DUBLIN--(BUSINESS WIRE)--
Research and Markets (http://www.researchandmarkets.com/research/stgvbd/flir_isc0601b) has announced the addition of the "Flir ISC0601B Micro-bolometer Teardown & Reverse Costing Analysis" report to their offering.
System Plus Consulting is proud to publish a reverse costing report on the micro-bolometer ISC0601B, 320x240 pixels supplied by FLIR.
Flir micro-bolometer technology is based on a vanadium oxide material, with micro-machined structures. Each pixel contains active membranes suspended at 2µm above the readout circuit.
This micro-bolometer is suitable for various applications including thermography, industrial inspection, Building & Renewable Energy, Border Security and coastal surveillance, automotive, etc.
This report provides complete teardown of the Flir ISC0601B sensor with:
- Detailed photos
- Material analysis
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
Selling price estimation The micro-bolometer is part of the FLIR i7 thermal imaging camera. A reverse costing report on the i7 camera is available separately.
Key Topics Covered:
Table of Contents
Glossary
1. Overview/ Introduction
- Glossary
- Executive Summary
- Reverse Costing Methodology
2. Company Profile
- ULIS Profile
- On Semiconductor
3. Physical Analysis
- Synthesis of the Physical Analysis
- IR CameraI7
- Package
- Package x-ray
- Package Front Side
- Package rear side
- Pread Out IC
- ROIC Functions
- ROIC Technology
- Micro Bolometer
- Reflector
- Structure of Pixel
- Micro bridge
- Contact Structure
- Compensation Pixels
- Principle Operation
- Physical Data Summary
4. Manufacturing Process Flow
- Global Overview
- ROIC Process Flow
- Description of the ROIC Water Fabrication Unit
- Description of the Micro-balomerter Process Flow
- Description of the Micro-balomerter Water fabrication Unit
- Packaging
5. Cost Analysis
- Main Steps of Economic Analysis
- Yields Explanation
- Die per wafer & probe test
- ROIC Wafer Front-End cost
6. 200mm Micro-Bolometer Cost Analysis
- Micro Bolometer Wafer Cost
- Micro Bolometer Step Cost
- Micro Bolometer Equipment Cost
- Micro Bolometer Consumable Cost
- Back-End 1: Packaging, Final test
- Component Cost ( FE+BE 0 + BE 1)
- Yields Synthesis
7. Micro Bolometer Price Estimation
- Manufacturer Financial Ratios
- Estimated manufacturer Price
- Synthesis of the cost Analysis
8. Conculsion
For more information visit http://www.researchandmarkets.com/research/stgvbd/flir_isc0601b
Laura Wood, Senior Manager.
press@researchandmarkets.com
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Semiconductor
