He is desperate working on "commission" - somewhat like CNN - bad news sell better than good news -
The Eagles "dirty laundry".....
6 months or so Intel stated they moved more 22 nm stuff over to 14 nm - besides Intel pulled in 10 nm according to KLAC ....and my base was loaded with KLAC when Lam bought the company....
all you have to do is listen to AMAT et al but the doofus is too stupid....TSMC is the one who is dragging their feet moving to advanced technology -
in January TSMC announced record capex ...
Not at all
LRCX has now exposure to EUV via KLA:
At one time, the industry claimed it did not need an actinic wavelength inspection tool for EUV masks. Now, the industry is singing a different tune. “At the KLA-Tencor Lithography Users Forum, Dr. Mark Phillips from Intel presented what, at first, appeared to be a largely uncontroversial report regarding metrology challenges. However, things took an interesting turn as Dr. Phillips shifted to his EUV program. He made the case that the only workable solution for inspecting EUV masks is to develop an EUV-based (actinic wavelength) EUV mask inspection tool,” Twigg said.
Metrology is also a key technology. “Just as ASML dominates the lithography segment, KLA-Tencor is dominating the discussion when it comes to solving upcoming process control challenges. The company rolled out its ‘5D’ process control concept; the five dimensions represent the three physical dimensions, plus time and efficiency. What the concept represents is the idea of tying a number of fab measurements together to better apply feed-forward and feed-back information to process equipment to improve process windows. This is a more holistic approach to process control, similar to ASML’s approach to lithography, but broader,” Twigg said.
of course Intel will love it ....
you people just don't get it
Intel might even buy a stake in LRCX / KLAC
You better off reading the transcript -
BK was also very specific about the capex - there was a very specific reason why some of the capex was rolled over to 2016 - because tool configurations were changed
AE is completely ignorant - he's becoming more and more a broken clock
In a couple days KLAC will report - and KLAC reported a month ago that Intel is pulling in 10 nm purchases -
and KLAC stock moved up nicely
Chih-Cheng Lin of Taiwan Semiconductor Manufacturing reported that the foundry has been able to process 15,040 wafers in four weeks — an average of 518 wafers a day — using ASML’s NXE:3300 scanner this year, with tool availability increasing to 70.2 percent, compared with 55 percent during an eight-week period in 2014.
While ASML “has made a lot of progress” with EUV pellicles, Lin said, “the job is not done yet.”
According to slide presentation of July 2015 ASML is shipping 4 or 5 EUV tools to Intel -
perhaps Intel is a lot closer in obtaining satiesfactory uptime and perhaps starts inserting EUV @ 10 nm node although officially EUV to be used @ 7 nm
That's exactly what Intel did in case of ASML - perhaps Intel is going to take a stake in KLA
Panelist Yalin Xiong of KLA-Tencor called for “a new model of discussing technology and economic terms” in developing inspection equipment for extreme-ultraviolet lithography photomasks and pellicles. “Long-term solutions that require investment are risky,” he said of actinic inspection technology, adding, “They require a new collaboration model.”
Xiong engaged with a fellow panelist, Jeff Farnsworth of Intel Mask Operations, in talking about such “economic terms” and forms of collaboration among mask shops, equipment vendors, and other parties in the semiconductor industry.
No change in MU capex as well as third party capex (Intel) -
bodes well for Lam
BTW Micron's CFO is ex Lam
It appears KLAC and ASML are somewhat stabilizing - there is no reason for Lam not to follow.
AMAT is a different story:
they actually cut guidance
Lam is Brooks largest customer and they are very, very much in line with LRCX CEO with respect to outlook.
they reported 9/4
they were asked if they shut down in December quarter "to save expense" and they said no shut down in december quarter.
LRCX could become shorties worst nightmare
Intel Mask Engineer Reports “Steady Progress” in EUV Masks
Intel has been working on photomasks for extreme-ultraviolet lithography for more than a decade, and has recently logged significant progress, according to Ted Liang, principal engineer in the Intel Mask Operations (IMO).
KLAC should be "rocking"
Light sources for EUV scanners are now running at more than 90 watts, Liang reported, and 120W has been demonstrated, he said.
Among the results of the members’ perception survey, respondents expressed increased optimism in the implementation of EUV lithography for semiconductor high-volume manufacturing (HVM) compared to last year’s survey, while at the same time acknowledging that EUV lithography is expected to add greater complexity to photomask manufacturing. In addition, expectations on the use of multi-beam technology for advanced photomask manufacturing continue to remain strong. Results from the eBeam Initiative’s first mask makers survey–which not only provides insight into the challenges and opportunities for photomask manufacturers but also gives mask makers a way to assess their own progress relative to their peers–indicate growing mask complexity across many fronts.
BTW KLAC reported that Intel pulled in 10nm mask inspection tools and ASML is shipping multiple EUV tools to Intel
Short interest up another million - 2 millions within the last month while LRCX confirmed guidance...
pretty amazing - there are several funds working together
it looks like Intel has ducks in a row for Skylake launch -
supposedly Intel cleared inventories -
so Intel looks OK
TSMC struggles - but I believe they are getting heat from second tier foundries eating into their very profitable legacy business.
do the seller/shorters know that Intel is pulling in 10 nm - 10nm is a great node for equipment makers.
The Lam CEO actually leaned towards the upside - NVLS has GREAT exposure to Intel.
I hope you had a chance to listen - also to KLAC
Today they are slamming ASML - they have a huge backlog and are shipping EUV tools to Intel
came out last week.... 1.06....bookings up sequentially
I recall stuff like this would show up at Yahoo news - not anymore
The LRCX a KLAC call might be still archived...
listen to both at least for the first 10 minutes - there is good news out there but it's not being published
Last July LRCX upped their guidance significantly and less than two weeks ago the CEO confirmed and he was fairly upbeat and confident.
I think it is very, very likely Lam will make the quarter - there is no reason for trashing Lam
also KLAC reported pull ins from Intel
both AMAT and KLIC were negative
Apple is squeezing the blood out of its suppliers....
did it ever come to your mind Intel/BK actually rejected an Apple deal -
that's something to think out of the box
the current perception is Intel chasing AAPL business
intel's capex supports annual sales of $55 to 57 billions....
TSMC capex supports sales of $ 26 to 28
what's TSMC revenue from 16nm FinFet?
what's intel revenue from 14 nm?
I predied there will be dog fighting for ARM business -
don't kid yourself Nenni - TSMC loosing bread and butter business to second tiers will greatly impact TSMC capabilities to move to bleeding edge -TSMC always relied on legacy as a cash and profit cow.
it seems Intel has NO intention to expand its foundry business ....
crosspoint memory might be a better opportunity
Too bad -
my sources say TSMC continues to push out while Intel actually is pulling in
it's just a vicious dog fighting for some ARM bones.....
TSMC’s 28nm blues
While the company claims its 16nm node is on track, and coming in under budget, the short term problem for TSMC is actually its legacy 28nm node. The company reportedly lost quite a few orders to SMIC and UMC, including orders from industry heavyweights like Qualcomm and MediaTek.
We discussed why 28nm will remain a relevant node for several quarters to come in a recent feature. It will be used for low- to mid-range parts for at least another year.
As for the 20nm node, Apple is still going strong and new Snapdragon 810 design wins are being announced on a weekly basis (Xiaomi, ZTE, LG and more). However, losing Samsung’s flagships is still a big deal and is bound to impact both Qualcomm and TSMC.
The only thing I know is that TSMC is NOT - I repeat NOT - spending capex as projected which was confirmed by AMAT a week ago - on the other side smart guy KLAC was surprised that Intel is pulling in 10 nm -
you just don't understand capex
ASML has a huge litho backlog from Intel
In what appears to be a reincarnation of its 2012 12.5-inch XPS 12 convertible notebook, Dell Inc. is seemingly In gearing up to launch a 2-in-1 Surface Pro-like tablet, dubbed the XPS 12. German site Giga published what it claims are leaked images detailing the specs and release date of the Dell XPS 12 2-in-1 Windows 10 tablet. (via Engadget)
Specs for the Dell XPS 12 include a 4K Ultra HD (3840 x 2160) resolution display with an InfinityEdge design similar to that found on the XPS 13 to cut down on bezel size, a Dell active stylus, a Thunderbolt 3 port for one-cable docking and 8x faster transfer speeds than USB 3.0, 10-hour battery life, 8-megapixel rear-facing camera, 5-megapixel front-facing camera, and a magnetically connected and detachable backlit keyboard (illuminates in low light and no light conditions) and precision touchpad.
Dell XPS 12 specs via Giga.de
Dell XPS 12 specs via Giga.de
The images, unfortunately, do not reveal the processor spec, RAM or expected pricing for the Dell XPS 12. According to the images, the Dell XPS 12 is slated for release in October this year.
Judging by the images alone, the Dell XPS 12 closely resembles Microsoft’s Surface Pro 3 2-in1 tablet, right down to the kickstand setup.
Dell is not the only company throwing its hat into the hybrid tablet market. Earlier this month, Lenovo Group Ltd. unveiled its own Surface Pro 3-like 2-in-1 Windows tablet, the 12-inch Lenovo MIIX 700. Apple also joined the fray – albeit with a strict mobile-first offering – when it launched its 12.9-inch iPad Pro last week. Like the 2-in-1 offerings from Microsoft, Dell and Lenovo, Apple’s iPad is also compatible with a removable Smart Keyboard and stylus in the form of the Apple Pencil.
The Dell XPS 12 leak follows news last week that both Dell and competitor Hewlett-Packard Co. would participate in Microsoft’s Surface Enterprise Initiative to sell Surface Pro devices and accessories through their sales channels.
PRO stands for Professional -
who would buy a tablet instead of a 2 in 1
Stupid Cook made fun of 2 in 1
too bad Apple did not invent the 2 in 1 convertible
Jobs probably would have come up with a concept of a 2 in 1
I fully agree with WW - the Ipad is done
as B.B. King says ... the thrill is gone