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Taiwan Semiconductor Manufacturing Company Limited Message Board

jamulmike 382 posts  |  Last Activity: Feb 11, 2016 12:40 PM Member since: Oct 10, 2011
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  • shills screaming the sky is falling because 20th Tech is being massively disrupted by 21st Tech* is totally bogus. The cave dwelling flat earthers just eat it up.
    However,...
    This is just the start.
    (Cymer)ASML.

    Don Zerio, Linear Technology Corporation - CFO [50]

    --------------------------------------------------------------------------------

    This market is kind of fits and starts. It stayed the same as a percentage but it did obviously grow in absolute dollars. And for us the part of the communications particularly when you look towards the wireless portion isn't in the base station type of area. Really the sort of the non-wired or non wireless portion is really where the growth that we are seeing, sort of the networking. Optical is coming back to life. We were seeing as these optical applications go from 40 G to 100 G to 200 G to 400 G, there's some really tough problems that our customers need to solve and that particular market part of the market looks pretty good. There's some performance issues. There's some very tight space constraints that they have to deal with. And so the sort of optical part of the business looks pretty decent.

    *21st SSS gadgets en fuego as 20th HDD hotboxes continue to "fall off a cliff" just like CD and DVD platters.

    Sentiment: Strong Buy

  • Brick n Mortar needs beacons and interactive kiosks.
    Smart street luminaires.
    Just the start.
    (Cymer)ASML.

    Qualcomm's New Snapdragon X16 LTE Modem Delivers Gigabit LTE And A Scalable Architecture

    Patrick Moorhead,Contributor

    Forbes | 2016-02-11

    has been the global unit and revenue market share leader for years in modem technologies used in smartphones, tablets, PCs and IoT (Internet of Things). One of the reasons they have maintained this lead for so long is that they are typically first to market with new generations of modems. Today at their investor conference, they announced their latest and greatest LTE modem capable of gigabit-class speeds, specifically 1 Gbps, which translates to “Category (Cat.) 16” LTE according to the 3GPP standards. This is also the first modem that fits into the class of ‘LTE Advanced Pro’, which is the next step in LTE modem technologies and is a move towards the 5G future with gigabit-class connectivity. This new modem also brings a lot of industry firsts, even for Qualcomm, which include the first Cat. 16 LTE modem, the first LTE Advanced Pro modem, the first modem to support LAA (Licensed-Assisted Access) and the first discrete modem built on the 14nm FinFET process as well as a new modem architecture.

    Why we need faster modems

    The need for faster modem speeds is driven by “data density”. The growth of media consumption and content creation has driven the need for a gigabit class LTE modem. The resolutions of the phone and tablet displays have now reached beyond 1080P or 2K resolution compared to 480P in phones like the Galaxy S2 from five years ago. Over the past five years, these same phones have seen their cameras’ capabilities increase drastically from 5 megapixel photos and 720P video to 16 megapixel photos and 4K video. Just in terms of video alone, this means an 8x increase of resolutions and approximately the same amount of data usage. These increased resolutions have driven users to desire more and more download and

    Sentiment: Strong Buy

  • Innovation speeds up.
    Innovators don't get the shill Armageddon memo.
    Here, history DOES repeat.
    (Cymer)ASML.

    Qualcomm rolls out new Snapdragon trio and wearable platform

    Qualcomm updated its Snapdragon processor lineup for smartphones and its wearable platform for a bevy of emerging devices.

    Larry Dignan

    ZDNet



    Qualcomm on Thursday launched three Snapdragon processors designed to bolster camera, video and gaming in smartphones. The company also rolled out the Snapdragon Wear 2100 system on a chip for new wearable devices.

    The trio of Snapdragon chips include the 625, 435 and 425 and the aim is to support LTE, new connectivity standards like 802.11ac and the latest camera image sensors. There's also tools to connect to sensors as well as quick charging technology.

    According to Qualcomm, the 625 is the highest end of the trio and supports latest LTE speed as well as high resolution cameras. The 425 is the entry level chip with the 435 falling in the middle.

    Snapdragon Wear is a platform that aims to power the latest Android Wear watches and expand from there. Snapdragon Wear includes processor, software, support and reference designs to target everything from health trackers to fashion to mobile devices.

    The Snapdragon Wear 2100 is 30 percent smaller than the Snapdragon 400 has 25 percent less power and enables more sensors.

    Sentiment: Strong Buy

  • Cisco guy on c(low)nbc.
    Chips are NO longer for propeller heads in IT.
    It IS the very fabric of doing anything.
    And,...
    This is just the start.
    (Cymer)ASML.

    Sentiment: Strong Buy

  • Remember?
    the shills and their sponsored "experts"?
    14nm was too expensive.
    Hogwash.
    Way cheaper dirt 10nm. Soon.
    (Cymer)ASML.

    Highlights:
    •Synopsys' 10 Gbps DesignWare USB 3.1 controller and PHY passed all protocol, electrical and interoperability tests to become the first IP to achieve USB-IF certification
    •DesignWare USB 3.1 PHYs consume less than 50 mW power at 10 Gbps speeds in 14/16-nm FinFET process technologies
    •DesignWare USB 3.1 Host, Device and Dual-Role Device Controllers are backward-compatible with DesignWare USB 3.0 software stacks and device class protocols, enabling designers to reuse code and save months of software development time
    •Complete USB 3.1 solution, including, controllers, PHYs, verification IP, IP subsystems, IP prototyping kits and IP software development kits reduce the time and effort of integrating the IP into SoCs

    Sentiment: Strong Buy

  • jamulmike by jamulmike Feb 10, 2016 11:34 AM Flag

    In the euro cnbc interview, CEO said units soared as things chip stuffed continue to soar.
    (Cymer)ASML.

    LONDON (Reuters) - Britain's ARM Holdings (ARM.L) said more than half of all smartphones shipped in the
    fourth quarter contained its most powerful processor technology, helping it grow revenue even as demand cools in markets such as China.

    The company's v8 architecture, which analysts say commands 30 percent higher royalties than its forerunner, has filtered down from devices like Apple's (AAPL.O) iPhone at the beginning of the year to become the industry standard.

    Chief Financial Officer Chris Kennedy said that a 14 percent rise in revenue in the fourth quarter, ahead of expectations, was driven by strong royalties.

    Processor royalty revenues rose 24 percent, defying a 3 percent drop in industry revenue for chips in smartphones, although they were boosted by a $9 million late payment.

    "We expect chips based on our latest version 8 technology will continue to replace older ARM technology in mobile markets, and gain share in networking infrastructure and servers," Kennedy said.

    "It will end up in every phone, even down in the low end."

    Sentiment: Strong Buy

  • I heard ARM CEO interview. Though Fone unit growth slowing, bit intensity growing.
    Said chips stuffed in Everything(y).
    Hmmm...
    Where has that been said before?
    (Cymer)ASML.

    Computing power in cars will jump 100-fold by 2020, Segars predicted. Each car will then have an average of $150 of silicon chips, or at least seven times as much as the average smartphone.

    Sentiment: Strong Buy

  • It now sits at 25% of recent highs.
    Why?
    traitor paper demand for every commodity. Another pump n dump bubble burst.
    Container ship mania on vapor demand.
    In other words?
    same old krapp.
    different day.
    cesspool.
    with the best government money can buy,

    Baltic Dry Index Down in the Dumps

    The Baltic Dry Index has fell below 300 points, plunging to a new low of 298 points on Thursday, February 4

  • Last October, Qualcomm started sampling its first batch of 24-core data center chips to tier-1 data centers. At the time, it didn't seem like Qualcomm's server chips could threaten Intel, which controls over 99% of the data center market. But in January, Qualcomm formed a joint venture in China to design, develop, and manufacture chips for Chinese servers -- showing that it was getting serious about stepping on Intel's toes.

    But looking ahead, Qualcomm's data center business could soon gain its biggest ever backer -- Alphabet's Google. According to a recent Bloomberg report, Google is expected to publicly back Qualcomm's data center chips at an upcoming investor event. Qualcomm and Google previously collaborated on the chip designs, and Google reportedly pledged to back Qualcomm if the processors met certain performance goals.

    Google orders as many as 300,000 processors every quarter for its servers, making it the third largest buyer of data center processors on the planet. Those orders account for over 5% of all processor shipments worldwide according to IDC. Let's take a closer look at how much Google's support could help Qualcomm, and how deeply that partnership could wound Intel.

    What's in it for Google?
    The growth of data-hungry web and computing services caused Google's equipment costs to nearly triple since 2011. By partnering with Qualcomm, Google could reduce those expenses by securing more favorable prices for data center chips. That partnership might force Intel to lower its prices, which would make it cheaper for Google to expand its data centers with either company's processors.

    Since Google writes its own software, it can optimize its systems for Qualcomm's ARM-based processors more easily than large businesses which use third-party software designed for Intel's x86 processors.

    Sentiment: Strong Buy

  • Server installs are simply exploding.
    Facebook disrupted it. MicroSoft putting servers underwater for cooling and more.
    96-layer SSS. Soon.
    400G. Soon.
    5G Mobile.
    This is going to be an Intel/ARM units/layers/bits bonanza. For a decade or more.
    And,...
    This IS just the start.
    (Cymer)ASML.

    Vicor Is Helping Intel In Its Fight Against The Low Power ARM Processor

    Summary

    •Vicor provides a novel power saving architecture for Intel processors.

    •Vicor's solution helps Intel in its battle against the low-power ARM processor.

    •Vicor's CHIP and SIP products are used in data centers to power Intel processors and save energy.

    Vicor (NASDAQ:VICR) is providing solutions that help Intel (NASDAQ:INTC) compete against ARM in the battle for data center processors. The issue facing Intel is the perception that ARM chips use less power. Vicor provides an efficient power train that supplies power to the Intel processors that are used in the data center. This power train reduces the total amount of energy used in a server.

    The stakes are huge for Intel, as Intel has 99% of the data center's shipment share and 80% of the revenue.

    The manufacturers of ARM chips and systems are doing everything they can to get a piece of that business. ARM was successful in the mobile market because of their low energy use. Vendors are now trying to take that same concept to provide a lower power chip to compete with Intel in the data center.

    Andrew Feldman, corporate VP of AMD (NASDAQ:AMD), said the energy-sipping ARM design is the architecture of the future. At the Open Compute Summit in January, he said: "By 2019, ARM will command 25% of the server market," and custom ARM CPUs "will be the norm for mega-datacenters," such as those used by Facebook, Microsoft, Google, and Amazon. And ARM expects a 20% market share by 2020.

    ARM vendors are looking at other solutions to reduce power including pairing an ARM processor with a FPGA. So Intel bought Altera to bring FPGA technology into their ser

    Sentiment: Strong Buy

  • The Fone guys need to pick up the pace.
    All Silicon Solution Stick PCs inserted in dumb Fones? Monitors? TVs? Everything(y)?
    The IoE Age is here. NOW!
    Just the start.
    (Cymer)ASML.

    Worldwide wearable devices sales to grow 18.4% in 2016, says Gartner

    Press release; Jessie Shen, DIGITIMES [Friday 5 February 2016]

    Gartner has forecast that 274.6 million wearable electronic devices will be sold worldwide in 2016, an increase of 18.4% from 232 million units in 2015. Sales of wearable electronic devices will generate revenues of US$28.7 billion in 2016. Of that, US$11.5 billion will be from smartwatches.

    "From 2015 through 2017, smartwatch adoption will see 48% growth largely due to Apple popularizing wearables as a lifestyle trend. Smartwatches have the greatest revenue potential among all wearables through 2019, reaching US$17.5 billion," said Angela McIntyre, research director at Gartner. "Though the sales of smartwatches are the one of the strongest types of wearables, their adoption will remain much below sales of smartphones. For example, in 2016 more than 374 million smartphones will sell in mature market countries and in large urban areas of emerging market countries, for example, in Hong Kong and Singapore."

    Fitness wearables, which include wristbands, smart garments, chest straps, sports watches and other fitness monitors, continue to increase in popularity, driven in some part by US wellness programs.

    Sentiment: Strong Buy

  • 2015 was a very good year for our advanced packaging lithography model. We set an internal record of orders in the OSAT space. The AP300 model is the standard for volume production and copper pillar and fan-out processes at virtually all the OSATs. We expect that these applications will continue to grow, requiring additional 1X steppers for the next several years.

    Sentiment: Strong Buy

  • 2015 was a difficult year for Ultratech, where our major semiconductor served market, logic devices were expensive to produce with limited capacity expansion for the sub-20-nanometer FinFET devices. It have been expected that the 14-nanometer, 16-nanometer FinFET device node would be widely used. However, transistor cost combined with less-than-expected yields resulted in the expansion of the 28-nanometer planar logic devices. The 28-nanometer node has been one of the largest nodes in recent history. Now, many major logic chip foundries are moving very rapidly to the 10-nanometer and 7-nanometer node, which is hoped to drive down transistor cost.

    Sentiment: Strong Buy

  • Second, our linear amplifiers and drivers continue to take share. Specifically, the adoption of our multi 100-Gigabit linear drivers continues to drive our business growth.

    Our linear driver business revenue ended up 2.3 times larger compared to one year ago, growing much faster than Infonetics' forecasted underlying market growth of 50%. This market share expansion is happening at an accelerated pace relative to our expectations even six months ago.

    Sentiment: Strong Buy

  • 400G. Soon.
    All Silicon Solution. Soon.
    (Cymer)ASML.

    The decline in our datacom business over the past couple of quarters was the result of the lower speed market having become overly competitive and customers at 40G slowing their consumption in anticipation of 100G. We are now at a point where we expect growth in our 100G products to more than offset declines in our lower speed products.

    Sentiment: Strong Buy

  • (Cymer)ASML's success is based on the leading edge.
    shills screaming about the lagging edge and 20th Tech is pure contort n distort BeeS.
    Facts.
    (Cymer)ASML.

    Since our last conference call, demand for our Optical Communication products has gotten stronger. Demand from China and our customers supplying into North America metro builds is particularly strong. The investments we made in industry-leading products, including 100G components and modules, amplifier and pump lasers, and ROADMs position us very well.

    Sentiment: Strong Buy

  • "as the market shifts from 4G LTE to LTE-A, LTE-Pro and eventually 5G."

    Nothing screams All Silicon Solution like 5G.
    An units/layers/bits bonanza.
    An EUV/ArF bonanza.
    (Cymer)ASML.

    In IDP, December was an exceptionally strong design win quarter. Here's some of the highlights. We captured multiple key design wins for macro and small cell base station applications. We believe network capacity constraints will accelerate the adoption of small cell base stations and massive MIMO active antennas. Massive MIMO active antenna systems are driving a 10x increase in RF content in next-generation base stations. We continue to work on capturing new design wins as the market shifts from 4G LTE to LTE-A, LTE-Pro and eventually 5G.

    At this year's Consumer Electronics Show, we supplied a suite of critical microwave components for a 5G massive MIMO demonstration performed by a leading base station OEM. The demo featured Qorvo phase shifters, power amplifiers and switches. We also expanded our presence in the connected home with key design wins in gateways and access points, highlighted by our design wins in flagship products at both NETGEAR and LINKSYS. We continue to believe that the rapidly increasing number of connected devices represented by the Internet of Things will be IDP's largest growth engine.

    Sentiment: Strong Buy

  • the yahoos: "This topic is deleted"

    Smart Everything(y).
    (Cymer)ASML.

    Sentiment: Strong Buy

  • Apple might be the only guy making money on Fones.
    We already knew everybody but Apple and Samsung were making money before. Samsung's slim profit may have evaporated.
    The 21st gadget biz is brutal.
    Remember?
    Cymer lights don't make ASPs/profits/margins.
    They make units/layers/bits with, by far, the greatest uptime/throughput/yield very precisely.
    ASML.

    LG confirms it will reveal the G5 smartphone on February 21st

    We're hearing a lot of really interesting things about what LG has planned for its next major Android phone. The G5 is rumored to be a major departure from the G4 and its predecessors, with a design that likes "nothing like" those phones and an "accessory slot," the exact purpose of which no one seems to be sure — yet. But at least the wait is getting shorter; today LG confirmed via Twitter that the G5 is indeed coming at its Mobile World Congress keynote on February 21st. Along with the tweet are several photos taken in New York City, each with the number 5 as its subject.
    After introducing last year's G4, LG returned later in 2015 with the V10, which added a steel frame, impressive manual video controls, hi-fi audio, and other new features. LG may be bleeding money as it tries time and time again to build a hit Android smartphone, but every indication says that the G5 will be the company's boldest attempt yet. We'll be live at the company's big press conference later this month, so check back for all of The Verge's Mobile World Congress coverage..

    Sentiment: Strong Buy

  • For back-end advanced packaging business remained healthy as it was essentially flat with September. Furthermore, we anticipate that March will be a record revenue quarter for us in advanced packaging applications as the design wins we have accumulated over the past three years are now beginning to be put into manufacturing lines like TMSC’s info line.

    I remind you that for back-end advanced packaging, we count 25 customers and 29 different tool platforms in the win column and we are working to capture more customers and more tool types as we believe that the back-end will present more opportunities for us in the coming year.

    Sentiment: Strong Buy

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