Even the pinheads on Wall Street will soon figure out what this means. Or maybe not. Regardless, it's time to buy all of the dips. The end of the year is looking very, very good.
David Kanter predicts Intel will use High-mobility QWFETs (Quantum Well FETs) at 10 nanometers on his Real World Technologies Web site
Intel plans to ramp production of 10nm in the next 12-18 months according to EEtimes
1. The industry will adopt Quantum Well FETs (QWFETs) that use a fin geometry and high-mobility channel materials to achieve excellent transistor performance at nominal operating voltages around 0.5V (compared to roughly 0.7V for FinFETs)
2. The industry will adopt III-V compound semiconductors (most likely In0.53Ga0.47As, alternatively InSb) for the n-type QWFET channel
3. The industry will adopt strained Germanium (most likely) or III-V materials (as an alternative) for the p-type QWFET channel
4. Intel will adopt QWFETs at the 10nm node (most likely), which will probably go into production in late 2015 or early 2016 (alternatively at 7nm in 2017 or 2018)
5. Intel will probably co-integrate conventional transistors and QWFETs, it is less likely (but possible) that the company will use separate substrates that are packaged together to optimize cost
6. The rest of the industry (e.g., Samsung, TSMC, Global Foundries) will wait until the 7nm node to use QWFETs
QWFETs will use two new materials – indium gallium arsenide (InGaAs) for n-type transistors and strained germanium for p-type devices
1.) Intel quantum well technology.
Intel could gain a capability as early as 2016 to produce 10nm transistors as much as 200 millivolts lower in power consumption than the rest of the industry. Kanter expects other chip makers will not be able to catch up with the techniques until their 7nm node, at least two years later.
2.) Windows 10 to be released in July.
3. Intel Windows Smartphone.
4.) Intel Compute Stick coming with Skylake-Y - a huge market for Intel. Initial launch in April.
5.) Push into mobile. "The company expects its mobile group to break even in 2016."
6.) Intel built-to-order Xeon D chips. Another big success.
7.) Micron and Intel Unveil New 3D NAND Flash Memory.
8.) Big server, data center and IoT growth.
9.) An Intel Altera acquisition would boost foundry business.
10.) Skylake coming in October.
11.) The death of RT and the revival of the Wintel relationship.
12.) Intel's EDR InfiniBand arriving soon.
13.) The push into smartphones is beginning to accelerate.
14.) Intel is becoming the leading tablet processor provider.
15.) The elimination of contra-revenue will provide a major bump in the bottom line.
A semiconductor analyst is making a bold and detailed prediction about the process technology Intel Corp. will use for its next two generations. If he is right, the world’s largest chip maker is set to leapfrog the industry once again.
Intel will use quantum well FETs starting with its 10nm process, said David Kanter in an analysis posted on his Real World Technologies Web site. The new transistor structures will use two new materials – indium gallium arsenide (InGaAs) for n-type transistors and strained germanium for p-type devices, he said.
If correct, Intel could gain a capability as early as 2016 to produce 10nm transistors as much as 200 millivolts lower in power consumption than the rest of the industry. Kanter expects other chip makers will not be able to catch up with the techniques until their 7nm node, at least two years later.
It could take more than a year before Intel discloses its 10nm plans, Kanter said, giving his own predictions an 80-90 percent confidence level.
Kanter’s analysis is based on a study of about two dozen Intel research papers mainly presented at the annual International Electron Devices Meeting (IEDM), a leading gathering of chip makers. He also analyzed as many Intel patents related to chip making.
“Everything I saw pointed in this direction,” Kanter told EE Times.
[We've already seen a lot of intimations that Intel is about to bust a major move. This looks like it could be it. ]
Generally financial editors have only a superficial knowledge of the industry in general.
The Deep Chip contributor took the Wall Street explanation for the acquisition as a real reason for such move. Wrong, really wrong.
Contrary to the Wall Street editor, Intel has people that do not just rely on a Google search to find out the potential of the acquisition, both from a technological and a financial point of view.
[In other words, Wall Street editors are pinheads. And some pinheads on this board gave their opinions without even doing a Google search to find out the potential of the acquistion.]
"I am quite happy to be wrong, but Microsoft was very explicit at the time - no legacy UI for ANY device with a screen size below X."
[Please post support so we can review your source. You have a copy of the internal memo and press release, right?
Microsoft also guaranteed this policy would never change, right?
Now was Microsoft "explicit" or explicit in your mind after filtering it through your happy, happy ARM marketing department interpreter?]
Things are looking very promising. We'll kick things off with the Windows 10 release. Now is the time time to be planning some incremental buys leading into the second half of the year.
ARM has a significant headwind as mobility matures and fabrication continues in crisis.
Intel has many tailwinds now.
"Nope, not I. Microsoft."
[Well, that's amazing - you know what is going on inside the inner sanctum not only at Apple but at Microsoft as well. Um, where did you read the part about a policy once established never being changed. You do remember that Microsoft said that RT isn't dead and now they say it is. You are going to be as right about the Intel Windows phone as you were about RT. I remember when you used to be technical. Now you just parrot everything we hear from the various ARM marketing departments.
Not you? Yes, you.
The WinTel alliance is alive again. Read it and weep.]
"And if that phone could run full Windows 10 (not just the mobile version) with support for all x86 Windows apps when docked it would be a revolutionary change in the mobile industry. Nobody's smartphones today can deliver both a mobile and desktop experience in one device. We would see lines of buyers in front of Microsoft stores that would make even Apple envious."
[Yep, you called it. And Monk said it could never happen.]
AMD’s roadmap for its Cortex-A57 based “Seattle” SoC has slipped a full year, with volume ramping in 2015.
Why the delays? There are several possibilities. While the IP blocks and data from ARM for the basic design should be straightforward, this is still AMD’s first non-x86 CPU in a very, very long time. It’s also a product aimed at the server market, which means the amount of validation that has to occur is going to be higher than it would be for a consumer product. 28nm, however, is a proven node and the Cortex-A57 is a proven CPU design — which means AMD really ought to have had a product out by now.
It’s possible that AMD’s foot-dragging is being driven by market considerations as much as anything. Several years ago, analysts were confidently predicting that ARM would ascend into both the notebook and server spaces, challenging x86 for dominance at every stage. Intel responded to this rhetoric by aggressively positioning Xeon, Atom and Core M products in an attempt to cut ARM off at the pass. With the exception of Intel’s contra-revenue mobile shipments (which could be seen as a defensive move to shore up its market share while it worked on developing cheaper SoC manufacturing techniques), the ARM and x86 ecosystems have not come to blows. This is doubly true in servers, where ARM occupies essentially no space at all. Several companies, including AMD and Qualcomm, have talked about changing that — but there are few products.
Microsoft has already promised new flagship phones, which will debut around the time Windows 10 is launched. Since Windows 10 aims to tie phones, tablets and PCs, the launch of a Surface phone running Windows 10 would complete the list of devices running on Microsoft's new operating system.
Designer Nadir Aslam has now come up with a brilliant new Surface Phone concept with an exquisite design and build quality. The images of the concept design show the Microsoft Surface Phone to be made of a strong and light magnesium alloy (VaporMg) with the premium material making the device appear very attractive, strong and durable. The Microsoft Surface Phone has been shown to feature a built-in kickstand, similar to the Surface Pro tablets, so that users can place the phone on the desk or any flat surface with the stand to watch videos or enjoy video calls with friends and family.
The Microsoft Surface Phone is speculated to feature a 5.7-inch Full HD display along with a Surface Pen and a Touch cover accessory. The device is expected to be powered by an Intel chipset, which will provide sufficient power to multitask easily. The Microsoft Surface Phone's connectivity features include LTE, Bluetooth, NFC, and a micro HDMI connector, which can be used to hook up the phone to a bigger display and enjoy a full PC experience.
From ECUMENICAL NEWS