Micron to release more DRAM packaging orders to Taiwan suppliers, DigiTimes says

theflyonthewall.com

Micron plans to release more backend packaging orders for its commodity DRAM chips to IC testing and packaging companies starting in Q2, reports DigiTimes. According to industry sources, Micron will need to outsource packaging capacity to Taiwan as it plans to switch its Malaysia plant production to NAND flash products.

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