articles how Japan Thingies get NO support outside of Japan.
    This while using Canon and Nikon junk lights. A Japan shill called them dogs.
    How wrong were shills ho, kumar, pang?
    What else is new?
    shills paid 7 figures to contort n distort. Confuse and diffuse by blaming Fed for everything.

    All Cymer all the time.

    Hana Hu, DIGITIMES Research, Taipei [Thursday 26 May 2016]

    Wi-SUN (wireless smart utility network), the Japan-developed wireless communication technology used in management of connected home appliances, has been popularly in the Japan market due to low power consumption, long-distance communications and high physical penetrability. But there are problems internationalizing Wi-SUN, according to Digitimes Research.

    The problems are mainly: Wi-SUN is operated on unlicensed 920MHz radio frequency band, and the band is used in Japan and the US but not in Europe; there are few international members of ECHONET Consortium, an organization to boost smart-home communication protocol ECHONET and therefore it is difficult to promote ECHONET Lite standards outside Japan; cost for Wi-SUN modules is too high to be internationally price-competitive, Digitimes Research indicated.

    Japan-based National Institute of Information and Communications Technology led the development of Wi-SUN based on IEEE 802.15.4g and then formed Wi-SUN Alliance with leading Japan-based suppliers of smart meters for specifying Wi-SUN standards.

    Japan-based power companies in 2013 adopted Wi-SUN standards for communications between smart meters and HEMS (home energy management system) and later adopted Wi-SUN HAN (home area network) standards for communications between HEMS and various connected home-use electric appliances.

    In addition to smart home management, Wi-SUN has been recently applied to locating lost old people with dementia and to agriculture.

    Sentiment: Strong Buy

  • The Customer is shunning 20th Old Tech.
    Thin's in.
    Hot's not.
    Instant on.
    Blazing fast.

    Taiwan market: Oppo launches R9 Plus smartphone

    Max Wang, Taipei; Steve Shen, DIGITIMES [Friday 27 May 2016]

    Oppo has unveiled its latest smartphone, the Oppo R9 Plus, in the Taiwan market with the availability to begin on June 1, priced at NT$16,990 (US$522) unlocked for a 64GB version and NT$18,990 for a 128GB version, according to Oppo Taiwan.

    The R9 Plus features a Qualcomm 1.8 GHz Snapdragon 652 8-core processor, 6-inch Full HD AMOLED display, 4GB RAM and 64/128GB ROM, dual 16-megapixel cameras, with dimensions of 163.1 (H) by 80.8 (W) by 7.4 (D)mm and a weight of 185g.

    Sentiment: Strong Buy

  • Apple iPhone Supplier Broadcom Opens Its M&A Maw; Is Xilinx Next?

    Tell me you see what's coming.
    @ 10nm and below, the 20th motherboard becomes a huge bottleneck.
    The customer wants Mobile Model stuff. 21st New Tech stuff.
    The tower HDD PC hotbox has been a dead man walking.
    The All Silicon Solution is the only answer.
    These are very, very exciting times.
    Cymer times.

    Apple (AAPL) iPhone supplier Broadcom (AVGO) is quickly deleveraging and might pursue M&A before year’s end, MKM analyst Ian Ing said Friday, days after Broadcom’s name was again thrown into the theoretical bidder hat for Xilinx (XLNX).

    Xilinx stock rose by 5.7% Tuesday on rumors that it had received a $15 billion bid from an unidentified source. Apple suppliers Qualcomm (QCOM) and Broadcom are often rumored suitors, but Cowen analyst Timothy Arcuri sees NXP Semiconductors (NXPI) as a better target for Qualcomm.

    Long term, Broadcom and other chips combos are at risk of Apple’s penchant for sourcing from suppliers “that have an easier path to full integration,” Ing wrote. Broadcom is about 14% exposed to Apple, providing some $4-$5 of content per iPhone.

    “Apple’s second-sourcing of modem chips via Intel (INTC) may be an interim step toward full integration centered around the (Apple) Ax-series applications processor,” Ing wrote. Intel is more open to implementing third-party apps processor IP than is Qualcomm, he says.

    “An Apple single-chip integration comparable to Qualcomm’s Snapdragon would save package, test and assembly costs as well as power consumption,” Ing wrote.

    Sentiment: Strong Buy

  • Reply to

    ASML: 10X what's claimed for RETC

    by jamulmike May 28, 2016 10:06 AM
    jamulmike jamulmike May 28, 2016 10:33 AM Flag

    (Cymer)ASML has put all ~20 competitors out of business not just competed strongly.

    Nikon is a joke.
    Nikon good old boy krapp lights go only to good old boy Japan chip guys. An industry that has been vaporized by RoW Cymer users. The Japan good old boy model has them in a ~20 year unabated downward spiral. Nikon is one of many poster children. Sony? Elpida? Panasonic? Sharp?
    Nikon is a conglomeration of a conglomeration of failed good old boys.
    What do heavy industry guys know about chips?
    Just because they still make good DSLRs lends no credence to 10nm and below chip light capabilities.

    In other words?

    Sentiment: Strong Buy

  • What's more, you're talking about an industry where the key customers are keenly focused on trying to improve their own free cash flow, leading to a "do more with less" philosophy with equipment than can pressure suppliers.

    What's the best defense? A good offense, or in this case, compelling technology and products that offer end users real advantages in throughput, production costs, and/or total cost of lifetime ownership. Rudolph Technologies (NYSE:RTEC) is trying to bring new technology to areas like advanced packaging, inspection, and metrology and use it to leverage real growth in new packaging technologies and RF and MEMS production.

    Targeting Areas Of Real Growth
    I've talked about this extensively in reference to Ultratech, but advanced packaging technologies are emerging as a big deal in the space. Technologies like wafer-level fan-out are allowing for increased density in a smaller footprint/profile and at a lower cost, and that's a trend I don't see reversing.
    Rudolph's inspection and metrology tools are used with these new packaging approaches, while the company's lithography systems help create them. While market leader Ultratech sells 1X reduction steppers for advanced packaging, Rudolph's JetStep platform is a 2X stepper. The market for 2X steppers is still very young, but the JetStep seems to be getting a look from a lot of companies using fan-out, and management has claimed a 40% efficiency advantage for its tools. Given that the addressable market could easily double over the next three to five years, that could prove to be a significant growth driver

    It's Never Easy
    The semiconductor industry is challenging enough for companies like Applied Materials and KLA-Tencor, and it can be downright brutal for companies like Rudolph and Ultratech. It is not uncommon for fabs to switch vendors from generation to generation, and that puts a lot of pressure on companies to keep up with R&D, and it does often limit pricing as well.

    Sentiment: Strong Buy

  • And,...
    History repeating tells us it only speeds up. Geometrically.
    shills know sheeple react strongly to negative "investor" "concerns" krapp.

    Mollenkopf: What people kind of forget in the tech industry is that you are [in a battle of] life or death, basically. You either win technology transitions or you don't live to tell the day because things move so quickly. We have had to pivot the company so many times either to a different end market or a different core competency, and the rate we have had to do that would surprise people. It could be every five years that we really have to make sure that we hit the next transition very, very well.

    Sentiment: Strong Buy

  • But not the innovators and entrepreneurs.
    I'll stick with them.
    I'll stick with (Cymer)ASML.

    Mollenkopf: Yes. But what I think is interesting is that people under-call how fast things are going to change. It's a defense mechanism built into the way people are wired. Qualcomm had the belief long ago that everything would be connected, computers would move off the desk into your pocket and data was going to take over everything. Even back then, I would say we didn't dream we would be as relevant in the industry as we are today.

    Sentiment: Strong Buy

  • Like I said.
    Many, many times. Over many, many years.
    SSS stuff en fuego as (H)eat (D)issipating (D)evices "fall off a cliff"
    This is just the start. As shills and their sponsored "experts" proclaim the (buggy whip) HDD is here to stay.
    128-layer SSS? Soon?
    3D interposer stack.
    Energy Harvesting.

    Market Trends Q1 2016: Shipments of SSDs Up 32.7% Year-over-Year

    Shipments of SSDs in the first quarter of 2016 were up 32.7% compared to the same period a year ago, according to findings of TrendFocus*, a storage market tracking company. Sales of all types of SSDs, including those for client and server systems, were up sequentially and year-over-year, which indicates that NAND-based storage devices are taking share away from traditional hard drives.

    My ~6 year old SanDisk SSS continues its flawless instant on, blazing fast performance.

    Sentiment: Strong Buy

  • Just the start…of Smart Everything(y).

    Smart city devices to top 1 billion units in 2025
    Global unit shipments of smart city devices, which are internet-connected devices used in smart city projects, will increase from 115.4 million in 2015 to 1.2 billion in 2025. Although in 2015 North America, Europe, and Asia Pacific each received approximately one-third of unit shipments, the Asia-Pacific region will receive over half of all device shipments by 2025, according to IHS Inc. (NYSE: IHS), a global source of critical information and insight.
    “Unit shipments of smart city devices to Asia Pacific will increase more than shipments to other regions for two main reasons,” said Roz Euan-Smith, senior analyst, smart cities, for IHS Technology. “First, the region’s large population is increasingly moving to cities, which are straining under the increased pressure and demand for resources, creating a clear need for smart city development. Second, several national governments in the region have announced smart city development initiatives that focus on full-city development, not just trials, including India’s 100 Smart Cities program, Singapore’s Smart Nation program, and other initiatives in China and Japan.”
    After countries in Asia-Pacific, the United States represents the largest potential market for smart city technology, because of the number of cities and metropolitan areas in the country, according to the recent IHS Smart Cities Devices Report. In September 2015, the White House announced a new smart cities initiative that will invest more than $160 million in federal research funds to bolster the U.S. smart cities market.

    Sentiment: Strong Buy

  • The motherboard, like the HDD, a bottleneck.
    The All Silicon Solution.

    “We’re at a critical juncture in the semiconductor industry with increased dependence on packaging solutions for delivery of next-generation products,” said Ron Huemoeller, Amkor’s corporate vice president, research and development. “The development of these PADKs, the latest outcome of our lengthy collaboration with Cadence, addresses a critical gap forming between foundry and back-end-of-line, as fan-out packaging solutions blur the lines between these processes. Based on our vast experience with advanced package design methodologies, Amkor is well positioned to lead the industry with our unique fan-out packaging technologies.”

    By jointly developing Cadence PVS-based PADKs for SLIM and SWIFT technologies, Amkor and Cadence are filling the gap between semiconductor die design and package design, while refining design methodologies for advanced IC packaging fan-out technologies. Amkor’s PADKs will enable designers to meet the design requirements needed to ensure complete package-level sign-off verification for SLIM and SWIFT technologies and provide more seamless collaboration with their customers.

    “To keep up with the industry’s faster-performing, lower-power and smaller form-factor device requirements, fan-out processing is now an essential part of advanced IC packaging,” said Steve Durrill, senior product engineering group director of the PCB Group at Cadence Design Systems. “Our partnership with Amkor fills a void when it comes to complete sign-off verification for this advanced IC packaging technology, helping to accelerate the adoption of SLIM and SWIFT technologies in this fast growing market segment.”

    Sentiment: Strong Buy

  • Just the start
    The virtuous upward spiral of New Tech is in early days.

    Steve Mollenkopf

    Sure, so I if could it from here and I said the next step will be linking Wi-Fi to cellular and you're seeing that even upstream of when people talk about accelerated 5G or 4G the 4G/5G combo. But we see that as something that operators are using as a means to essentially get bandwidth in the unlicensed band to help augment their business so they have tremendous desire to deliver wireless video of them to the consumers. And then the next step is really people trying to figure out how can I do video distribution and you see that a lot of in the United States, you see that with a lot of the activities that are going to planned around the winter Olympics in Korea and you tend to see a big push there. That is actually providing some pressure on the longer term schedule for 5G, people are asking us to pull it forward which of course we're engaged in all of these activities and we think that's a good strategy. What is the net effect, the net effect of that is that it will be a little bit earlier in time and we think it will be even more leveraged from 4G then perhaps we would have answered a year ago, and so we love when technology changes like that particularly on the modem side and that's a good trend

    Sentiment: Strong Buy

  • Unidentified Analyst

    One of your DRAM competitors is doing the 1x node at this point, and they, I believe, gave a presentation a couple of weeks ago talking about using EUV for their next 1x node. Can you talk about what your EUV plans are?

    Mark Durcan

    Yeah. We will actually install our first EUV tool late this year. So, we've obviously, we've been doing work with EUV through various consortia in both Albany and Imec for over a decade now. We will have a tool in our own R&D fab, but I think that's indicative of the fact, but we still think it's a ways out before it will be a value-add for us in manufacturing.

    Primary concerns would be not only around the detectivity activity, but also around the tool up time. So if you can't know that you got the tool available, then you have to have multiple tools in order to guarantee you've got the availability to keep the manufacturing line running. So that's got to get fixed or certainly further improved before we would head that direction.

    I think early implementation would likely happen for isolated contact layers because we've all got big install basis for double, triple and quadruple patterning at this point. And so the place you would actually think about using an EUV tool would be for maybe one or two additive layers where you could potentially get some significant benefit versus that multiple patterning methodology

    Sentiment: Strong Buy

  • Sort of the third area that I guess I'd highlight would be in this whole area of advanced packaging, which is really a key enabler of those memory subsystems that I...

    Harlan Sur


    Mark Durcan

    ...talked about a moment ago. A lot of interesting new packaging technologies that drive form factor but also performance for things like hybrid memory cube, where you want to get that controller on a high-density memory stack through silicon [indiscernible], but also other new thinning and capsulation technologies that can drive value-added performance for the customers.

    Sentiment: Strong Buy

  • Beyond that, we'll be deploying our 110 Series or our 1X DRAM nodes later this year in both Hiroshima and Taiwan, and we look forward to a gen-2 NAND technology rolling out later in the year. So we're very excited about all the new technologies we're creating and getting those into manufacturing and using them to drive forward the company and the company's financial performance.

    Sentiment: Strong Buy

  • The PC must become a SBC like a handful are making. Like Raspberry.
    The PC guys refuse to smell the coffee.
    Keep drinking the 20th HDD hotbox PC Kool-Aid.
    A units/layers/bits bonanza.

    Windows 10 plus Raspberry Pi: Now they work together for wireless 3D printing

    Microsoft's new app lets you send jobs via Raspberry Pi to your 3D printer over Wi-Fi, even if the printer doesn't support wireless.

    Sentiment: Strong Buy