“Skyworks is off to a great start in fiscal 2014 as we exceeded guidance and delivered strong performance across all key financial and operational metrics,” said David J. Aldrich, president and chief executive officer of Skyworks. “We are capitalizing on unprecedented demand for wireless ubiquity and the Internet of Things. Specifically, Skyworks is empowering connectivity across a number of strategic applications including medical devices, wearable technologies, home automation and hybrid vehicles as well as smartphones and tablets, linking people, places and things to improve the way the world communicates.”
Captured navigational-assist content with Volkswagen across next year models
• Supported Nest’s energy-efficient, intelligent thermostats and smoke detectors
• Commenced volume production of wireless home lighting platforms at Belkin
• Enabled wearable technologies at Philips for emerging medical applications
• Secured key sockets within FitBit’s smart scale and connected wristband systems
• Leveraged 802.11ac solutions in gaming consoles, set-top boxes, BluRay® players and LED/4K TVs for enhanced video streaming applications
• Introduced 4G-LTE base station RF subsystems at Ericsson
The power draw on the new Arista 7250X and 7300X switches is also 25% lower per 10Gb/sec port than on the existing machines in the Arista line, says Sadana. This will matter to a lot of shops working in confined spaces and on tight electrical and thermal budgets.
The original 64-port 1Gb/sec low latency 7050 switch that put Arista on the map five years ago was based on Broadcom's Trident+ network ASIC, and its follow-on 40Gb/sec model used Broadcom's Trident-II ASIC. The 7150 switches used Intel's Fulcrum Bali and Alta ASICs. The new 7250X and 7300X switches put multiple Trident-II ASICs into a single switch to boost the throughput and port scalability. All of the switches run Arista's EOS network operating system, which is a hardened variant of the Linux operating system designed just for switching.
Arista Networks, which boasts serial entrepreneur Andy Bechtolsheim as its chief development officer and chairman, has been selling products for five years against Cisco Systems, Juniper Networks, Mellanox Technologies, and others in the networking arena. Its largest customer has 200 000 servers connected on a single network. So Arista can hardly be thought of as a start-up. But the company is still an upstart, and is launching a new set of switches that deliver an absolutely flat network, called a spline, to customers who need moderate scale, simplicity, and low cost.
With a leaf-spine network, every server on the network is exactly the same distance away from all other servers - three port hops, to be precise. The benefit of this architecture is that you can just add more spines and leaves as you expand the cluster and you don't have to do any re-cabling. You also get more predictable latency between the nodes.
Rounding out the machine's rear connections are two Gigabit Ethernet ports powered by Broadcom's BCM57762 controllers. Each is linked up to its own PCI bus with x1 link width.
Millions of iPhones already ordered, says Asian wireless carrier
BEIJING — Apple Inc.’s deal with China Mobile Ltd. to sell iPhones won’t be limited to handsets, but will also entail broad cooperation between the two companies, the chairman of the world’s largest carrier said Wednesday.
China Mobile HK:941 -0.90% CHL +1.08% Chairman Xi Guohua said that already multi-millions of Apple’s iPhones have been ordered by its customers, signaling strong demand for the device. Apple’s AAPL +0.11% iPhones will begin selling at China Mobile, the world’s largest carrier by subscribers, starting Friday.
Speaking in a small media briefing to Chinese media and The Wall Street Journal, Apple Chief Executive Tim Cook said he is “incredibly optimistic” about the outcome of the cooperation with the Chinese carrier.
“We’ve gotten to know each other....today is a beginning, and I think there are lots more things our companies can do together in the future,” Cook said.
The new cooperation with China Mobile is the last piece of the puzzle for Apple in the country, officially making the iPhones available through all three of China’s state-run telecom carriers. Though neither Apple nor China Mobile would comment on the exact terms of the deal, Apple is likely to get a considerable bump from China Mobile, which analysts expect to spend generously on marketing and handset subsidies to sell the iPhones.
The cooperation also massively expands the reach of Apple’s sales channels in China, making the iPhones available in China Mobile’s thousands of stores that range across the country from large cities to tiny hamlets.
A deal to sell iPhones on China Mobile's vast network is a "watershed moment," Apple CEO Tim Cook told CNBC on Wednesday.
China Mobile, the world's largest mobile company, starts selling Apple iPhones in China this Friday.
Apple and China Mobile announced a long-awaited deal last month, with access to China Mobile's network of an estimated 760 million subscribers seen as a crucial next step for Apple.
(Read more: Apple, China Mobile strike a deal )
"This is a watershed moment," said Cook, who is in Beijing for Friday's launch. He referred to China Mobile as a great cellphone firm with a "very fast network."
China Mobile said it did not have exact sales estimates. The firm said as of January 13, it had received 1.2 million pre-orders or 60,000 per day since December 25.
The mobile phone carrier said it was not releasing details of subsidies, which will be released with its annual results in March.
(Read more: Biggest loser of Apple-China Mobile deal: Samsung )
The deal with China Mobile means that the iPhone will now be available through all state-run telecom carriers in China, home to the world's biggest population and a growing class of consumers.
The two latest iPhones have been sold by rivals China Unicom and China Telecom since they were launched last year. Both firms have trimmed contract prices for the iPhone to keep existing customers and tempt new ones away from China Mobile, according to media reports.
While Apple gets access to China's Mobile's vast network of customers, the tech firm also faces stiff competition from the like of Samsung and Lenovo.
analysts at Canaccord Genuity raised their price target on shares of Broadcom Corp. from $32.00 to $35.00 in a research note to investors on Thursday 1/9/14. They now have a “buy” rating on the stock.
FBR Capital analyst Christopher Rolland reiterated an Outperform rating on Broadcom (NASDAQ: BRCM) and raised his price target from $29 to $32, saying product portfolio and management's optimism about mobile and wireless are encouraging.
"Broadcom's products at its open house presented themselves well, and CEO Scott McGregor was upbeat on the company's prospects for mobile and wireless, particularly for LTE," Rolland notes. "In addition to restating the company's expectation of growth in mobile and wireless in 2014, on a three-year basis, management now believes mobile and wireless will experience the fastest growth of all segments."
The sub-Rs 20,000 price segment is currently a hot-bed for Chinese smartphone vendors offering everything from Full HD displays, quad-core CPUs, 13MP camera modules to giant screen sizes – all this at a very affordable price. MediaTek has been a key player in powering all these features right from the get go and now, it’s tough to find an Android phone under Rs 20,000 that isn’t powered by a MediaTek chipset.
One thing that has been lacking however is better wireless connectivity. We’ve gotten used to not having NFC, GLONASS, dual-band Wi-Fi, etc simply because MediaTek’s chipsets don’t have these features currently. Broadcom’s renewed focus on the budget segment could potentially change what customers typically expect from smartphones. We had a chance to sit down with some of the key folks over at Broadcom, to understand their game plan on changing the perception of budget smartphones.
Changing the face of budget smartphones
For those who aren’t aware, Broadcom is primarily a wireless and broadband communications company whose bread and butter is providing solutions for everything from enterprise servers, cable modems, home networking to even mobile phones. In fact, some of the most popular consumer electronic devices like the iPod, Samsung Galaxy S4, Galaxy Note 3 and others use Broadcom’s technology for NFC, Wi-Fi, Bluetooth, etc. The American company is now shifting its focus on baseband chips and better wireless connectivity for affordable smartphones given the boom in emerging markets like ours.
Broadcom currently has three main baseband chips that we’ll be seeing in smartphones; BCM 21663 and BCM 28145 are dual-core baseband chips and the BCM 23550 is their current flagship quad-core SoC. The latter will also debut in XOLO’s upcoming Q1000 Opus smartphone.
The company will also be playing a key role in the some of the upcoming LTE phones from Micromax, etc which are due for an announcement towards the end of the year. “Our recent acquisition of Renesas Mobile Corporation, the ex-Nokia chip company, gives us an advanced position in LTE”, said Mr. Rajiv Kapur, MD Broadcom India.
Broadcom has also tied up with key smartphone players like XOLO, Panasonic, Karbonn, Idea and Micromax to deliver either complete platform solutions (baseband, connectivity suite and navigation) or simply individual modules. This allows more flexibility as OEM’s can select a MediaTek or a Qualcomm chipset and pair it with Broadcom’s BCM4752 multi-constellation GNSS chip to deliver a better package.
Our interaction with them was centred on bringing advanced wireless and navigation features to budget phones. Things like dual-band Wi-Fi, 5G Wi-FI, NFC, Miracast, GLONASS, Bluetooth low energy (BLE) for wearable computing and their proprietary Smart On function which enables dual standby SIM cards to behave as dual active could soon be new features in the next wave of Chinese droids.
At the end of our interaction, the message was pretty clear – Broadcom is more than happy playing the unsung heroes as they don’t plan on going crazy with marketing their new chipsets the way Qualcomm does. They don’t care about bringing in octa-core SoCs anytime soon either. Providing better wireless solutions in the budget segment is their primary goal and we feel they have a huge advantage here considering that’s their pedigree. The next bunch of smartphones from players like Karbonn, XOLO and Micromax are going be more about better wireless connectivity and improved location services and honestly, it’s about time too.
Micromax will soon be launching a quad core version of its Canvas smartphone based on Google's Android 4.1 Jelly Bean. The best part is the quad version will be priced under Rs 15,000. Wow! A quad core Jelly Bean phone under Rs 15,000.
This is for the very first time that an Indian player is looking forward to launch a quad core phone under Rs 15,000. The price of quad core phone is usually high just because the quad core chipsets are purchased from Qualcomm or NVIDIA, leading to the rise in price. Recently, Broadcom has entered this segment and it seems to have partnered with Micromax, according to The Mobile Indian. With Broadcom's entrance we can expect economical quad core smartphones in the Indian market.
"Micromax will be launching a quad core Android smartphone based on Broadcom processor in March for around Rs 15,000," Vikas Jain, co-founder and business director, Micromax said to The Mobile Indian. "The quad core smartphone will have a 4.5 inch qHD IPS display, ICS or Jelly Bean operating system, 8 megapixel camera and 4 GB of internal memory."
There seems to be no change in camera module. There is a 8 MP rear camera and 1.9 MP front camera. Other good thing is 2600 mAh battery. Of course dual sim card slots are there. The phone is coming in Black, White and Pink color options.
Quick Specs of Samsung Galaxy Grand 2
Dual SIM card slots (GSM+WCDMA)
Android 4.3 JellyBean OS
Quad core Broadcom BCM23550 SoC
1.2 GHz quad core CPU, Videocore IV GPU
5.25 inch TFT LCD touch screen display, HD 720p resolution
1.5 GB RAM, 8 GB ROM, micro SD card slot
8 MP rear camera, 2 MP front camera
Full HD video recording and playback
2600 mAh Li-Ion battery
Flux leather back cover
HSPA+ speed, Bluetooth, dual band Wi-Fi 802.11 a/b/g/n, Wi-Fi Direct, NFC.
Samsung officially unveils the successor of Samsung Galaxy Grand Duos to counter home-grown brands like Micromax. In recent times Samsung is losing ground to Micromax, Karbonn, Lava, Xolo. Micromax is now threatening the South Korean giant company in low-mid range smartphone segment. Currently MMX is on second spot with 22% market share while Samsung is on the top with 26% market. Therefore, the successor Samsung Galaxy Grand 2 is released with improved hardware.
Once again Samsung opted for Broadcom over MediaTek. It’s Broadcom BCM23550 SoC that couples quad core 1.2 GHz Cortex A7 application processor and VideoCore IV GPU. In addition to that it has 1.5 GB RAM. Therefore, the phone is quite efficient in terms of multitasking.
Samsung Galaxy Grand 2 sports 5.25 inch screen with HD 720p resolution. This seems to be a good feature of this handset. Once again it has 8 GB ROM along with micro SD card slot for storage expansion.
The BCM43602, on the other hand, is designed for the PCIe interface and is capable of receiving 802.11ac speeds up to 900Mbps. Broadcom says the entire WLAN software driver for the chip runs inside the chip itself, freeing up the host's (for instance, a computer) CPU power for other tasks.
Both of these chips are now sampling to OEMs, which means you can expect to see the final products based on them sometime this year.
At CES 2014, Broadcom announces two new 5G WiFi system-on-a-chips (SoCs) designed to deliver range and speed while using less power from the host device's CPU.
Broadcom has been betting heavily on 802.11ac (5G Wi-Fi) and says its new chips will help significantly enhance users' Wi-Fi experience at home.
Broadcom, which three years ago released the first chip to incorporate the new 802.11ac Wi-Fi standard -- which it calls 5G Wi-Fi -- is at it again.
The company announced today at CES 2014 two new 5G Wi-Fi client system-on-a-chips (SoCs), models BCM43569 and BCM43602, designed to offer Wi-Fi speed and range while reducing the Wi-Fi processing power of the host device.
As Broadcom explains it, consumers generally stream video content to multiple devices at home using various applications and content delivery services. This create interference when multiple devices are using the same frequencies, leading to signal quality degradation than expected. For example, using Bluetooth- and Wi-Fi-enabled devices such as remotes, speakers, and game controllers at the same time can reduce available Wi-Fi bandwidth and cause latency when playing an online game or streaming a movie from a tablet to a smart TV.
Broadcom says the new BCM43569 and BCM43602 are designed to tackle this problem.
The BCM43569 chip is a dual-band 2x2 MIMO combo chip with a USB 3.0 interface and coexistence technology that enables performance by allowing smart TVs to receive both Wi-Fi and Bluetooth (4.1) signals simultaneously. Broandcom claims it's the first chip to include a common USB port for Wi-Fi, Bluetooth, and integrated Power Amplifiers (iPA) across both bands. It's designed to deliver up to three times the bandwidth of its peers, and it comes with a separate Bluetooth low-noise amplifier (LNA) as well as customized Wi-Fi and Bluetooth coexistence algorithms. It can be used in adapters that use either a USB 3.0 or USB 2.0 interface.
The BCM43602, on the other hand, is designed
Last year at CES we took a look at Broadcom's LTE modem portfolio, where the company showed off a Cat 4 LTE baseband doing 10+10 MHz carrier aggregation, before being formally announced at MWC. Since then a number of things have changed, including Broadcom's acquisition of LTE and SoC related Renesas Electronics assets, and subsequent restructuring of Broadcom's LTE modem plans. Its own LTE modem which we saw last year has been shelved in favor of a plan forwards with an M320 SoC with multimode capabilities and an upcoming standalone LTE modem.
At CES 2014, Broadcom showed off its M320 SoC which was based on the Renesas SoC platform. M320 combines two ARM Cortex A9 CPUs clocked between 1.2 and 1.5 GHz, PowerVR 5XT GPU, and Cat 4 LTE modem with DC-HSPA+ and GSM multimode capabilities. Broadcom prepared a reference design turnkey phone based on the M320 platform and showed it attached to AT&T and T-Mobile LTE on the show floor, and allowed me to run a few speedtests. The platform is already slated to be productized by Samsung in an upcoming smartphone which was under development even before the acquisition completed.
In addition, Broadcom teased an upcoming Cat 6 (300 Mbps) LTE modem cabled up to an Anritsu base station emulator showing 20+20 MHz carrier aggregation and delivering the expected 300 Mbps speeds on the downlink. Just like last year, Broadcom will formally announce the name and details of this upcoming multimode LTE modem around MWC.
said that the company is "making good progress" on LTE, with more announcements likely coming at the Mobile World Congress trade show in February.
"We are never going to be at the level of Qualcomm," he said. "We have to take baby steps. As long as we get one or two deigns initially and prove that it will be successful, it can be a stepping stone."
Qualcomm, for its part, acknowledged the competition, but said it will stay ahead of rivals. "A very similar situation occurred in 3G," said Peter Carson, senior director of product marketing for Qualcomm Gobi. "A large number of chipset vendors came out with products or proposed products (in 3G). One thing that is common is that, for those who are not executing, the bar keeps getting higher and higher."
Carson said Qualcomm is currently working on LTE Release 13 specs (Release 10 features will hit the market this year). "One unique thing about wireless is you need to be backwards compatible," he said, and for those companies that are late to the game on LTE, they now have to implement past features but optimize them for reduced chip sizes, power, spectral efficiency and more.
which will deliver LTE Advanced features such as carrier aggregation, will be in "commercial devices" in first half of 2014.
For its part, MediaTek unveiled its first multimode LTE chipset this week, the MT6290. Mohit Bhushan, MediaTek's vice president and general manager of U.S. corporate marketing, said that in the U.S. MediaTek is going take its LTE chips "through all of the carrier labs in the first half [of 2014] so they can flow through the market in the second half." MediaTek's first LTE devices will have standalone modems, but the company is sampling integrated chips that combine modems and applications processors in the first half of this year.
Broadcom has made significant strides on LTE, especially after it acquired LTE-related assets from affiliates of Renesas in September. Broadcom's M320 dual-core LTE System-on-a-Chip will be shipping in at least one Samsung phone in the first quarter, though the companies aren't releasing details. The chip supports LTE Cat 4, with speeds of up to 150 Mbps. Bob Rango, executive vice president of Broadcom's mobile and wireless group, said the company is not yet ready to announce other customers but is "definitely engaged" with them. He said that the chip is backwards compatible to support any network in the world except for CDMA and TD-SCDMA.
Rango said Broadcom will differentiate itself in the LTE market by bringing "a tremendous suite of complementary technologies." He noted that Broadcom can support different Wi-Fi usage models, and that its GPS chips, which are all part of the single SoC, are more advanced than others since they use multiple satellite constellations.
Nvidia CEO Jen-Hsun Huang has said the first products with Nvidia's Tegra 4i chipset, which combines the company's application processor with an LTE modem, will be rolling into the market in the first half of next year, but likely will not be aimed at the U.S. market, at least initially. Sridhar Ramswamy, senior technical marketing manager at Nv
January 10, 2014 | By Phil Goldstein
LAS VEGAS--Qualcomm (NASDAQ:QCOM) remains the market leader by far in the cellular baseband market, and in LTE chips in particular. However, its chipset rivals made clear this week at the 2014 Consumer Electronics Show that they are intent on using 2014 to close the gap on Qualcomm when it comes to LTE.
According to research firm Strategy Analytics, Qualcomm, MediaTek, Intel, Spreadtrum and Broadcom captured the top-five revenue share spots in the cellular baseband processor market in the third quarter of 2013. Qualcomm maintained its dominance with 66 percent revenue share, followed by MediaTek with 12 percent revenue share and Intel with 7 percent share. However, according to Strategy Analytics analyst Sravan Kundojjala, Qualcomm has around 95 percent of revenue share in the LTE baseband segment, thanks in part to the $14 billion in research and development the company has spent over the last four years.
Despite those leads, Qualcomm's competitors are not standing still and are doing everything they can to catch up. In interviews with FierceWireless at CES, executives from rival companies said they are seeing momentum on LTE and expect to increase that in 2014.
The competition will become more fierce and urgent as more carriers around the world roll out LTE, thus driving demand for LTE phones.
Hermann Eul, vice president and general manager of Intel's Mobile and Communications Group, said Intel is now the No. 2 chipset vendor in terms of shipping LTE chips. He noted that "obviously it's a very sophisticated technology" but that Intel is "loading more design wins on that platform."
"We are working full steam ahead," he said. In August Intel purchased a unit of Fujitsu, called Fujitsu Semiconductor Wireless Products, a specialist in RF transceiver technology, in a bid to increase its LTE and overall mobile expertise. Intel started shipping its first multimode LTE modems in October. Eul said that Intel's XMM 7260 modem,
An acquisition might put Intel's (INTC) slow-to-gain-traction wireless strategy in the fast lane, says RBC Capital in a research report released Friday that recaps developments at the Consumer Electronics Show.
Chipmaker Intel has aimed for more design wins with tablets and smartphones, where rival ARM Holdings (ARMH) has had the upper hand.
RBC analyst Doug Freedman says the game plan for Intel, which focused on wearable devices at CES this week, might have holes.
"The vast number of Intel's tablet design make us wonder, which of these will sell?," wrote Freedman. "Our view is that while Intel's OEMs are building to its plan, lack of product differentiation could once again lead to a market where inventories are not consumed.
"We continue to view Intel's tablet strategy to buy revenue as too risky, as customer engagements are more short-term in nature. Consequently, this aligns with our core thesis that Intel needs to better optimize return on investment, particularly in the mobile market, where the company could be better off acquiring a market share gainer in a buy vs. build strategy."
Last month, Nomura speculated that Intel could acquire Broadcom (BRCM) in 2014, as IBD reported.
"We believe Broadcom's acquisition not only brings diversification to Intel's existing revenue stream, which is heavily weighted toward PCs (60% of sales), it is also highly strategic in several areas where Intel is trying to expand (such as wireless and networking)," wrote Nomura analyst Romit Shah.
RBC's Freedman doesn't name candidates for an Intel acquisition.
On Broadcom, Freedman wrote: "The challenge is proving that BRCM has a sustainable business model in its wireless and combos, which could eventually become integrated. The company is broadening its efforts, via channel strategies, to becoming more horizontally and vertically balanced. The key will be monitoring market share gains against Qualcomm (QCOM)."
After yesterday appeared complete specifications and leaked photo, now comes the news that the Samsung Galaxy Grand Neo smartphone will be released in mid-February 2014. Samsung is also reportedly planning to introduce the Galaxy Grand Neo at MWC 2014.
The information reported by GSM Arena (01/08/2014), said that the smartphone will be released Galaxy Grand Neo Samsung in week 7 of 2014, or about 10 to February 16, 2014 for the European market. What about other areas? Another region reportedly not much different.
Smartphone Galaxy Grand Neo Galaxy will continue its glory and at the same Grand accompany the first generation Galaxy Grand 2 to demolish the middle class market. Samsung Galaxy Grand Neo estimated is approximately USD 4.9 million in the European market.
What is offered by the Samsung Galaxy Grand Neo? Samsung Galaxy Grand Neo equip it with a 5-inch touchscreen with a WVGA resolution of 800 x 480 pixels with a pixel density of the screen reaches 187 per inch PLS technology.
Samsung Galaxy Grand Neo is equipped with 8GB of internal memory which is equipped with a microSD slot for external memory expansion up to 64GB. Konketivitas Samsung Galaxy Grand Neo is powered by WiFi, Bluetooth, 3G HSDPA, microUSB port, and GPS.
Sector camera, the Samsung Galaxy Grand Neo has decreased when compared to the first generation Galaxy Grand because only the rear camera equipped with autofocus 5 megapixel resolution that is supported by the presence of LED flash and a VGA front camera.
Sectors kitchen runway, the Samsung Galaxy Grand Neo is powered by a Broadcom BCM 23550 chipset which brings quad-core ARM Cortex-A7 1.2 GHz speed paired with 1GB of RAM memory and a graphics processor from VideoCore IV.
Samsung Galaxy Grand Neo will use the Android operating system 4.2 Jelly Bean and supported by the battery capacity of 2100mAh.
Samsung’s next flagship smartphone, the Galaxy S5 is likely to be released in April and could come with eye scanner technology, says a new report in Bloomberg.
The report quotes Lee Young Hee, executive vice president of Samsung’s mobile business as saying that the phone will release in April and that it will be paired with a newer version of the Galaxy Gear smartwatch.
Lee is quoted as saying, “When we release our S5 device, you can also expect a Gear successor with more advanced functions, and the bulky design will also be improved.”
On the issue of eye scanner, Lee refused to confirm whether the S5 would actually come with it or not and indicated that it was still in a research stage.
Other rumours about the S5 have also hinted at a diamond coating for the phone’s body. A report in the Korean paper ETNews said that Samsung is working hard to change the external design of the S5 and that it is conducting R&D to apply the diamond metal surface treatment technology to metal cases.
A diamond coated-material is likely to ensure that S5 is not as vulnerable to scratches. It’s not clear whether Samsung will be ditching the polycarbonate shell for an aluminium body for the S5.
Another report had said that S5 could launch sooner and at the Mobile World Conference in Barcelona in February. South Korean paper ienews24 had said that Samsung’s vice president #$%$-hoon Chang of design strategy, confirmed the launch event of Galaxy S5 would be at Mobile World Congress,
It is also being reported that Samsung will launch a new flagship phone soon after the S5. The flagship is rumoured to be named the Galaxy F smartphone and will have a full metal body.