Leading mobile chipset manufacturer, Qualcomm Inc. (QCOM) and U.S. telecom giant Sprint Corp. (S) recently completed the second phase of an over-the-air trial of LTE TDD hyper dense small cell network at the Phoenix International Raceway.
The first phase was conducted in Nov 2013, when Qualcomm installed 31 LTE base stations within a few meters of each other to test density limits, measure network performance capabilities and managed the signaling load to the core network.
This hyper-dense network trial used Airspan Networks developed AirSynergy 2000 LTE-Advanced Pico base stations and was supported by Qualcomm’s small cell chipsets and UltraSON (Self Organizing Network) technology. This was the first trial run of Qualcomm’s innovative UltraSON technology. Currently, both Qualcomm and Sprint carry a Zacks Rank #3 (Hold).
The acquisition of Atheros Communications has transformed Qualcomm into an integrated chipset developer for the mobile computing market.Qualcomm can play as a single window to any wireless gadget maker (mobile phone/tablets) for an integrated Snapdragon chipset platform supporting Wi-Fi.
Besides mobile computing, Qualcomm can now diversify in the consumer electronics segment, particularly in the home networking market. Atheros manufactures Wi-Fi chips for televisions, video games, printers, and other home devices. Qualcomm has already started working on the reference design for set-top boxes and other home connected devices.
Sprint has announced that it will deploy both indoor and outdoor base stations in 2014. For this purpose the company is negotiating with several vendors including Alcatel-Lucent S.A. (ALU), Samsung Corp. and Nokia Solutions and Networks (:NSN), a division of Nokia Corp. (NOK). NSN is using Liquid Applications tochange the competitive landscape of the telecom infrastructure gear market by revolutionizing base stations.Read the Full Research Report on S
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