LIVERMORE, CA--(Marketwire - Nov 2, 2012) - FormFactor, Inc. (
The combined company's portfolio contains a comprehensive range of products and technologies to enable and accelerate the roadmaps of System-On-Chip (SoC) and memory semiconductor device manufacturers.
At ITC, the premier discussion forum for advanced wafer test technologies, FormFactor will present case studies of the company's leading-edge wafer-test technologies in the following sessions:
Wednesday, Nov. 7th; 12:00 noon - 2 p.m. Poster Session
"Parallel Parametric Test in Semiconductor Production"
Co-presentation by technologists from Agilent and FormFactor
Friday, Nov. 9th; 8:25 a.m. - 8:50 a.m. 3D-Test Workshop
Session 4: 3D Wafer Probing
"40um Pitch Probe Card Evaluation"
Co-presentation by technologists from Altera Corp. and FormFactor
In addition to the presentations, FormFactor executives will be on hand to answer customers' questions. To schedule a briefing on Wed. 7th or Thurs. 8th, please contact Amy Leong at email@example.com.
Further information on the 2012 ITC, including the Third IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits, can be found at www.itctestweek.org.
FormFactor, Inc. (
FormFactor, MicroProbe and the FormFactor and MicroProbe logos are registered or unregistered trademarks of FormFactor, Inc. All other product, trademark, company or service names mentioned herein are the property of their respective owners.
Statements in this press release that are not strictly historical in nature are forward-looking statements within the meaning of the federal securities laws, including statements regarding anticipated results, market conditions, expectations and operating plans. These forward-looking statements are based on current information and expectations that are inherently subject to change and involve a number of risks and uncertainties. Actual events or results might differ materially from those in any forward-looking statement due to various factors, including, but not limited to: the company's ability to successfully integrate and realize the anticipated benefits of the Micro-Probe acquisition; risks around the company's ability to enable and accelerate the roadmaps of SoC and memory semiconductor device manufacturers; and risks of the company's ability to meet customers' test roadmaps. Additional information concerning factors that could cause actual events or results to differ materially from those in any forward-looking statement is contained in the company's Form 10-K for the fiscal year ended December 31, 2011, as filed with the SEC, and subsequent SEC filings, including the company's Quarterly Reports on Forms 10-Q. Copies of the company's SEC filings are available at http://investors.formfactor.com/edgar.cfm. The company assumes no obligation to update the information in this press release, to revise any forward-looking statements or to update the reasons actual results could differ materially from those anticipated in forward-looking statements.
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