that Intel is going to use McAfee to incorporate protection into the corporate computing environment.
you pumped TSMC long before and it tanked -
will u is incorrect - you're not a girl....
you suffer from a short #$%$ syndrome
On May 13-15, the key industry players, science institutes and innovation business representatives will gather in Moscow at SEMICON Russia — the premier Russian semiconductor exhibition and conference. The Microelectronics Market Conference (May 13) associated with SEMICON Russia will be held at Technopolis, Moscow, while the Exhibition (May 14-15) will be held at the Moscow Expocentre. Topics include: Advanced Packaging and MEMS, as well as exhibitor presentations in the TechARENA on the show floor.
Over 2,000 attendees are expected from more than 30 countries. Semiconductor and related industries enjoy a high level of support by the government, and SEMICON Russia offers market information, technical knowledge and networking opportunities. Investment opportunities exist in Russia for semiconductor and related technologies — Russia is set to invest into R&D and industrialization of local semiconductor manufacturing.
With economic growth, expanding university/state funding programs, and foreign investments, the Russian technology industry is progressing. With the race for innovation and new programs for electronics development for 2015-2025, Russia offers new opportunities for the market players — including public-private partnership project development. In Russia, there is a sense of urgency about removing trade barriers and other bureaucracy, especially for high-tech products. Russian companies are looking for technical alliances to catch up with Western companies as quickly as possible.
The Microelectronics Market Conference on May 13 will provide a very effective platform for learning about the regional and global market, identifying promising areas for investment, establishing new contacts and developing mutually beneficial cooperation between Russian and foreign companies. The year’s edition will focus on “Shaping up the Russian Microelectronics Industry.” Launched in 2000, the Conference has established a reputation as an important event for microelectronics and related industries specialists.
Heinz Kundert, president of SEMI Europe, will open the Conference with a SEMI Market Update. The opening keynote will be provided by Alexey Kommissarov, director of the Department of Science, Industrial Policy and Entrepreneurship, Moscow City Government. In addition, Frost & Sullivan will present new data based on their recent market research on the electronic and semiconductor segment in Russia. Other speakers featured at the Microelectronics Conference include representatives from: CNII Electronica, Concern Vega, ETU “LETI” SPb, El-Tech SPb, CrocusNano Electronics, Russian MEMS Association, and STMicroelectronics.
Look at TSMC's CAPEX spending. Nada on 450mm
exactly doofus - that's what I said a couple days ago - TSMC has cold feet - just look at the BS TSMC put out about 450mm a few years ago - you are slow - you don't get it - now TSMC is scared sheetless about 450mm and being crunched by 450mm.
Intel slows down rather paving a (free) path to 450mm for TSMC - no more free rides for TSMC
don't you know dummy that TSMC had the first 300mm fab?
and now what?
nenni - you have never seen a 6 inch fab from the inside and you have ZERO employment record - WW is probably right about you -
you're just a sliicon talking head who tries to make money off the dummies
I don't recommend it at all and would be very careful -
perhaps if you have money to blow "play" currency - play the rubel
it's mindblowing that many "investors" depend on SA, fool and nenni.
Why invest in chips when you know sheet about chips?
The Infamous Intel FPGA Slide!
TSMC reiterates 2013-14 450mm plan
Published December 23, 2011 | By zonkey
2013-14 and to be in volume production in 2015-16.
That confirms what TSMC’s President for Europe, Maria Marced, told the IEF 2011 meeting in Seville in October that TSMC’s fab 12 will have the company’s first 450mm pilot line in 2013-14, and that the company’s first 450mm production fab will be in Fab 15 in 2015-16.
Today’s DigiTimes report says that TSMC expects to have 95% of its 450m equipment installed in 2014 and will begin small-volume 450mm production in 2015.
However it clashes with what Rob Hartmann, Director of the world’s No.1 lithography tool maker, ASML, told the ISS 2011 meeting in Dresden in October that 450mm manufacturing will not be introduced until 2018 “or thereabouts”.
When asked by EW how he felt about not having a tool ready to meet the TSMC timeline, Hartmann replied: “Ask TSMC if they are prepared to fund the development of the tool,” adding: “I really wonder if they’ll meet that timeline.”
"I take exception to Intel and anybody else who spreads disinformation about the fabless semiconductor ecosystem."
Me too .... and so does ideal_invst and ....
did you get this nenni?
he's talking about you
Worse yet you get an echo chamber of sites like Seeking Alpha, Forbes, and Motley Fool who will publish things from any idiot out there with a grammar checker. These bottom dwellers of the financial web sites are funded simply on hits, they will put up anything from nearly anyone, and pay by the view. The more inflammatory the headline, the more hits, and the more money both sides make. In short they don’t seem to give a rats #$%$ about accuracy, content, or simple logic, it is all about hits.
or simple logic, it is all about hits.
funny - I posted "show me the logic" with regards to the ALTR topic -
charlie just reiterates what most of us figured out some time ago -
BTW me thinks sometimes charlie is sittin in a glass house - nevertheless he nailed it
great post WW
We should mention here that based on information released during last week’s SPIE Advanced Lithography (2014), it seems EUV is not going to be ready for the N+1 node (10nm). These costs, as well as other capital costs, increase, and thus drive up the wafer price as illustrated by the recent NVidia chart from Semicon Japan (Dec. 2013) below:....
This escalating wafer cost eats away the higher transistor density gains, as articulated by NVidia and calculated by IBS’ Dr. Handel Jones and shown in the following table:
note nenni was refering to SPIE 2014....for the 450mm delay ...nevertheless he did not mention EUV delay -
Semiconductors are dead taking Intel along with it.
I don't think so - i am diversified - chip equips and Intel - time is on Intel's side.
Unless Apple and QCOM inject capex $ TSMC is going to bleed slowly but surely.
The mobile SoC market is not that big and Intel can leverage CPU to make "cheap" SoC.
The next big thing will be memory interface (3D) and that's strictly a manufacturing issue.
Fab equipment spending to increase 20-30% in 2014
SoC scaling to 16/14 nm could result in a significant cost increase...aka FinFet....
too bad neither nenni nor the intel expert have an understanding of manufacturing economics...
both nenni and the intel expert avoid this topic like the devil avoids the holy water
Consequently, the average SoC scaling to 16/14 nm could result in a significant cost increase, and hence 28nm is effectively the last node of Moore’s Law. To make things even worse, the remaining 35% of die area is not composed of only logic gates. More than 10% of the die area is allocated to I/O, pads and analog functions that either scale poorly or do not scale at all. And even in the pure logic domain scaling could not reach the potential 4X density improvements. The following chart was presented by Geoffrey Yeap, VP of Technology at Qualcomm, in his invited paper at IEDM 2013:
JPM (US) started the rumor about voltage regulator (supposedly not working the way it was intended) - JPM was quoting "sources" at (analog) tech conference
People use GPS and get lost - why? because they giving up on thinking for themself,- they become "brain dead"
a quarter delay (by Intel) initiates that ALTR is moving to TSMC who is starting up 20 nm planar?
Let's see whether the Intel expert can come up with a spin
BTW this is JPM Taiwan - and it's not a front page news - it should be shouldn't it .
Of course it was eagerly picked up by ML...you get the drift
The paper, citing JJ Park of JP Morgan Securities, said that Intel's decision to delay its 14nm Broadwell CPUs to the fourth quarter of 2014 is the main concern that sent Altera switching its orders back to TSMC.
Meanwhile, TSMC has managed to ramp up the yield rate of its 20nm process to 50% recently, which will allow TSMC to enjoy brisk sales in the next three quarters, said Park.