Rudolph Technologies Receives Multiple System Order from ASE for its Complete Portfolio of Back-End Inspection Solutions

Rudolph sees significant market potential as leading manufacturers implement data analysis capability in their 2D and 3D in-line inspection for advanced packaging processes.

• Press Release
• Source: Rudolph Technologies
• On 7:00 am EDT, Thursday October 8, 2009

FLANDERS, N.J.--(BUSINESS WIRE)--Rudolph Technologies, Inc. (NASDAQ: RTEC - News), a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, announced today that it has received an order for multiple back-end inspection tools from Advanced Semiconductor Engineering, Inc. (ASE, TAIEX: 2311) (NYSE: ASX - News), the world's largest semiconductor packaging and test company. This purchase for automated NSX^® Inspection Systems with Discover^® yield management software reflects a trend to incorporate real-time process control into advanced back-end fabrication processes.

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“Rudolph’s hardware and process control software solutions have consistently demonstrated industry-leading productivity and performance in outgoing quality assurance (OQA) operations,” said Ardy Johnson, Rudolph’s vice president of marketing. “More advanced capabilities are now required, such as the replacement of wire bonds with bump-based connections. Rudolph’s unique combination of 2D and 3D inspection hardware and analytical software is a compelling solution for ASE’s in-line process control requirements.”

Rudolph’s General Manager in Taiwan, Jimmy Lin, adds, “As back-end processes continue to grow more complex, manufacturers are increasingly replacing existing outgoing quality control procedures with advanced, in-line process control methodologies, which are already well established in front-end fabs. Rudolph is unique in offering a hardware and software ‘total solution’ for inspection and data analysis that provides the speed and accuracy required to control high-volume production processes. We see significant potential for growth in the back-end inspection market, a result of being inserted at multiple in-line applications, as advanced packaging technologies are more widely adopted.”

“The value of Rudolph’s tool set was enhanced by ASE’s decision earlier this year to install our Discover yield management software,” said Johnson “This defect analysis/data management system easily interfaces with existing fab databases, and delivers high uptime when linked to process tools.”

The order, referenced in Rudolph’s Sept. 16, 2009 release on back-end market recovery, began shipping in 3Q 2009.

Rudolph offers a complete line of inspection and metrology systems for semiconductor manufacturing applications. The NSX^® 115 automated inspection tool is optimized specifically for the back-end manufacturing environment, and offers the highest throughput and greatest flexibility in the detection and analysis of macro defects created during wafer manufacturing, probing, bumping, dicing, or by general handling. The WaferScanner™ 3840 uses proprietary laser triangulation technology to provide fast and accurate 3D measurements of bump height and coplanarity. The open architecture and scalable system provided in Discover software can encompass all inspection tools on the fab floor. It is designed to efficiently analyze the tremendous volume of data generated by high-speed inspection tools to identify significant events, such as process excursions, and provide process engineers with the information required to optimize the manufacturing processes.

The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. As a global leader geared towards meeting the industry's ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package and final test. ASE Group also provides electronic manufacturing services through its affiliate, Universal Scientific Industrial Co Ltd. The Group generated sales revenues of $3.1 billion in 2007 and employs over 28,000 people worldwide. For more information about the ASE Group, visit www.aseglobal.com.

Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology, defect inspection, data analysis systems and fabwide process control solutions used by semiconductor device manufacturers. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market. The company has enhanced the competitiveness of its products in the marketplace by anticipating and addressing many emerging trends driving the semiconductor industry's growth. Rudolph’s strategy for continued technological and market leadership includes aggressive research and development of complementary metrology and inspection solutions. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company’s web site at www.rudolphtech.com.

Safe Harbor Statement
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the “Act”) which include demand for Rudolph’s products, Rudolph’s existing market position and its ability to maintain and advance such position relative to its competitors and Rudolph’s expectations about our future bookings and backlog as well as other matters that are not purely historical data. Rudolph wishes to take advantage of the “safe harbor” provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Rudolph’s control. Such factors include, but are not limited to, delays in shipping products for technical performance, component supply or other reasons, the company’s ability to leverage its resources to improve its positions in its core markets and fluctuations in customer capital spending. Additional information and considerations regarding the risks faced by Rudolph are available in Rudolph’s Form 10-K report for the year ended December 31, 2008 and other filings with the Securities and Exchange Commission. As the forward-looking statements are based on Rudolph’s current expectations, the company cannot guarantee any related future results, levels of activity, performance or achievements. Rudolph does not assume any obligation to update the forward-looking information contained in this press release.

Rudolph Technologies
Investors:
Steven R. Roth, 973-448-4302
steven.roth@rudolphtech.com
or
Trade Press:
Virginia Becker, 952-259-1647
virginia.becker@rudolphtech.com