Microsemi Expands New Line of Dual Boost Chopper Modules for Interleaved PFC Applications

Improves Power Supply Efficiency, Reliability and Cuts System Costs

• Press Release
• Source: Microsemi Corporation
• On 8:30 am EDT, Thursday October 1, 2009

IRVINE, Calif., Oct. 1, 2009 (GLOBE NEWSWIRE) -- Microsemi Corporation (Nasdaq:MSCC - News), a leading manufacturer of high performance analog mixed signal integrated circuits and high reliability semiconductors, has expanded its new line of dual boost chopper modules for interleaved power factor correction (PFC) applications in high performance power supplies found in telecommunications and industrial equipment, digital TVs, lighting, air conditioning and home appliances.

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A PFC circuit is mandatory to reach low distortion levels of the input current in DC to DC converters and get full utilization of the voltage mains. An improvement of this topology consists of using two boost converters in parallel operating 180 degrees out of phase, called interleaved PFC. Such topology requires an open connection between the transistor collector and the diode anode to insert a transformer that feeds information to a dedicated control circuit.

"The introduction of these new dual boost chopper power modules will allow our customers to improve their PFC designs beyond the efficiency, performance, reliability and size of conventional power systems," said Philippe Dupin, Director, Power Module Products, Power Products Group located in Bordeaux, France. "SiC diodes are also available for Microsemi's dual boost chopper modules to further increase the operating frequency and achieve even lower profile systems," he added.

The input current is the sum of two inductor currents with ripple currents that tend to cancel each other due to opposite phase operation. Interleaving the two boost converters leads to an equivalent frequency on the input that is twice the operating frequency of each single converter. The significant reduction of the input ripple current as well as the doubling of the input switching frequency significantly facilitates EMI filtering and reduces magnetic components volume and system cost. Interleaved PFCs reduce also the output capacitor ripple current and the electrical stress on this component to further contribute to higher system reliability.

The new dual boost chopper modules are offered in Microsemi's low profile SP1 and SP3 packages with fast NPT IGBTs, COOLMOS(TM) and MOSFET devices with voltage from a 500V to 1200V and currents from 13A to 90A.

 VCES
 (V)  IGBT type   IC (A)  Vce(on)(V)
                  Tc=80 C at rated Ic Package   NTC    Part Number

 600              90      2.1          SP3      YES  APTGF90VDA60T3G
                  50      2.1          SP3      YES  APTGF50VDA60T3G
      NPT Fast
 1200             50      3.2          SP3      YES  APTGF50VDA120T3G

 VDSS MOSFET type RDS(on) ID (A)      Package   NTC    Part Number
 (V)              (mR)    Tc=80 C
 600   COOLMOS        45       38      SP1      YES  APTC60VDAM45T1G
                      24       70      SP3      YES  APTC60VDAM24T3G
 900   COOLMOS        120      23      SP1      YES  APTC90VDA12T1G
 1000  MOSFET         350      17      SP3      YES  APTM100VDA35T3G
 1200                 570      13      SP3      YES  APTM120VDA57T3G

Technical data sheets are available on the Microsemi website: www.microsemi.com. Samples are available immediately. Pricing varies by part number and ranges from $20 to $50 for 1000 piece quantities.

"COOLMOS " is a trademark of Infineon Technologies AG

About Microsemi

Microsemi Corporation, with corporate headquarters in Irvine, California, is a leading designer, manufacturer and marketer of high performance analog and mixed-signal integrated circuits and high reliability semiconductors. The company's semiconductors manage and control or regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.

Microsemi's products include individual components as well as integrated circuit solutions that enhance customer designs by improving performance and reliability, battery optimization, reducing size or protecting circuits. The principal markets the company serves include implanted medical, defense/aerospace and satellite, notebook computers, monitors and LCD TVs, automotive and mobile connectivity applications. More information may be obtained by contacting the company directly or by visiting its website at http://www.microsemi.com.

The Microsemi Corporation logo is available at http://www.globenewswire.com/newsroom/prs/?pkgid=1233

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements concerning the expansion of its new line of dual boost chopper modules for interleaved power factor correction (PFC) applications in high performance power supplies, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.

Microsemi Corporation
Financial Contact:
John Hohener, Vice President and CFO
  (949) 221-7100
Editorial Contact:
Cliff Silver, Corporate Communications Manager
  (949) 221-7100