AUSTIN, TX--(Marketwired - Apr 2, 2013) - Applied Nanotech Holdings, Inc. (
Applied Nanotech will be located in booth G7 and will exhibit its copper, aluminum, nickel, and silver inks and pastes. Furthermore, at this trade show ANI will present its revolutionary new printed circuit board (PCB) concept that integrates printed electronics with its high thermal conductivity substrate, CarbAl™ (see for example "Power Electronics PCB Concept Supports Thermal Management" published in "Power Electronics Technology," page 23, October 2012).
At the show, Applied Nanotech will also have additional public information available about its significant new intellectual property that is scheduled to be issued in April 2013 related to its copper and silicon nanoink formulations and processing methods.
"Although the printed electronic industry is developing, and the number of applications is increasing, there is still a roadblock due to the high cost of copper materials suitable for the printed electronic efforts," said Dr. James Novak, Director of Nanoelectronics and Thermal Management Division. "The new copper material, Cu-iM530, presented by ANI at this trade show may provide a solution to the high cost barrier."
About Applied Nanotech Holdings, Inc.
Applied Nanotech Holdings, Inc. is a premier research and commercialization organization focused on solving problems at the molecular level. Its team of PhD level scientists and engineers work with companies and other organizations to solve technical impasses and create innovations that will create a competitive advantage. The business model is to license patents and technology to partners that will manufacture and distribute products using the technology. Applied Nanotech has over 300 patents or patents pending. Applied Nanotech's website is http://www.appliednanotech.net.
Safe Harbor Statement
This press release contains forward-looking statements that involve risks and uncertainties concerning our business, products, and financial results. Actual results may differ materially from the results predicted. More information about potential risk factors that could affect our business, products, and financial results are included in our annual report on Form 10-K for the fiscal year ended December 31, 2012, and in reports subsequently filed by us with the Securities and Exchange Commission ("SEC"). All documents are available through the SEC's Electronic Data Gathering Analysis and Retrieval System (EDGAR) at www.sec.gov or from our website listed above. We hereby disclaim any obligation to publicly update the information provided above, including forward-looking statements, to reflect subsequent events or circumstances.