Reportlinker Adds IC Advanced Packaging Industry Report, 2009

• Press Release
• Source: Reportlinker
• On 11:08 am EST, Tuesday November 10, 2009

NEW YORK, Nov. 10 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue.

IC Advanced Packaging Industry Report, 2009

http://www.reportlinker.com/p0158884/IC-Advanced-Packaging-Industry-Report-2009.html#utm_source=prnewswire&utm_medium=pr&utm_campaign=prnewswire

The semiconductor industry is in the era of 32nm process, and it is expected that it will meet 16nm around 2019. Designing a 45nm SoC costs USD20-50 million except labor cost, and the design of a 32nm SoC costs USD75-120 million, while it is less than USD5 million for 130nm. Therefore, even if the IC design companies with annual revenue of over USD2 billion probably can not afford such high cost, and there are no more than ten such companies all over the world, which means that the majority of IC design companies are disqualified to enter 45nm or 32nm era. Perhaps the semiconductor industry will develop at the pace of Moore's Law. Having made up for the bottleneck of process shrinkage, the packaging industry will yield unusually brilliant results in post-Moore's Law era.

In practice, the packaging industry has become increasingly important since 2000, and the debut of BGA, FC and CSP has sped up the progression of semiconductor industry. However, the front-end of semiconductor manufacturing has been in stagnancy, still in the era of 12-inch wafer, and it is likely that 15-inch wafer era will not come. Currently, a revolutionary packaging, TSV packaging presents itself, which is so called 3D IC. The technology will dramatically improve chip transistor density, cubic density rather than plane density, and make semiconductor industry surpass the development pace of Moore's Law. Not only packaging companies and wafer OEMs, but also nearly all global prominent semiconductor companies such as IBM, Samsung, Intel and Qualcomm are all actively developing TSV technology. TSV has been in large shipment in image sensor and MEMS field, and it will rapidly expand to memory field in the future, and to DSP, RF IC, cell phone baseband, processor, CPU and GPU in 2013. Furthermore, TSV market size will rise to over US$2 billion from less than US$ 300 million currently, which will be the rapidest growing field in semiconductor industry.

In the meantime, the advanced packaging has an increasingly powerful driving force. IC advanced packaging mainly refers to IC substrate packaging, including BGA, CSP, FC and LGA, and it mainly applies for cell phone, memory, PC (CPU, GPU and Chipset), network communications, and consumer electronics. In addition, the network communications include high-speed switch, router and base station. Consumer electronics are as the followings such as game console, IPOD, ITOUCH, and high-end PMP. The cell phone has more and more powerful functions, thinner and thinner in size; and the smart phones have covered a rising ratio. In the field of memory, DDR3 has become the mainstream, with the rate increased to over 1GHz; CPU has multi-cores, and the number of pins has exceeded 1,200. China's 3G and the world's 4G network distribution has boosted up the sales of base stations. The stay-at-home economy has made game machine shipment increase sharply as well.

Japan and Taiwan have almost dominated IC packaging industry. Among the global top 12 companies, seven of which are from Taiwan, two from Japan, two from the United States, and one from South Korea.

Table of Contents

1 Status Quo and Future of IC Advanced Packaging

1.1 IC Packaging Overview

1.2 IC Packaging Types

1.2.1 SOP

1.2.2 QFP and LQFP

1.2.3 FBGA

1.2.4 TEBGA

1.2.5 FC-BGA

1.2.6 WLCSP

1.3 Future Star - TSV Packaging

1.3.1 TSV Intro

1.3.2 Why is TSV rather than SoC

1.3.3 TSV Development

1.3.4 TSV Industry and Market

2 IC Advanced Packaging Market

2.1 Cell Phone IC Advanced Packaging Market

2.2 Cell Phone Baseband Packaging

2.2.1 Cell Phone Baseband Industry

2.2.2 Cell Phone Baseband Packaging

2.3 Cell Phone (Mobile) Application Processor

2.3.1 Definition

2.3.2 Market and Industry

2.4 Smart Phone Processor Industry and Packaging

2.5 Cell Phone Embedded Memory

2.5.1 Overview

2.5.2 Cell Phone Memory Development

2.5.3 Cell Phone Memory Industry and Packaging

2.6 Cell Phone RF IC

2.6.1 Market

2.6.2 Industry

2.6.3 3G/4G-era Cell Phone RF IC Packaging

2.7 Other Cell Phone IC

2.8 Cell Phone Market and Industry

2.8.1 Market

2.8.2 Industry

2.8.3 China's Smart Phone Market

2.9 Advanced Packaging in PC Field

2.9.1 DRAM Industry

2.9.2 DRAM Packaging

2.9.3 NAND Flash Industry

2.9.4 NAND Flash Packaging Development

2.9.5 CPU, GPU & North and South Bridge Chipset

2.10 Image Sensor

3 Advanced Packaging Industry

3.1 Industry Scale

3.2 Industry Patterns

3.3 Comparison of Manufacturers

4 Advanced Packaging Manufacturers

4.1 TESSERA

4.2 Greatek

4.3 Formosa

4.4 ASE

4.5 AMKOR

4.6 SPIL

4.7 STATS ChipPAC

4.8 PHOENIX

4.9 Nanya

4.10 Kinsus

4.11 PowerTech

4.12 ChipMOS

4.13 King Yuan Electronics

4.14 IBIDEN

4.15 SHINKO

4.16 CARSEM

4.17 UNISEM

4.18 NEPES

4.19 STS

4.20 SEMCO

4.21 Unimicron

4.22 Chipbond

4.23 Changjiang Electronics Technology Selected Charts

IC Packaging Development Course, 1980-2010

SOP and TSSO Outline and Cross-sectional Diagram

QFP, LQFP, HQFP Packaging Outline and Cross-sectional Diagram

FBGA Outline and Cross-sectional Diagram

FBGA Development Roadmap, 2006-2012

TEBGA Outline and Cross-sectional Diagram

FC-BGA Outline and Cross-sectional Diagram

FC-BGA Development Roadmap, 2006-2012

WL-CSP Outline, Manufacturing Flow and Cross-sectional Diagram

Via First TSV Sketch-map

Via Last TSV Sketch-map

TSV Roadmap, 2005-2015

TSV Application Roadmap

TSV Via Size Roadmap

TSV Industry Layout

TSV Wafer Shipment by Application, 2006-2014

Typical Cell Phone Block Diagram

Market Shares of Global Cell Phone Baseband Manufacturers' Shipment, 2007-2009

Market Shares of China's Cell Phone Baseband Manufacturers, 2009

Processor Marker Scale Forecast by Type, 2008-2012

Market Shares of Main Non-Smart Phone Processor Manufacturers by Sum, 2008

Market Shares of Main Smart Phone Processor Manufacturers, 2009

Cell Phone Embedded Memory Development Roadmap

Cell Phone NOR Memory Demand (Mb), 2004-2012

Cell Phone RAM Memory Demand (Mb), 2004-2012

Cell Phone NAND Memory Demand (Mb), 2004-2012

Market Shares of Main Cell Phone Memory Manufacturers, 2009

Cell Phone Single-chip Memory Packaging Trend, 2007-2010

SIP Cell Phone Memory Packaging Development Trend, 2007-2011

PoP Cell Phone Memory Development Trend, 2007-2011

Global Cell Phone RF Market Scale, 2003-2010E

Global 3G Cell Phone Distribution by Band Number, 2009-2013

Market Shares of Global Main Cell Phone RF Transceiver Manufacturers by Shipment, 2008

Market Shares of Global Main Cell Phone PA Manufacturers by Sum, 2008

Comparison of Main PA Manufacturers' Technology Capabilities

Intel CPU Development Trend, 2009-2011

PC Shipment, 2006-2013E

Early Cell Phone Camera Module Sketch-map

Cell Phone Camera Module with TSV Packaging

Cell Phone Camera Module Industry Chain

CMOS Image Sensor Shipment, 2008-2013

Market Shares of Main CMOS Image Sensor Manufacturers, 2009

Market Shares of Cell Phone Camera Module Assembly Manufacturers

Market Shares of Main Cell Phone Camera Optics Lens Manufacturers

TSV Roadmap of CMOS Image Sensor

Global IC Packaging Shipment by Type, 2007

Global IC Packaging Shipment by Type, 2012

Global IC Packaging Sum by Type, 2007

Global IC Packaging Sum by Type, 2012

Downstream Distribution of Global Advanced Packaging Industry , 2009

Regional Distribution of Global Advanced Packaging Industry, 2009

Market Shares of Main Global Advanced Packaging Manufacturers in Cell Phone Field, 2009

Market Shares of Main Global Advanced Packaging Manufacturers in Laptop Field, 2009

Market Shares of Main Global Advanced Packaging Manufacturers in Memory Field, 2009

Market Shares of Main Global Advanced Packaging Manufacturers in Network Communication, 2009

Market Shares of Main Global Advanced Packaging Manufacturers in Consumer Electronics, 2009

TESSERA Business Distribution

TESSERA's Patent Number, 2000-2009Q2

TESSERA's Revenue, 2004-2008

TESSERA's Main Clients

TESSERA's Presence Worldwide

Revenue and Gross Profit Margin of Greatek Electronics, 2002-2012

Organization Structure of Greatek Electronics

Revenue of Greatek Electronics by Packaging Technology, 2007-2008

Formosa's Revenue and Gross Profit Margin, 2002-2012

Formosa's Organization Structure

Formosa's Revenue by Product, 2009

ASE's Revenue and Gross Profit Margin, 2001-2010

ASE 's Organization Structure

ASE's Revenue and Gross Profit Margin, 2007Q1-2009Q2

ASE's EBITDA and Investment Amount, 2007Q1-2009Q2

ASE's Packaging Revenue and Gross Profit Margin, 2007Q1-2009Q2

ASE's Packaging Revenue by Product, 2007Q1-2009Q2

ASE Test Department's Revenue and Gross Profit Margin, 2007Q1-2009Q2

ASE Test Department's Revenue by Technology, 2007Q1-2009Q2

ASE Product Downstream Application, 2005Q4, 2007Q2, 2008Q1 and 2009Q2

ASE's Core Test Technologies

Amkor's Revenue and Gross Profit Margin, 2007Q1-2009Q2

Amkor's Expenditure Ratio by Item, 2007Q1-2009Q2

Amkor's Revenue by Division, 2008Q1-2009Q2

Amkor's Product Downstream Application, 2008Q1-2009Q2

Amkor's IC Shipment by Packaging Type, 2008Q1-2009Q2

Amkor's Output Utilization Rate and Customer Concentration, 2008Q1-2009Q2

SPIL's Organization Structure

SPIL's Revenue and Gross Profit Margin, 2003-2010

SPIL's Revenue by Region, 2005Q4, 2007Q2, 2009Q1 & 2009Q2

SPIL's Product Downstream Application Structure, 2005Q4, 2007Q2, 2009Q1 & 2009Q2

SPIL's Product Structure by Technology Type, 2005Q4, 2007Q2, 2009Q1 & 2009Q2

StatsChipPAC's Revenue and Gross Profit Margin, 2004-2009

StatsChipPAC's Revenue by Division, 2006-2009Q2

StatsChipPAC's Product Downstream Application Ratio, 2006-2009Q2

StatsChipPAC's Revenue by Region, 2006-2009Q2

PHOENIX's Organization Structure

PHOENIX's Revenue and Gross Profit Margin, 2003-2010

PHOENIX's Product Structure, 2008Q1-2009Q2

PHOENIX's Product by Layer, 2008Q1-2009Q2

PHOENIX's Product Downstream Application Ratio, 2008Q1-2009Q2

PHOENIX's Revenue by Region, 2007Q1-2009Q2

PHOENIX's Staff Structure

Nanya's Revenue and Gross Profit Margin, 2003-2010

Nanya's Circuit Board Revenue Structure, 2007, 2008 & 2009Q2

Nanya's Circuit Board Product Downstream Application Ratio, 2009Q2

Kinsus' Revenue and Gross Profit Margin, 2001-2010

Kinsus' Revenue, Jul, 2008-Jul, 2009

Kinsus' Product Downstream Application Ratio, Jan-Jul, 2009

Ratios of Main Clients' Contribution to Kinsus Revenue, 2007H1

Kinsus' Products by Technology, 2007-2009

PowerTech's Revenue and Gross Profit Margin, 2005-2010

ChipMOS Organization Structure

ChipMOS Revenue and Gross Profit Margin, 2001-2009

ChipMOS Revenue by Region, 2006-2008

ChipMOS Revenue by Division, 2006-2008

ChipMOS Memory Revenue, 2001-2007Q3

ChipMOS Flash Memory Revenue, 2006Q1-2007Q3

ChipMOS LCD Driver IC Revenue, 2001-2007Q3

Revenue and Gross Profit Margin of King Yuan Electronics, 2003-2010

Organization Structure of King Yuan Electronics

Revenue of King Yuan Electronics by Process, 2007Q3

Revenue of King Yuan Electronics by Product, 2007Q3

Product Downstream Applications of King Yuan Electronics, 2007Q3

IBIDEN's Revenue and Operation Profit Margin, 2004-2008FY

IBIDEN's Revenue by Division, 2004-2008FY

IBIDEN's Revenue by Region, 2004-2008FY

IBIDEN's FC Substrate Output Capability Expansion Plan

IBIDEN's FC Packaging Product Shipment, 2006-2012

Shinko's Revenue and Operating Profit Margin, 2005-2010

Shinko's Total Liabilities and Shareholder's Equities, 2005-2009FY

Shinko's Net Profit, 2005-2009FY

Shinko's Capital Expenditure, 2005-2009FY

Shinko's Revenue by Division, 2005-2009FY

Shinko's Product Tree

Unisem's Revenue and Gross Profit Margin, 2004-2009

Nepes' Revenue and EBITDA, 2007-2011E

Nepes' Revenue by Division, 2008Q1-2009Q4

STS Revenue and EBITDA, 2004-2008

STS Revenue by Product, 2009Q1-2010Q4

Unimicron's Organization Structure

Unimicron's Revenue and Gross Profit Margin, 2000-2010

Unimicron's Plants

Unimicron's Output Capability by Product, 2007-2009

Unimicron's Revenue by Product, 2009Q1 vs. 2009Q2

Unimicron's Revenue by Downstream Application, 2009Q1 vs. 2009Q2

Unimicron's Revenue by Product, 2008 vs. 2009H1

Unimicron's Revenue by Downstream Application, 2008 vs. 2009H1

Chipbond's Revenue and Gross Profit Margin, 2003-2010

Chipbond's Revenue by Technology, 2006-2010

Chipbond's Clients, 2005-2009

Revenue and Operating Profit Margin of Changjiang Electronics Technology, 2006-2009

Staff Structure of Changjiang Electronics Technology by the end of 2008

Revenue of Global Main Cell Phone Baseband Manufacturers, 2008

Packaging Technology Development Forecast of Global Main Cell Phone Baseband Manufacturers, 2008-2013

Comparison of 12 Typical Baseband Packaging Types

Packaging Comparison of Typical Cell Phone Processors

Packaging Technologies of Global Typical Cell Phone Processors, 2009

Comparison of 12 Typical PA Packaging

Comparison of 13 Typical RF Transceivers' Packaging

Other Typical Cell Phone IC Packaging Technologies

Shipment of Global Top 13 Brand Manufacturers, 2008

Top 25 Cell Phone Manufacturers in China by Output, 2008

ASE's Top Ten Clients, 2006Q1, 2008Q1 & 2009Q2

SPIL's Output Capacity, 2006Q1, 2007Q2&Q3 and 2009Q1&Q2

Nanya's Circuit Board Output Capacity, 2007-2009

M&A Events of ChipMOS

Output Capacity of ChipMOS Shanghai Base

FC Packaging Revenue, 2006-2009FY

Chipbond's Output Capacity, 2009-2010

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IC Advanced Packaging Industry Report, 2009

http://www.reportlinker.com/p0158884/IC-Advanced-Packaging-Industry-Report-2009.html#utm_source=prnewswire&utm_medium=pr&utm_campaign=prnewswire

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    Nicolas Bombourg
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