LIVERMORE, CA--(Marketwired - Aug 29, 2013) - FormFactor Inc. (
At the 3D-TEST Workshop, FormFactor will feature its 40µm grid-array pitch contactor technology for direct testing of Through-Silicon-Vias (TSVs), as well as grid-array micro-bumps or copper pillars for 2.5D/3D IC integration. This proprietary contactor technology is being evaluated by leading memory semiconductor manufacturers in their TSV development programs. The company will discuss certain new developments achieved with the contactor technology in a formal presentation and table-top demonstration at the 3D-TEST Workshop. The company's contactor technology was honored earlier this year at the IEEE VLSI Test Symposium in Berkeley when a presentation titled "Direct Connection and Testing of TSV and Micro-bump Devices using NanoPierce™" captured the "Best Paper Award" for FormFactor authors Dr. Onnik Yaglioglu and Ben Eldridge, the company's CTO.
On Friday, September 13, FormFactor executives and technologists will participate in the following events at the 3D-TEST Workshop:
Session 7: 3D Wafer Probing
"Very Low Damage Direct Testing of Micro-bumps for 3D IC Integration".
Co-presentation by technologists from Elpida Memory, Inc. and FormFactor.
Session 10: Special Session on 2013 3DInCites Awards
A panel discussion featuring the nominees and the winner of the 2013 3DInCites Awards' Test and Reliability Tools and Equipment category.
FormFactor will be represented on the panel by Mike Slessor, SVP & General Manager, MicroProbe Product Group.
In addition to the presentations, FormFactor executives will be on hand throughout the week to meet with customers. To schedule a briefing, please contact Amy Leong at firstname.lastname@example.org.
Further information on the 2013 3D-TEST Workshop and ITC can be found at www.itctestweek.org.
FormFactor Inc. (
FormFactor, MicroProbe and the FormFactor and MicroProbe logos are registered or unregistered trademarks of FormFactor, Inc. All other product, trademark, company or service names mentioned herein are the property of their respective owners.
Statements in this press release that are not strictly historical in nature are forward-looking statements within the meaning of the federal securities laws, including statements regarding anticipated results, market conditions, expectations and operating plans. These forward-looking statements are based on current information and expectations that are inherently subject to change and involve a number of risks and uncertainties. Actual events or results might differ materially from those in any forward-looking statement due to various factors, including, but not limited to: risks that the company's 40µm grid-array pitch contactor technology for direct testing of Through-Silicon-Vias (TSVs), as well as grid-array micro-bumps or copper pillars for 2.5D/3D IC integration, does not meet customer requirements or demands; and risks that the company's contactor technology does not successfully complete qualification at leading memory semiconductor manufacturers. Additional information concerning factors that could cause actual events or results to differ materially from those in any forward-looking statement is contained in the company's Form 10-K for the fiscal year ended December 29, 2012, as filed with the SEC, and subsequent SEC filings, including the company's Quarterly Reports on Forms 10-Q. Copies of the company's SEC filings are available at http://investors.formfactor.com/edgar.cfm. The company assumes no obligation to update the information in this press release, to revise any forward-looking statements or to update the reasons actual results could differ materially from those anticipated in forward-looking statements.