SANTA CLARA, Calif. -- Successful technology will be invisible, ARM CEO Simon Segars said in his keynote address at ARM TechCon here. While the physical size of silicon is ever shrinking, connectivity, performance, and efficiency need to be even less visible to consumers.
"We're going to see more and more connected devices with more and more powerful embedded processers within them, with really sophisticated software," he said. "We should take it upon ourselves to make sure that we continue to do a great job of hiding away the complexity, hiding these components and what they do… so we continue to get a great adoption rate."
Manufacturers must create abstractions, such as software-defined networks, to allow quicker development of hardware and services. Increased abstraction will reduce complexity and deliver more efficient systems, which will aid in the development of compelling consumer applications.
Segars said the approach will be increasingly important as the Internet of Things expands. He cited ARM's mbed platform as one of the ways the company is involved in integrated development. For its part, ARM announced new tools such as Power Grid Architect for easing the task of creating power grids on SoCs built with emerging 3D transistors called FinFETs.
In addition, ARM expanded its partnership with TSMC to include work on 10nm processes. Previous collaborations showed better-than-expected results on 16nm FinFETs using ARM Cortex-A53 and A57 cores as test vehicles.
A collaboration with Synopsys also has borne fruit, Segars said. ARM and Synopsys are creating advanced chips based on ARM V8 cores built using FinFETs.
"If we can optimize processes for our processors, everyone will get a better result," Segars said. "If we do that right, I think we're going to enable all sorts of new products. We've got some more work to do on all these technologies to get that experience right."
Eric Lin, DIGITIMES Research, Taipei [Friday 3 October 2014]
ARM's Mali is expected to become the mainstream GPU architecture for China-based application processors (APs) in the second half of 2014 in terms of market share, surpassing Imagination significantly. However, in the high-end segment, Mali's share will be slightly weaker than that of Qualcomm's GPU architecture due to Qualcomm's advantages in chip design, but will still perform better than Imagination's solution.
Among the solutions, Nvidia's GPU architecture has the best performance and its latest GPU core is able to deliver strong performance with low power consumption. Although Nvidia only has limited clients, its shipment growth in 2014 is expected to be better than in previous years, according to figures from Digitimes Research.
Vivante has been losing clients and only has two clients in the second half of 2014. The company's market share is also expected to decline in 2014.
High definition (HD) mobile has become the main marketing point for mobile devices and even products in different price segments are all heading toward the same development direction: When increasing resolution on mobile devices, in addition to optimizing multimedia applications, developers also need to satisfy demand for 3D gaming applications, which have been appearing rapidly.
After experiencing fierce price competition, China's mobile device market started looking for ways to recover and strengthening multimedia applications and releasing high-end HD products have become a new strategy.
The GPU is a key component for handling multimedia applications and each GPU solution has its own unique advantages in the balance between technology and costs. GPU solution providers' marketing is also greatly influencing their market shares. Currently, ARM is mainly expanding its market base using its pricing advantages. After gaining the upper hand in the ecosystem, the company is expected to gradually enter into the high-end territory to further stabilize its market position to help edge out its competitors.
The ex-dividend date, also known as the reinvestment date, is an investment term involving the timing of payment of dividends on stocks of corporations, income trusts, and other financial holdings, both publicly and privately held. For sales before this date, the dividend belongs to the new owner; for sales on or after the date, the seller is entitled to the dividend.
September 9, 2014
Lattice and Cypress Team Up to Simplify USB 3.0 Video Bridge Designs With New Development Kit
Kit Offers Complete HD Video Reference Design Based on the LatticeECP3 FPGA and the Cypress FX3 USB 3.0 Peripheral Controller; Demonstrations at IDF 2014
SAN FRANCISCO, CA -- (Marketwired) -- 09/09/14 -- Lattice Semiconductor Corporation (NASDAQ: LSCC) and Cypress Semiconductor Corp. (NASDAQ: CY) today introduced at the Intel Developer Forum (IDF) a low-cost development kit that provides a complete reference design for USB 3.0-enabled video bridges. The new Lattice USB 3.0 Video Bridge Development Kit simplifies integration of USB 3.0 audio and High-Definition (HD) video connectivity for a wide range of applications, leveraging the LatticeECP3™ FPGA family and the Cypress EZ-USB® FX3™ USB 3.0 peripheral controller. Cypress and Lattice will demonstrate the kit at IDF in Cypress booth number 780 from September 9-11.
USB 3.0 delivers 5-Gbps bandwidth that enables streaming of HD video without requiring compression, which degrades image quality. The Lattice USB 3.0 Video Bridge Development Kit includes all of the hardware and software needed to develop USB 3.0 cameras, frame grabbers, machine vision systems, surveillance equipment, and other audio/video USB 3.0 converter systems. With the LatticeECP3 FPGA, the kit supports high speed reception and packing of video and audio data into USB 3.0 UVC and UAC data frames without the use of external memory buffers. The kit leverages the flexibility of the FX3 solution to support parallel, MIPI CSI-2, and LVDS camera interfacing, as well as HDMI and SDI audio/video formats. The kit is available now for purchase at the Lattice store.
"This new Lattice video bridge solution offers a complete reference design that will help designers get top-performance HD video products to market faster," said Mark #$%$, senior marketing director of the USB 3.0 Business Unit at Cypress.
-----------------------------------------September 10, 2014 // Graham Prophet
Lattice offers packaged design for power functions in USB 3.1 Type-C connectors
Lattice says it can provide the fastest time-to-market for manufacturers, with the first programmable USB 3.1 Type-C solution; it is offering adrop-in design for the power delivery functions, promising a faster end-product than awaiting the availability of dedicated ICs.
The design is for a USB 3.1 Type-C power delivery solution to help you develop USB 3.1 Type-C connectors and quickly get them to market, and that addresses all the critical power-related functions required by the recently-finalised USB 3.1 Type-C specification, which defines very small jacks well suited to smartphones, tablets, and other mobile devices.
“The considerable advantages of USB 3.1 Type-C connectors make them a lucrative market opportunity for manufacturers, and our solution enables them to get a 'first mover' advantage,” said Keith Bladen, Marketing Vice President at Lattice. “Manufacturers can immediately take advantage of our solution and its proven silicon to begin developing their connectors, rather than lose precious time waiting for ASSPs to fully implement the specification.”
The core of Lattice’s solution is the company’s highly successful iCE40 devices, which are suited to this application with a combination of programmability, low power and small size. USB 3.1 Type-C power delivery is the latest addition to the company’s portfolio of USB 3 and 3.1 solutions.
The purpose of posting about Monroe Hospital has nothing to do with me being either long or short.
It is about a finalization of the Monroe "problem" that has been a hindrance to positive stock movement.
FYI: Owning over 38k shares of the stock @avg. of 10.86 with a 10 year time horizon makes me a lot of things - BUT - being SHORT is not one of them.
I'm the relic in the "buy and hold" camp.
Small Hospital Files for Bankruptcy with Eye-Popping Debt
Monday, August 04, 2014
In normal circumstances, this wouldn't be a bankruptcy filing that would make the headlines. After all, as California bankruptcy attorneys have seen, hospitals and healthcare facilities have not been immune from the bankruptcy crisis sweeping in the country. However, in this case, a small hospital that filed for bankruptcy recently has registered a staggering amount of debt, raising eyebrows. The Monroe Hospital in Bloomington, Indiana recently filed for bankruptcy, and stated that it has $134 million worth of debt.
This is a really small hospital with only 32-beds. An average of eight patients is treated at the hospital, but according to officials, the hospital currently owes approximately $121 million to a real estate investment trust. The hospital has 315 workers, and operates on land owned by Medical Properties Trust Inc., which also happens to have lent a loan to the hospital.
That kind of debt for any company filing for bankruptcy is highly unusual. By any standards, this is an enormous amount of debt, considering the size of the hospital. According to the details furnished in the documentation filed with the court, approximately $53.4 million of the debt is related to unpaid rent, and other obligations. Approximately $35.7 million involves loan repayment to Medical Properties Trust Inc. The remainder of the debt is related to fees, interest as well as other outstanding financial commitments. More details on the bankruptcy filing have not yet been made available, and therefore, it's hard to tell how the hospital managed to accumulate that much debt.
Bankruptcy lawyers for the hospital are currently working on the sale of the hospital to a California-based healthcare chain. Prime Healthcare Services currently operates 27 hospitals across the country, and is in line to buy out Monroe Hospital.
Read more: http://www.businessbankruptcylosangeles.com/business-bankruptcy-blog/general-motors-to-seek-bankruptcy-protection#ixzz3C4a2YvdH
Momentum Builds for the Next Generation of ARM Processors
6 hours ago
CAMBRIDGE, England--(BUSINESS WIRE)--
ARM® is celebrating the signing of the 50th licensing agreement for its ARMv8-A technology, which includes support for 64-bit computing. A total of 27 companies have signed agreements for the company’s ARMv8-A technology as industry momentum builds for greater compute capability across a wide range of applications. The ARMv8-A silicon partners include:
• All of the top 10 companies who sell application processors for smartphones
• 9 of the top 10 application processor companies for tablets
• 4 of the top 5 companies that provide chips for consumer electronics (including DTV and STB)
• 4 of the top 5 companies that provide chips for enterprise networking and servers
• 8 silicon vendors from Greater China
The 50th licensing agreement demonstrates the continuing strength in demand for the company’s 64-bit-capable ARMCortex®-A50 processor family and ARMv8 architecture licenses which will serve future digital devices and infrastructure deployments coping with more complex applications within strict power budgets.
“ARMv8-A technology brings multiple benefits, including 64-bit capability alongside improved efficiency of existing 32-bit applications,” said Noel Hurley, general manager, processor division, ARM. “Tablets and smartphones are quickly replacing PCs for many tasks and the ARMv8-A Cortex-A57 and Cortex-A53-based chips developed by our Partners support this transition with important enhancements in performance and efficiency. These ARMv8-A platforms are also fully backward compatible and will efficiently execute over a million 32-bit apps and extensive software assets already in use.”
The company began developing its ARMv8-A architecture design in 2007 as it foresaw the need for more powerful and energy efficient processors. First announced in November 2011, the cumulative 50 licenses are now spread across ARMv8-A architecture and ARM Cortex-A57 and Cortex-A53 processors. This is ensuring a vibrant and diverse roadmap for a new range of mobile and connected devices and infrastructure equipment.
ARM has signed more than 1100 license agreements for its processor designs and is working with around 350 international firms producing silicon chips for a range of devices from sensors to servers. The company announced recently that the 50 billionth chip containing an ARM processor had been shipped by partners and the momentum in 64-bit ARM architecture is a key component in the journey toward the next 100 billion chips.
You may be right.
However, owning an ARM Architectural license and the services that will be utilized running on energy efficient servers in cloud computing will be the game changers.
Think energy efficiency - multiple IP platforms - personalization of devices and heterogeneous LTE-Advanced. networks by telcom carriers.
Read the roadmaps and draw your own conclusions.
Cost-Effective SONOS Embedded Nonvolatile Memory Delivers High-Yield, Scalable Process
For Next-Generation Smart Cards and Internet of Things Applications
SAN JOSE, Calif., and SHANGHAI, China, August 25, 2014 – Cypress Semiconductor Corp. (NASDAQ: CY), a leading provider of embedded nonvolatile memory solutions, and Shanghai Huali Microelectronics Corporation (HLMC), one of the most advanced pure play wafer foundries in China, today announced the companies have developed functioning silicon cells using Cypress’s SONOS (Silicon Oxide Nitride Oxide Silicon) embedded Flash memory intellectual property (IP) at the 55-nanometer process technology node. The silicon cells are designed for smartcards and Internet of Things (IoT) applications. Cypress SONOS delivers low wafer and die costs with unmatched scalability for future development. The technology and design IP will be available for high-volume manufacturing by HLMC customers in the second half of 2015.
HLMC licensed Cypress’s 55-nanometer SONOS embedded nonvolatile memory (NVM) process in January 2014. The technology provides significant advantages over other embedded NVM offerings. SONOS only requires three mask layers to insert it into a standard CMOS process compared with the nine to twelve additional masks generally needed for other embedded Flash technologies. This mask reduction results in lower manufacturing costs. SONOS does not alter standard device characteristics or models when it is added to baseline CMOS process, preserving existing design IP. SONOS delivers intrinsically high yields and best-in-class reliability, 10 years of data retention, 100,000 program/erase endurance cycles, and robust resistance to soft errors. Cypress has demonstrated the ability to scale SONOS to 40-nm and 28-nm nodes, expediting future IP development.
“We are pleased to achieve this milestone with Cypress’s 55-nm SONOS, as it marks a significant step in bringing the benefits of the technology to our customers,” said Jack Qi Shu, Vice President at HLMC. “SONOS is a cost-effective process that delivers proven high yields. Its reliability and efficiency are key for high-volume Internet of Things applications and smartcards.”
“Achieving working 55-nm SONOS silicon cells with HLMC is a testament to the technology’s scalability and ease-of-design and to HLMC’s manufacturing expertise,” said Sam Geha, Vice President of the Technology and Intellectual Property Business Unit at Cypress. “The low cost, high performance and reliability of SONOS are ideal for the rapidly growing smartcard and Internet of Things markets, as well as for bank cards, wearable electronics and other logic-dominated products. Cypress will continue to work with leaders such as HLMC to make SONOS the industry’s embedded nonvolatile memory platform of choice.”
About Shanghai Huali Microelectronics
Founded in January, 2010 at Shanghai Zhangjiang Hi-tech Park, Shanghai Huali Microelectronics Corporation (“HLMC”) is one of the most advanced pure-play wafer foundries in mainland China. HLMC owns a 300mm fab with maximum full capacity of 35000 wafers per month. HLMC’s process technologies start from 55nm technology node and mainly cover 55nm LP, 40nm LP, 55nm HV, 55nm e-Flash and specialty technologies for a wide range of applications. HLMC is devoted to providing domestic and overseas customers with comprehensive foundry solutions and value-added services
I'm only 78 so I'll have to defer to your age of reason.
I was the guy dumb enough to BUY into ARMH(Y) IN 2002 and dollar cost average in monthly for 10 years, making 5 major swing trades in that time frame, which resulted in a share count of 775k @ avg. price of 10.48, which I will begin selling in January 2015 in the same order I purchased only in reverse.
The reason I mention ARMH is that the companies RISC cores will play mightily into the future success of CY.
This will become abundantly clear to all by the end of 2017.
Though I could be wrong, being a "rookie" and all.
P.S. - the money coming out of ARMH will be invested in MSFT , which will be the first $ 2.5 Trillion market cap stock by 2023.
You can keep score as to how I'll be doing.
Just keep thinking energy efficiency and watch what happens.
Smartwatches and Smart Bands Dominate Fast-Growing Wearables Market
Wearables Shipments to Hit 22 Million in 2014 up 129% from 2013
By 2018 over 250 million smart wearables will be in use, 14 times more than in 2013
Shipments of smart wearables are expected to grow from 9.7 million in 2013 to 135 million in 2018, according to CCS Insight's new global forecast. The forecast predicts that wrist-worn devices will account for 87% of wearables to be shipped in 2018 — comprising 68 million smartwatches and 50 million smart bands with no screen or with a minimal, one-line display.
Quantified self devices, which track fitness and well-being, are the fastest-growing category. CCS Insight believes this can be attributed to their clear purpose, user benefits and increasingly affordable prices. Commenting, Marina Koytcheva, CCS Insight's Director of Forecasting says, "Wearables are poised to be the perfect gift for the person who has everything this Christmas. We believe this will fuel strong growth in the final quarter of 2014 for smart bands, particularly fitness trackers, which will account for more than half of the 35 million wearables in use at end of 2014."
However, Koytcheva cautions, "the wearables market is in its Stone Age right now. There needs to be huge improvements to broaden their appeal. This is particularly acute when it comes to devices for women: wearables need to quickly move on from black, clunky devices; fortunately we're starting to see the first steps in this direction."
CCS Insight's forecast also foresees strong future growth in smartwatches. The company expects many smart band manufacturers to extend their product ranges by adding devices with screens. As smartwatches broaden their appeal, capabilities are refined, new functions are added and prices fall, CCS Insight expects smartwatches to displace fitness bands and become the most used form of wearables.
North America currently leads the way in terms of adoption of wearables: 5.2 million wearables were sold in North America in 2013, and over 40% of all wearable devices currently in use are there. This is partially because many wearable companies are based in North America, but also because the region has proven eager to adopt new technology: a good example of this is tablets. But Western Europe is catching up and from 2016 is expected to buy more wearables than North America. Adoption will be slower in emerging markets and primarily driven by tech-savvy, affluent users.
A smart wearable category that will become much more prominent in the second half of 2014 is stand-alone cellular wearables. We expect a number of high-profile devices with their own SIM cards will be announced in the coming months. However, these devices will face significant challenges as people are reluctant to take out another contract with their mobile operator.
Reflecting more broadly on the wearables opportunity Koytcheva notes "The market is still in a chaotic stage of development, and there's still a huge amount of uncertainty. Every category faces different risks: the way people use wearables is still changing, one type of device could kill sales in another category, people are unsure whether some wearables are socially acceptable, and intellectual property rights are a minefield for the dozens of start-ups entering the wearables market.
As Koytcheva points outs, "The market could be changed beyond recognition if a major player like Apple decides to get into the game. History shows us that when Apple enters a market it can reshape the way people think about a product."
These insights come from CCS Insight's latest wearables forecast; the research predicts trends at a global level. To take into account the uncertainties inherent in a fast-growing market, CCS Insight has adopted a scenario-based approach to its wearables forecast. This offers not only a view on the most likely outcome but also high and low forecast scenarios for each of the four categories of device covered.
Lose the CAPS.
Listen, MPW is a buy at any price where the market cap is below $ 3B.
This is a nice long term hold for those who are looking for a nice dividend return.
Forget about short term trading, this is not that type of stock.
SLIM® Sensor Technology Enables Low-Cost Smartphones with Ultra-Thin Form Factors
SAN JOSE, Calif., August 18, 2014 – Cypress Semiconductor Corp. (NASDAQ: CY) today announced that its TrueTouch® Gen4X touchscreen controller family now supports single-layer multi-touch sensors, which lower manufacturing costs without compromising performance. The Gen4X TMA445 controller enables thin form factors by leveraging Cypress’s Single-Layer Independent Multi-touch (SLIM®) sensor structures. The controller also adds support for Cypress’s industry-leading tracking of multiple fingers in gloves.
The TrueTouch Gen4X TMA445 controller delivers best-in-class accuracy and linearity for fingers of different sizes and gloves of various materials and thicknesses, including ski gloves. In addition, it automatically switches between glove and finger tracking without requiring the user to switch settings. Gen4X controllers provide industry-leading water tolerance and best-in-class immunity to electronic noise from aftermarket chargers and displays.
“Gen4X with SLIM delivers the industry’s best single-layer sensor performance,” said Yi Hang Wang, Director of TrueTouch Marketing for Cypress. “SLIM helps our customers create thin mobile devices at lower costs. This combination has helped the family quickly gain popularity in China and other cost-competitive markets. With the addition of our superior multi-finger tracking for users wearing gloves, Gen4X is upgrading the touchscreen user experience for mobile devices.”
Cypress’s TrueTouch Gen4X family delivers immunity to charger noise of up to 35V peak-to-peak (Vpp) from 1-500 kHz, with a 0.5-mm cover lens and a 9-mm-wide finger. With Cypress’s unique and patented DualSense™ technology to execute both self-capacitance and mutual-capacitance measurements in the same device, the family offers the industry’s best water rejection and wet finger tracking for seamless performance in real-world conditions, including the presence of rain, condensation, or sweat. The TrueTouch portfolio’s unique features are backed by an industry-leading portfolio of more than 100 capacitive touch sensing patents.
The Gen4X family is based on a 32-bit ARM® Cortex™ M-Core processor that is known for high-efficiency MIPS/mW. The TMA445 controller averages low power consumption of 12 mW in active mode and 15 uW in deep-sleep mode.
August 13, 2014
2014 rebound in smartcard MCUs begins next wave of growth as the economy improves and new applications emerge, including the Internet of Things and wearable systems.
The original system-on-chip (SoC) product category—microcontrollers—appears to be on the verge of another substantial growth cycle after losing momentum in the last three years due to economic uncertainty, a falloff in the smartcard MCU market, and price erosion following the IC market’s strong recovery in 2010 from the last recession. With the global economy stabilizing and promising modest growth in the next few years, microcontroller sales are now expected to increase 6% in 2014 to a new record high of $16.1 billion after being flat in 2013 and dropping 3% in 2012, according to IC Insights’ new Mid-Year Update to the 2014 McClean Report.
IC Insights is raising its growth forecast for microcontroller sales in 2014 from 3% previously due to steady improvements in overall MCU demand and a strong recovery in the smartcard market segment. Smartcard MCU sales fell 12% in 2013 but are now on track to grow 19% in 2014, based on the forecast in the new 250-page Mid-Year Update report. Overall MCU sales are forecast to strengthen in 2015 and 2016 with 7% and 9% increases, respectively, due to improvements in the global economy and the emergence of new applications, such as wearable systems and the build-out of the Internet of Things (IoT).
The 2014 Mid-Year Update shows worldwide MCU sales rising by a compound annual growth rate (CAGR) of 4.6% in the next five years, reaching nearly $19.1 billion in 2018 (Figure 1). The microcontroller market is projected to reach new record-high sales each year in the forecast period, with the exception of 2017, when the market is expected to dip by 1% due to the next anticipated economic slowdown.
Overall, an explosion of 32-bit microcontroller shipments is reshaping the market as suppliers aggressively promote more powerful MCU designs that are cost competitive with 8-bit and 16-bit devices. In some cases new 32-bit MCUs are being priced well under $1, in high-unit volumes, and below the cost of 8-bit microcontrollers. Between 2013 and 2018, total 32-bit MCU sales are expected to grow by a CAGR of 9.5%, reaching $11.0 billion in 2018. IC Insights’ Mid-Year Update shows 4/8-bit MCU sales falling by a CAGR of 1.3% to $3.7 billion in 2018 while 16-bit revenues will barely grow at an annual rate of 0.3%, remaining at $4.2 billion in five years.
Daniel Shen, Taipei; Steve Shen, DIGITIMES [Monday 28 July 2014]
In addition to initiating a massive lay-off, Microsoft also plans to discontinue Nokia's Asha-, Series 40- and X-series handset products as well as to rename the Lumia-series - moves which could eventually lead to the elimination of Nokia.
By implementing the biggest round of layoffs in Microsoft's history, 12,500 or 70% of the planned cuts are jobs related to Microsoft's acquisition of Nokia's Devices and Services business unit.
The sweeping layoffs come as no surprise. But what is surprising is that CEO Satya Nadella appears to have not agreed to the acquisition of Nokia launched by former CEO Steve Ballmer.
Although Microsoft has obtained the license to use the Nokia brand for 10 years, the planned suspension of Asha-, Series 40- and Nokia X-family products indicates that hardware devices launched by Microsoft in the future will not bear Nokia's brand name.
The ongoing restructuring also indicates that Nadella will not follow Ballmer's steps of integrating Microsoft's hardware and software business lines as Apple has done. Instead, Nadella believes that Microsoft should pursue its goal of innovating in both cloud and mobile software service segments.
To be sure, as Microsoft is adjusting back to its software and service core businesses, the hardware talent, technologies and patents it acquired from Nokia will no longer play a key role in Microsoft's future development, and the brand image Nokia enjoyed in emerging markets certainly will not help build up the image of Microsoft's hardware products.
The message is clear: Microsoft should strive to make it mobile device business a success in its own right, rather than rely on Nokia.