Microsemi Announces DSCC Qualification On New Surface Mount Power Schottky Diodes Family

Provides Low Power Losses in High Speed Switching Circuit Applications

• Press Release
• Source: Microsemi Corporation
• On 2:11 pm EDT, Tuesday October 6, 2009

IRVINE, Calif., Oct. 6, 2009 (GLOBE NEWSWIRE) -- Microsemi Corporation (Nasdaq:MSCC - News), a leading manufacturer of high performance analog/mixed signal integrated circuits and high reliability semiconductors, announced today that DSCC qualification has been granted on a family of five new surface mount power Schottky diode devices.

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These center tap and single diode constructions are designed to meet the rugged demands of high reliability applications. The U3 (SMD-0.5) ceramic package has an ultra efficient thermal path to keep the chip cool. This enables the Schottky diodes, which unlike conventional rectifiers have little-to-no stored charge, to perform with low power losses in high speed switching circuits.

Features include:

 * Schottky barrier construction for instantaneous switching speed
 * New lightweight surface mount hermetic package
 * Military temperature ratings: -65*C to +150*C
 * Low reverse leakage current & forward voltage drop ratings
 * Low thermal resistance

New Product Qualifications include:

 Microsemi Part Number  Vr    IO   Ifsm   Package        Pinout
 MIL-PRF-19500

 JAN/TX/V 1N6840U3     35V   10A   200A  U3 (SMD-0.5)  Dual-
 /678                                                  Common Cathode
 JAN/TX/V 1N6841U3     45V   10A   200A  U3 (SMD-0.5)  Dual-
 /678                                                  Common Cathode
 JAN/TX/V 1N6842U3     60V   10A   200A  U3 (SMD-0.5)  Dual-
 /680                                                  Common Cathode
 JAN/TX/V 1N6843CCU3  100V   15A   100A  U3 (SMD-0.5)  Dual-
 /681                                                  Common Cathode
 JAN/TX/V 1N6845U3     45V   30A   400A  U3 (SMD-0.5)  Single
 /682

A full description of these devices and technical data sheets are available on the Microsemi website: www.microsemi.com.

About Microsemi

Microsemi Corporation, with corporate headquarters in Irvine, California, is a leading designer, manufacturer and marketer of high performance analog and mixed-signal integrated circuits and high reliability semiconductors. The company's semiconductors manage and control or regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.

Microsemi's products include individual components as well as integrated circuit solutions that enhance customer designs by improving performance and reliability, battery optimization, reducing size or protecting circuits. The principal markets the company serves include implanted medical, defense/aerospace and satellite, notebook computers, monitors and LCD TVs, automotive and mobile connectivity applications. More information may be obtained by contacting the company directly or by visiting its website at http://www.microsemi.com.

The Microsemi Corporation logo is available at http://www.globenewswire.com/newsroom/prs/?pkgid=1233

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements concerning the DSCC qualification that has been granted on a family of five new surface mount power Schottky diode devices, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.

Microsemi Corporation
Financial Contact:
John Hohener, Vice President and CFO
  (949) 221-7100
Editorial Contact:
Cliff Silver, Corporate Communications Manager
  (949) 221-7100