Dialog Semiconductor Licenses Cadence's Industry-Leading Tensilica HiFi Audio/Voice DSP IP

Semiconductor Company to First Utilise the IP for Development of Next-Generation Connectivity Products

Marketwired

KIRCHHEIM UNTER TECK, GERMANY--(Marketwired - Sep 9, 2013) - Dialog Semiconductor plc (DLG.F), a provider of highly integrated power management, audio, AC/DC and short-range wireless technologies, announced today that it has licenced Tensilica® HiFi Audio/Voice DSP IP from Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation. Dialog will initially deploy the IP to develop next-generation audio solutions for its connectivity products.

Cadence® Tensilica HiFi Audio/Voice DSPs are the industry's most widely used licensable audio/voice DSP family, supporting over 100 proven audio/voice software packages optimised for enhancement of the user's audio experience.

"Sound quality, performance and low power architecture are critical contributors to our reputation and success with our leading customers," said Mark Tyndall, vice president of corporate development and strategy at Dialog. "The Cadence Tensilica HiFi Audio/Voice DSP delivers in all these areas and has a comprehensive software partner ecosystem, which is essential for the connectivity and portable device markets we serve."

"By selecting our HiFi audio/voice DSP IP core, Dialog will be able to continue its tradition of offering its customers top-quality ICs for their next generation wireless connectivity and other portable devices, including smartphone and tablet PCs," said Jack Guedj, corporate vice president of research and development at Cadence.

The HiFi Audio/Voice DSP is part of the broader Tensilica product offering that combines the best capabilities of DSPs and CPUs while delivering 10X to 100X the performance because they can be optimised using automated design tools to meet specific and demanding signal processing performance targets.

About Dialog Semiconductor
Dialog Semiconductor creates highly integrated, mixed-signal integrated circuits (ICs), optimised for personal portable, low energy short-range wireless, LED solid state lighting and automotive applications. With its focus and expertise in energy-efficient system power management and a technology portfolio that also includes audio, short-range wireless, AC/DC power conversion and multi-touch, Dialog brings decades of experience to the rapid development of ICs for personal portable and digital consumers applications, including smartphones, tablets, Ultrabooks™ and digital cordless phones. Dialog is headquartered near Stuttgart with a global sales, R&D and marketing organisation. More information about the company, its products, and services is available at http://www.dialog-semiconductor.com/

About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com 

Contact:
Company
Lauren Ofstedahl
Dialog Semiconductor
Phone: +1 408-374-4200
lauren.ofstedahl@diasemi.com
Web: www.dialog-semiconductor.com

Media
Lauren Ginsberg
Tel: +1 617 624-3254
Racepoint Group
lginsberg@racepointgroup.com
View Comments