Its going to cost a bunch to produce chips on these hybrid planar/finfet process. I doubt Qualcomm will be able to sell the chips produced on these process for $10 which is what is required in todays commodity smartphone market.
just look a tegra ....ashes, ashes all go down
QCOM will spin off (dump) its fabless chip business - just like TI did several years ago
GlobalFoundries, Samsung, and IBM are pushing ahead with plans for a hybrid 14-20nm process, in which chips would marry 14nm front-end manufacturing with 20nm interconnects. The result (if it works), would be a chip with 14nm-style power consumption and performance, but 20nm size.
decided to reply to making up a story about a bike to make it look like you could care less that you were exposed, again
you know "boxer" configuration with regards to an engine? - oh forgot zero engineering background - you drive an Oldsmobile don't you
how do you measure defect density on a 3D device ?
"grosse Fresse" and pea brain
compared to G 61 but that was expected - both clueless and both "grosse Fresse"
How defect densities wreck cost curves
As semiconductor nodes shrink, the difficulty of building ever-smaller transistor layouts becomes increasingly acute. The shift to double-patterning can increase defect densities on its own, the fundamental limitations of 192nm lithography are a constant pressure, and the need to ensure ever-higher levels of control over dopant distribution and voltage characteristics are slamming up against the fundamental limits of physical laws. Defect density is a metric that refers to how many defects are likely to be present per wafer of CPUs.
broadwellIt’s important to understand that defects aren’t binary. Chips don’t just work or not work. A chip may work perfectly but consume more power than intended. Imperfect dopant distribution or nanometer-size errors in transistor placement can cause issues related to frequency scaling. The problem with low-power, low-cost cores is that the manufacturer needs to tightly control both binary work/don’t work defects and smaller problems that don’t destroy the processor, but prevent it from hitting power targets.
One way of lowering the impact of defects is to build redundant circuit paths within the processor itself. All manufacturers build in a degree of redundancy, but when manufacturing tolerances are being tightly squeezed, adding redundant circuits also pushes up complexity. A balance must be carefully struck to ensure that the evaluation and duplicate structures don’t end up exacerbating the problem.
Consider the impact of defects that cumulatively increase CPU TDP by 50%. A 50W-75W desktop chip now has a TDP of 75W-112W — well within the cooling capabilities of a modern tower. A 17W laptop chip at +50% TDP can fit into any chassis capable of handling a 25W TDP. But a tablet chip, already borderline at 5W, may be pushed out of the space altogether if it hits the 7.5W mark.
well everybody is well aware about G61s stupid comment windows RT is the best thing ever happened to MS - for sure that level of stupidity can not be topped.
He is whining about Intel bribing while MS wrote off billions.....
anyhow when the FInFet/Trigate came out G 61 was confused because he could not relate defect density (measured in defects per mm2) to a 3D device and quickly concluded Intel statisticians were idiots.
But than came the best...
G61 concluded FinFet/Trigate would only be applicable to CPU's and FPGA because of repeating arrays but NOT to a SoC. - now that's hilarious - equally stupid to his comments about windows RT
I think Alexander might recall the discussion because he also made some comments about the defect density "issue" in response to G61 - shortly later Nenni published an article that Intel's FinFets would look NOT "right"
G61 has eine grosse Fresse but his brain is the size of a pea -
poop control has probably hard time to follow but do I care?
BTW anybody riding bikes?
I spent 3 hours riding my BMW boxer twin for the 3 hours to Yosemite - I picked up a R1100RS (19 years old !!!) in mint condition - sweet
there is nothing like a twin boxer engine .....
No you are very, very sick and you have a very, very short pimmel - I have never encountered a poster that is as sick as you - may god have mercy on your soul - you add NO value - you just jerk off - and you will be back tomorrow
Intel topped all chip companies in R&D spending in 2014, accounting for 36% of the top-10 spending and 21 percent of the $56.0 billion in total worldwide semiconductor R&D expenditures. The industry’s two largest IDMs—Intel and Samsung—continue to emphasize internal production capacity for advanced ICs in leading-edge wafer fabs. Consequently, spending on R&D programs at the two IC giants has kept growing, but at different rates in recent years. This is partly due to Samsung’s ability to hold down some costs by participating in IBM’s Common Platform joint development alliance, which also includes GlobalFoundries as an R&D partner.
Fabless IC supplier Qualcomm kept pace with Intel to remain the second-largest spender, a position it first achieved in 2012. Qualcomm showed the largest percentage increase among the top 10 suppliers with a 62 percent boost in its R&D spending in 2014. Fabless suppliers Nvidia, Qualcomm, and Broadcom had the highest R&D spending as a percent of sales ratios in 2014 at 31.3 percent, 28.5 percent, and 28.2 percent, respectively. Broadcom’s spending in 2014 declined for the first time since 2003, while Nvidia’s 2014 spending increased just three percent, but both companies have consistently spent in the range of 30 percent of revenue on R&D the past several years.
LRCX , ASML are at all time time - sow what
what are yo trying to proof little man?
you did not even own 50 shares of ASML - because you are lost
don't bother me today anymore
I think poop suffers from Syphilis - at advanced stage it hits his brains (for some time now) - he also hits the bottle in the AM - one day he'll be gone - he does not add value to the board nor society anyway = and he wetdreams about Romney - he has an "issue" which turned himself into a gay bashers.
He hates Germen because he's circumcised.... LOL
only a moron (like you) who stated Windows RT was the best decision ever made,
only a moron (like you) who wet dreams Intel fabbing for NVDA et al could make that kind of stuff up....
you act like a little, angry child kicking and screaming ...
you still have not figured put that it does not work - you are worse, far worse than Nenni
do you comprehend the significance of EUV ?
I doubt it - you sold your 50 ASML shares a long time ago and you don't own ARMH -
keep it it up G61
I would not touch ARMH with a 50 feet pole and so does everybody else on this board
there are a bunch of suckers posting here that have nothing else to do -
and according to Nenni Intel's Fins did not look right - you'r in the same ballpark like Nenni.
TSMC spending a ton of capex relative to Intel and still can't produce enough wafers - wasn't that the reason NVDA "scratched" 20nm -
As far as I understand Intel is mostly interested in Enterprise rather consumer.
I believe Enterprise uses exclusively S(ingle)LC rather than M(ulti)LC .
Lots of misinformation floating around
a $100million worth ????
you are the idiot
remember the stupid comments you made about FinFet strictly applicable to CPU's and topping it your moronic comments about defects relative to Intel's 3 D device - you don't - you're senile
neither Samsung nor TSMC has a productionworthy 20nm - otherwise there would be a lot more customer using it (amd u is right on the money).
Apple bought all the capacity - yeah after spending record capex $ only a few are able to get wafers allocated.
Just like Samsung's comment on 10 nm TSMC repeated the same nonesense about 10nm and catching up with Intel...
in the meantime I am waiting for foundry orders to implement FinFet
it seems Samsung and TSMC are now in a PR battle ...
in the meantime G61 still wetdreams about Intel fabbing for NVDA et al
who cares beside you about AE - AE is an idiot when it comes to manufacturing - just like Nenni
still making predictions
you did not learn from the last 2 years -
oh some content - very impressive - did NVDA gain or loose
bashers in complete disarray - they don't know what side is up or down
waldblow, poop, apology amazing contrarian ranting incoherently ....for the last 12 months or so
hey ASML up 5 % - life is good
No idea why anybody would buy ARMH
Blah, blah, blah.
a lot better than that TSMC/Nenni blah, blah
how many billions did Intel spent on ASML ....litho will be super critical
(2 or 3 times more than Samsung and TSMC combined?)